Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
06/2007
06/27/2007EP1801630A1 Projection optical system, production method for projection optical system, exposure system and exposure method
06/27/2007EP1801269A1 Process for producing a free-standing III-N layer, and free-standing III-N substrate
06/27/2007EP1801265A1 Cleaning system of sulfuric acid recycling type and persulfuric acid feeder of sulfuric acid recycling type
06/27/2007EP1801151A1 Methods of making a curable composition having low coefficient of thermal expansion and an integrated circuit and a curable composition and intergrated circuit made therefrom
06/27/2007EP1801046A1 Transfer apparatus
06/27/2007EP1800800A1 Abrasive pad
06/27/2007EP1800360A2 Electrical circuit with a nanostructure and method for contacting a nanostructure
06/27/2007EP1800350A2 Method for producing planar transporting resonance heterostructures
06/27/2007EP1800349A2 Semiconductor component
06/27/2007EP1800348A1 Wireless chip and manufacturing method thereof
06/27/2007EP1800347A2 Dmos-transistor and corresponding production method
06/27/2007EP1800345A2 Method of creating defect free high ge content (25%) sige-on-insulator (sgoi) substrates using wafer bonding techniques
06/27/2007EP1800340A1 Method of grinding multilayer body and method of manufacturing solid state image pickup device
06/27/2007EP1800339A1 Method for laser dicing of a substrate
06/27/2007EP1800338A1 Method for producing layers located on a hybrid circuit
06/27/2007EP1800337A2 Grooved substrates for uniform underfilling solder ball assembled electronic devices
06/27/2007EP1800336A1 Mgo-base coating for electrically insulating semi-conductor substrates and production method
06/27/2007EP1800335A1 Homogeneous copper interconnects for beol
06/27/2007EP1800334A2 Method of removing polymer coating from an etched trench
06/27/2007EP1800333A1 Adaptively plasma source and method of processing semiconductor wafer using the same
06/27/2007EP1800332A1 Uni-directional diffusion of metal silicide in semiconductor devices
06/27/2007EP1800331A2 Low temperature selective epitaxial growth of silicon germanium layers
06/27/2007EP1800330A1 System for processing semiconductor substrate by using laser and method of the same
06/27/2007EP1800329A2 Multi-single wafer processing apparatus
06/27/2007EP1800328A1 Vacuum holder for integrated circuit units
06/27/2007EP1799886A1 Indium nitride layer production
06/27/2007EP1799878A2 Atmospheric pressure chemical vapor deposition
06/27/2007EP1799877A2 Sioc:h coated substrates and methods for their preparation
06/27/2007EP1799785A2 Cmp composition with a polymer additive for polishing noble metals
06/27/2007EP1799446A2 System for thinning a semiconductor workpiece
06/27/2007EP1678495A4 Nanoscale transduction systems for detecting molecular interactions
06/27/2007EP1661159B1 Component mounting apparatus and component mounting method
06/27/2007EP1532292B1 Atomic deposition layer methods
06/27/2007EP1490915B1 Method of preparation of organic optoelectronic and electronic devices and devices thereby obtained
06/27/2007EP1470176B1 No flow underfill composition
06/27/2007EP1425433A4 Protective shield and system for gas distribution
06/27/2007EP1393432A4 Electron tunneling device
06/27/2007EP1305815A4 Film thickness measurement using electron-beam induced x-ray microanalysis
06/27/2007EP1245039A4 Three dimensional device integration method and integrated device
06/27/2007EP1244821A4 Articles coated with aluminum nitride by chemical vapor deposition
06/27/2007EP1176630B1 Polishing body, polisher, method for adjusting polisher, method for measuring thickness of polished film or end point of polishing, method for producing semiconductor device
06/27/2007EP1159214A4 In/out load port transfer mechanism
06/27/2007EP1085332B1 Semiconductor integrated circuit, liquid crystal apparatus, electronic apparatus and method for adjusting semiconductor integrated circuit
06/27/2007EP0943155B1 Method for anisotropic etching of silicon
06/27/2007CN2917150Y Keeping structure, insulation structure, and heating unit of heater
06/27/2007CN2916925Y Contact device for testing electronic component
06/27/2007CN2916645Y Support base for image sensor test
06/27/2007CN2915378Y 化学机械抛光垫及化学机械装置 Chemical mechanical polishing pad and chemical mechanical means
06/27/2007CN2915374Y Sand blasting apparatus for erasing waste silicon sheet impurity
06/27/2007CN1989793A Surface-treated copper foil and flexible copper-clad laminate plate and film carrier tape manufactured by use of the surface-treated copper foil
06/27/2007CN1989630A Semiconductor device, method for fabricating an electrode, and method for manufacturing a semiconductor device
06/27/2007CN1989626A Nitride system compound semiconductor and its manufacturing method
06/27/2007CN1989622A Silicon nitride film with stress control
06/27/2007CN1989620A Soi substrate and method for producing same
06/27/2007CN1989613A A method of manufacturing a plurality of electronic assemblies
06/27/2007CN1989610A 振荡器 Oscillator
06/27/2007CN1989609A 半导体装置 Semiconductor device
06/27/2007CN1989608A Semiconductor device and semiconductor device manufacturing method
06/27/2007CN1989607A Uv-ray irradiator
06/27/2007CN1989606A Anisotropic conductive connector for wafer inspection, production method and application therefor
06/27/2007CN1989605A Vibratable die attachment tool
06/27/2007CN1989604A Function element and manufacturing method thereof, and function element mounting structure
06/27/2007CN1989603A Method of forming a semiconductor device and structure thereof
06/27/2007CN1989602A Method and apparatus for mobility enhancement in a semiconductor device
06/27/2007CN1989601A Methods of fabricating nitride-based transistors with a cap layer and a recessed gate
06/27/2007CN1989600A Polishing slurry for cmp
06/27/2007CN1989599A Scribed interleaf separator wafer packaging
06/27/2007CN1989598A Uni-directional diffusion of metal silicide in semiconductor devices
06/27/2007CN1989597A Thin tungsten silicide layer deposition and gate metal integration
06/27/2007CN1989596A Silicon wafer substrate locking stage and silicon wafer substrate temperature measuring method
06/27/2007CN1989595A Gallium nitride-based semiconductor stacked structure, production method thereof, and compound semiconductor and light-emitting device each using the stacked structure
06/27/2007CN1989594A Method for transferring plates
06/27/2007CN1989593A Development apparatus and development method
06/27/2007CN1989592A Production method for simox substrate
06/27/2007CN1989452A Extreme ultraviolet reticle protection
06/27/2007CN1989271A Film forming equipment and film forming method
06/27/2007CN1988788A Heat equalizing sheet element and its producing method
06/27/2007CN1988767A Method for mounting chip component and circuit board
06/27/2007CN1988764A Method of making an electronic device cooling system
06/27/2007CN1988763A Method of making an electronic device cooling system
06/27/2007CN1988760A Base plate rear section treating method
06/27/2007CN1988200A Gas wall electrode side connection phase shift storage and its producing method
06/27/2007CN1988181A Capacitor in the semiconductor device and method of fabricating the same
06/27/2007CN1988179A Non-volatile floating gate memory cells with polysilicon storage unit and fabrication methods thereof
06/27/2007CN1988177A Fin-fet having gaa structure and methods of fabricating the same
06/27/2007CN1988176A High voltage N-shape metal oxide semiconductor tube and its preparing method
06/27/2007CN1988175A Super high voltage metal oxide semiconductor transistor tube element and its producing method
06/27/2007CN1988174A Thyristor and method of manufacture
06/27/2007CN1988173A Thyristor and method of manufacture
06/27/2007CN1988172A 异质结双极晶体管及其制造方法 Heterojunction bipolar transistor and its manufacturing method
06/27/2007CN1988171A 半导体结构及其形成方法 And a method for forming a semiconductor structure
06/27/2007CN1988164A Thin film transistor device, method for manufacturing the same and display apparatus having the same
06/27/2007CN1988163A Array substrate, method of manufacturing the same and display panel having the same
06/27/2007CN1988161A Non-volatile memory device and method of manufacturing the same
06/27/2007CN1988160A Multi-bit non-volatile memory devices and methods of fabricating the same
06/27/2007CN1988158A Flat plate capacitor and its realizing method
06/27/2007CN1988146A Method for producing dummy element pattern and mechanical reinforced low K dielectric material
06/27/2007CN1988145A Semiconductor package structure for vertical mount and method
06/27/2007CN1988143A Semiconductor device and manufacturing method of the same
06/27/2007CN1988142A Wafer structure and bumping manufacturing process
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