Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
07/2007
07/05/2007US20070152273 High performance circuit with metal and polygate electrodes
07/05/2007US20070152271 Gate electrode having a capping layer
07/05/2007US20070152270 Transistors and manufacturing methods thereof
07/05/2007US20070152268 Semiconductor component and method
07/05/2007US20070152267 Recess gate type transistor and method for fabricating the same
07/05/2007US20070152264 Nonvolatile memory device and method for fabricating the same
07/05/2007US20070152263 Dynamic random access memory cell layout and fabrication method thereof
07/05/2007US20070152261 Nonvolatile semiconductor memory device having element isolating region of trench type
07/05/2007US20070152259 Method of forming inside rough and outside smooth HSG electrodes and capacitor structure
07/05/2007US20070152258 Semiconductor device with a capacitor
07/05/2007US20070152257 Semiconductor device having recessed landing pad and its method of fabrication
07/05/2007US20070152256 Method for fabricating a metal insulator-metal (MIM) capacitor having capacitor dielectric layer formed by atomic layer deposition (ALD)
07/05/2007US20070152253 Ferroelectric Oxide Artificial Lattice, Method For Fabricating The Same And Ferroelectric Storage Medium For Ultrahigh Density Data Storage Device
07/05/2007US20070152252 Reducing aluminum dissolution in high pH solutions
07/05/2007US20070152249 Method for fabricating cmos image sensor
07/05/2007US20070152248 Complementary metal oxide semiconductor image sensor and method for fabricating the same
07/05/2007US20070152246 Complementary metal oxide silicon image sensor and method of fabricating the same
07/05/2007US20070152243 Standard cell, cell library using a standard cell and method for arranging via contact
07/05/2007US20070152242 Thin film transistor array substrate and method of manufacturing the same
07/05/2007US20070152233 Manufacture method for ZnO based compound semiconductor crystal and ZnO based compound semiconductor substrate
07/05/2007US20070152229 Light emitting apparatus method for producing it and assembly incorporating it
07/05/2007US20070152226 LED lamps
07/05/2007US20070152224 Method for manufacturing a thin film transistor array panel for a liquid crystal display and a photolithography method for fabricating thin films
07/05/2007US20070152223 Organic thin film transistor and organic light emitting display device including the same
07/05/2007US20070152216 Interconnection in an insulating layer on a wafer
07/05/2007US20070152215 Test pads on flash memory cards
07/05/2007US20070152214 Semiconductor device
07/05/2007US20070152173 Ion implantation apparatus and ion implanting method
07/05/2007US20070152150 Charged particle beam apparatus
07/05/2007US20070152025 Electronic part mounting method
07/05/2007US20070152024 System, apparatus, and method for advanced solder bumping
07/05/2007US20070151963 Laser irradiation apparatus, laser irradiation method, and method for manufacturing semiconductor device
07/05/2007US20070151956 Plasma processing device and ashing method
07/05/2007US20070151951 Stopper for chemical mechanical planarization, method for manufacturing same, and chemical mechanical planarization method
07/05/2007US20070151950 Etching apparatus for use in manufacture of flat panel display device and manufacturing method using the same
07/05/2007US20070151949 Semiconductor processes and apparatuses thereof
07/05/2007US20070151947 Method for setting plasma chamber having an adaptive plasma source, plasma etching method using the same and manufacturing method for adaptive plasma source
07/05/2007US20070151946 Method for monitoring edge bead removal process of copper metal interconnection
07/05/2007US20070151944 providing an acidic mixed solution includes nitric acid and ammonium fluoride, free of hydrofluoric acid; and a mixture of phosphoric acid, sulfuric acid and acetic acid; immersing the silicon wafer in the acidic mixed solution; and etching; stable, controllable and less hazardous for environment
07/05/2007US20070151861 Reliability barrier integration for cu application
07/05/2007US20070151756 Flexible substrate having interlaminar junctions, and process for producing the same
07/05/2007US20070151674 Substrate supporting plate
07/05/2007US20070151668 Gas supply system, substrate processing apparatus, and gas supply method
07/05/2007US20070151514 Apparatus and method for hybrid chemical processing
07/05/2007US20070151507 Crystallization apparatus, crystallization method, device and phase modulation element
07/05/2007US20070151090 Ceramic substrate
07/05/2007DE69836407T2 Anordnung zur Überprüfung der Signalspannungspegelgenauigkeit in einer digitalen Testeinrichtung Arrangement for checking the signal voltage level accuracy in a digital test equipment
07/05/2007DE19781667B4 Plasmaerzeugungsverfahren und -gerät mit einer induktiv gekoppelten Plasmaquelle Plasma generation method and apparatus using an inductively coupled plasma source
07/05/2007DE19652741B4 Vorrichtung und Verfahren zur Erzeugung eines Oxidfilms eines Halbleiterbauelementes Apparatus and method for producing an oxide film of a semiconductor device
07/05/2007DE112005002252T5 Blitzlampen-Aufwärmgerät zum Erzeugen elektromagnetischer Strahlung mit selektiven Wellenlängen Flash lamp warm-up device for generating electromagnetic radiation with selective wavelengths
07/05/2007DE112005002158T5 Verfahren zur Herstellung einer Halbleitervorrichtung, die eine dielektrische Gateschicht mit hohem K und eine Gateelektrode aus Metall aufweist A method of manufacturing a semiconductor device having a gate dielectric layer having a high K and a gate electrode made of metal
07/05/2007DE10207122B4 Ein Verfahren zur Herstellung von Schichten aus Oxid auf einer Oberfläche eines Substrats A process for the preparation of layers of oxide on a surface of a substrate
07/05/2007DE102006062403A1 Integriertes Schaltkreisbauelement sowie Herstellungs- und Betriebsverfahren Integrated circuit device and manufacturing and operating procedures
07/05/2007DE102006062397A1 Semiconductor device has high-voltage transistor well and low voltage transistor well which are formed on common substrate separated by isolation structure extending initial depth into substrate
07/05/2007DE102006060886A1 SOI-Baustein mit mehrfachen Kristallorientierungen SOI chip with multiple crystal orientations
07/05/2007DE102006058185A1 EEPROM und Herstellungsverfahren EEPROM and manufacturing processes
07/05/2007DE102006054969A1 Halbleiterbauelement und Verfahren zur Herstellung desselben A semiconductor device and method of manufacturing the same
07/05/2007DE102006035486A1 Verfahren zur Herstellung einer Halbleitervorrichtung aus einer Verbindung auf Basis eines Nitrids der Gruppe III A method of manufacturing a semiconductor device from a compound based on a Group III nitride
07/05/2007DE102006034772A1 Semiconductor device having a trench gate and method of fabricating the same Semiconductor device having a trench gate and method of fabricating the same
07/05/2007DE102006029961A1 Wicklungskörper mit einem Bearbeitungsband für einen Halbleiterwafer, Vorrichtung zum Ankleben eines Bearbeitungsbandes an einen Halbleiterwafer und Vorrichtung zum Bearbeiten eines Halbleiterwafers, welche den Wicklungskörper mit dem Bearbeitungsband für den Halbleiterwafer verwendet Winding body with a processing tape for a semiconductor wafer processing apparatus for adhering a tape to a semiconductor wafer and device for processing a semiconductor wafer that uses the coil body with the tape for processing the semiconductor wafer
07/05/2007DE102006027178A1 Multi-Fin-Bauelement-Anordnung und Verfahren zum Herstellen einer Multi-Fin-Bauelement-Anordnung Multi-fin component arrangement and method for manufacturing a multi-fin component arrangement
07/05/2007DE102006026954A1 Verfahren zur Herstellung eines Kondensators in einem Halbleiterbauelement A method for manufacturing a capacitor in a semiconductor device
07/05/2007DE102006024959A1 Polymer für eine Hartmaske einer Halbleitervorrichtung und Zusammensetzung enthaltend dieselbe Polymer for a hard mask of a semiconductor device and composition containing the same
07/05/2007DE102006024750A1 Druckvorrichtung und ein Druckverfahren unter Verwendung derselben A printing apparatus and a printing method using the same
07/05/2007DE102006024228A1 Flüssigkristalldisplay und Verfahren zu dessen Herstellung Liquid crystal display and method for its production
07/05/2007DE102006001253A1 Verfahren zur Herstellung einer Metallschicht über einem strukturierten Dielektrikum mittels einer nasschemischen Abscheidung mit einer stromlosen und einer leistungsgesteuerten Phase A process for producing a metal layer over a patterned dielectric by means of a wet chemical deposition with an electroless plating and a power-controlled phase
07/05/2007DE102005063272A1 Flexible Leiterplatte und Kontaktierverfahren Flexible printed circuit board and contacting methods
07/05/2007DE102005062936A1 Disk-shaped units e.g. wafer, position correcting device for use in semiconductor industry, has signal processing unit calculating position variation of units by evaluating detection time periods determined during transportation of units
07/05/2007DE102005062600A1 Method for positioning electronic power components on a circuit board used in chip manufacture comprises using a heat-conducting electrically insulating foil
07/05/2007DE102005062344A1 Halbleiterbauteil und Vorrichtung zur Herstellung eines Halbleiterbauteils Semiconductor device and apparatus for manufacturing a semiconductor device
07/05/2007DE102005061785A1 Verfahren und Vorrichtung zum Erkennen von Rissen in Silizium-Wafern Method and apparatus for detecting cracks in silicon wafers
07/05/2007DE102005061663A1 Ionenimplantationsvorrichtung, Verfahren zur Steuerung einer Ionenimplantationsvorrichtung sowie Abbremseinrichtung An ion implantation apparatus, method of controlling an ion implantation apparatus, as well as braking means
07/05/2007DE102005052000B3 Halbleiterbauelement mit einer Kontaktstruktur auf der Grundlage von Kupfer und Wolfram Semiconductor component having a contact structure on the basis of copper and tungsten
07/05/2007DE102005049793B3 Verfahren zur Herstellung einer Halbleiterschaltung, entsprechend hergestellte Halbleiterschaltung sowie zugehöriges Entwurfsverfahren A method for manufacturing a semiconductor circuit according manufactured semiconductor circuit design and associated method
07/05/2007DE102005045060B4 Integrierte Schaltungsanordnung mit mehreren Leitstrukturlagen und Verfahren zu ihrer Herstellung An integrated circuit device having a plurality of conductive structure and process for their preparation
07/05/2007DE102005015418B4 Phosphordotierungsverfahren zum Herstellen von Feldeffekttransistoren mit mehreren gestapelten Kanälen Phosphorus doping process of manufacturing field effect transistors having a plurality of stacked channels
07/05/2007CA2632897A1 Device and method for the surface treatment of substrates
07/04/2007EP1804305A1 A method of producing a gallium nitride-type light emitting semiconductor device
07/04/2007EP1804300A1 Function element, storage element, magnetic recording element, solar cell, photoelectric conversion element, light emitting element, catalyst reaction device, and clean unit
07/04/2007EP1804294A1 Method for manufacturing non volatile memory cells
07/04/2007EP1804293A1 Process for manufacturing a non volatile memory electronic device
07/04/2007EP1804290A1 Fabricating method for thin film transistor array substrate and thin film transistor array substrate using the same
07/04/2007EP1804289A2 Non volatile memory electronic device integrated on a semiconductor substrate
07/04/2007EP1804288A2 Semiconductor memory device with recessed gate and method for making the same
07/04/2007EP1804287A2 Method of manufacturing semiconductor device
07/04/2007EP1804286A1 Elongate nanostructure semiconductor device
07/04/2007EP1804285A1 Method for manufacturing a transistor with self-aligned channel
07/04/2007EP1804284A1 Substrate heat treatment apparatus and substrate transfer tray used in substrate heat treatment
07/04/2007EP1804283A1 Annealed wafer and manufacturing method of annealed wafer
07/04/2007EP1804282A1 Methods for manufacturing dense integrated circuits
07/04/2007EP1804281A1 Process for digging a deep trench in a semiconductor body and semiconductor body so obtained
07/04/2007EP1804280A1 Laser beam machining method
07/04/2007EP1804279A1 Substrate for exposure, exposure method and device manufacturing method
07/04/2007EP1804278A1 Correction method and exposure device
07/04/2007EP1804125A1 Method for fine pattern formation
07/04/2007EP1804124A1 Developing solution composition for lithography and method for resist pattern formation
07/04/2007EP1803804A2 Method and material for cleaning a substrate
07/04/2007EP1803803A2 Cleaning compounds and method and system for using the cleaning compound
07/04/2007EP1803708A1 Adamantane derivative, process for producing the same, and photosensitive material for photoresist
07/04/2007EP1803539A1 Resin encapsulation molding method of electronic part and resin encapsulation molding apparatus used therefor