Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
11/2007
11/29/2007US20070272928 Thin film transistor, array substrate having the thin film transistor and method of manufacturing the array substrate
11/29/2007US20070272927 Thin film transistor, method of manufacturing the thin film transistor, active matrix type display device, and method of manufacturing the active matrix type display device
11/29/2007US20070272926 Tft lcd array substrate and manufacturing method thereof
11/29/2007US20070272925 Semiconductor Device Having Multi-Gate Structure and Method of Manufacturing the Same
11/29/2007US20070272922 ZnO thin film transistor and method of forming the same
11/29/2007US20070272864 Uncooled Cantilever Microbolometer Focal Plane Array with Mk Temperature Resolutions and Method of Manufacturing Microcantilever
11/29/2007US20070272860 Electron beam inspection apparatus
11/29/2007US20070272759 Limiter and semiconductor device using the same
11/29/2007US20070272656 Method for forming contact hole on semiconductor device
11/29/2007US20070272655 Barrier metal film production method
11/29/2007US20070272589 Allowance Method for Point to Ground Resistance of Tray
11/29/2007US20070272562 Electrolytic Processing Apparatus and Electrolytic Processing Method
11/29/2007US20070272560 Method and compositions for direct copper plating and filing to form interconnects in the fabrication of semiconductor devices
11/29/2007US20070272545 Apparatus for processing substrate and method of processing substrate
11/29/2007US20070272359 Apparatus for removing a halogen-containing residue
11/29/2007US20070272357 Substrate Treatment Apparatus
11/29/2007US20070272356 Multipe zone carrier head with flexible membrane
11/29/2007US20070272355 Apparatus for processing substrate and method of doing the same
11/29/2007US20070272282 Composition for Removing Photoresist and Method for Removing Photoresist
11/29/2007US20070272278 Apparatus for cleaning and drying substrates
11/29/2007US20070272155 Substrate Processing Apparatus and Temperature Control Device
11/29/2007US20070272154 Shower Head and Film-Forming Device Using the Same
11/29/2007US20070272151 Substrate Processing System, Method of Confirmation of Its State of Use, and Method of Prevention of Illicit Use
11/29/2007US20070272149 Liquid drop jetting apparatus using charged beam and method for manufacturing a pattern using the apparatus
11/29/2007US20070271958 Method of Molding Silica Glass
11/29/2007US20070271775 Ball grid array rework using a continuous belt furnace
11/29/2007US20070271750 Method for manufacturing piezoelectric layers
11/29/2007DE19545743B4 Halbleiterspeichervorrichtung mit Speicherzellenmatrix A semiconductor memory device having memory cell array
11/29/2007DE112006000175T5 Graben Schottky-Sperrschichtdiode mit unterschiedlicher Oxiddicke Trench Schottky barrier diode with different oxide thickness
11/29/2007DE10353676B4 Verfahren zur Herstellung eines ultradünnen Moduls mit rauen Kontakten A process for producing an ultra-thin module with rough contacts
11/29/2007DE10219841B4 Kontaktplugausbildung für Bauelemente mit gestapelten Kondensatoren Contact Plug for training devices with stacked capacitors
11/29/2007DE10212962B4 Halbleiterspeicherzelle mit Zugriffstransistor auf der Grundlage eines organischen Halbleitermaterials und Halbleiterspeichereinrichtung A semiconductor memory cell having access transistors on the basis of an organic semiconductor material and the semiconductor memory device
11/29/2007DE10212878B4 Halbleiterschaltungsanordnung und Halbleiterspeichereinrichtung A semiconductor circuit arrangement and the semiconductor memory device
11/29/2007DE10206057B4 Nichtflüchtiges Speicherbauelement und Verfahren zu seiner Herstellung A non-volatile memory device and method for its preparation
11/29/2007DE102007024460A1 Chemisch-mechanisches Polierkissen Chemical mechanical polishing pad
11/29/2007DE102007024459A1 Chemisch-mechanisches Polierkissen Chemical mechanical polishing pad
11/29/2007DE102007023581A1 Zusammensetzung zur Ausbildung eines Musters und in-plane-Druckverfahren unter Verwendung derselben A composition for forming a pattern, and in-plane pressure method using the same
11/29/2007DE102007019895A1 Handler for testing of packed chip, has tray transfer device transfer bars holding sides of tray, where bars are rotatable around axis by drive unit to move tray in direction of longitudinal side of tray
11/29/2007DE102006034678B3 Power semiconductor device e.g. insulated gate bipolar transistor device, has semiconductor element with drift distance between zone and substrate range, and zone sections with trench structures that are filled with semiconductor material
11/29/2007DE102006025066A1 Integrated circuit`s e.g. remote sensor, part e.g. processor, testing method for radio frequency identification system, involves contactless selecting result of functional test by testing device
11/29/2007DE102006024504A1 Insulated-gate bipolar transistor power semiconductor component for frequency converter module, has dopant zone with higher impurity concentration arranged distant from base of trench structure and in space charge area of p-n junction
11/29/2007DE102006024495A1 Semiconductor arrangement for isolating e.g. insulated gate bipolar transistor, has conducting structure with semiconductor material, where conducting structure conductively connects one region with other region
11/29/2007DE102006024460A1 Motor vehicle radar system`s circuit structure, has coupling/decoupling device for coupling test resonator structure with circuit section having negative resistance during testing and for decoupling structure from section after testing
11/29/2007DE102006024418A1 Surface treatment apparatus for semiconductor chips has processing chamber filled with plasma and pressure lock with workpiece carriers on turntable which carry seals to prevent loss of pressure in lock during treatment
11/29/2007DE102006024214A1 Dielectric intermediate layer producing method for use in storage capacitor, involves forming metal oxide and metal nitride layers, oxidizing nitride layer to form another metal oxide layer, and heating layer sequence to form mixing layer
11/29/2007DE102006024213A1 Verfahren zum Herstellen eines Bausteins mit einer elektrischen Kontaktierung A method for producing a block with an electrical contact
11/29/2007DE102006024147B3 Elektronisches Modul mit Halbleiterbauteilgehäuse und einem Halbleiterchip und Verfahren zur Herstellung desselben An electronic module with the semiconductor device housing and a semiconductor chip and method of manufacturing the same
11/29/2007DE102006024121A1 Nichtflüchtige Speicherzelle einer in einem Halbleiterplättchen integrierten Schaltung, Verfahren zu deren Herstellung und Verwendung einer nichtflüchtigen Speicherzelle A non-volatile memory cell of an integrated circuit in a semiconductor wafer, to processes for their preparation and use a non-volatile memory cell
11/29/2007DE102006009280B4 Verfahren zur Herstellung von komplementären Transistoren und entsprechend hergestellte Transistoranordnung A process for producing complementary transistors and correspondingly produced transistor arrangement
11/29/2007DE102005043808B4 Außenkontaktmaterial für Außenkontakte eines Halbleiterbauteils und Verfahren zur Herstellung des Außenkontaktmaterials External contact material for external contacts of a semiconductor device and method of manufacturing the outer contact material
11/29/2007DE102005033443B4 Vorrichtung zum Ätzen von Halbleitern An apparatus for etching semiconductors
11/29/2007DE102005014793B4 Verfahren und Inspektionssystem zur CD-Messung auf der Grundlage der Bestimmung von Flächenanteilen Procedures and inspection system for CD measurement based on the determination of surface portions
11/29/2007DE102004059034B4 Verfahren zum Herstellen einer Hartmaske in einem Kondensatorbauelement und eine Hartmaske zur Verwendung in einem Kondensatorbauelement A method for producing a hard mask in a capacitor device and a hard mask for use in a capacitor device
11/29/2007DE102004047499B4 Wire Bonder mit einer Haltevorrichtung zum Anpressen der Anschlussfinger eines Systemträgers an eine Heizplatte Wire bonder having a holding device for pressing the connector fingers of a lead frame on a hot plate
11/29/2007DE102004018483B4 Verfahren zum Aufbringen von Beschichtungen auf bandförmigen Strukturen in der Halbleiterbauteilefertigung und Verwendung einer Vorrichtung zum Aufbringen von Beschichtungen auf bandförmigen Strukturen A method for applying coatings to the band-shaped structures in the semiconductor devices fabrication and use of an apparatus for applying coatings on strip-shaped structures
11/29/2007DE102004011234B4 Verfahren zur Verringerung der Zündempfindlichkeit eines Thyristors A method for reducing the ignitability of a thyristor
11/29/2007DE10194692B4 Verfahren zur chemischen Aufdampfung zur Bildung einer dielektrischen Schicht mit hohem K-Wert und Verfahren zur Bildung eines Kondensators Chemical vapor deposition method for forming a dielectric layer with a high K-value and method for forming a capacitor
11/29/2007DE10156915B4 Vorrichtung zum homogenen Erwärmen von Substraten oder Oberflächen und deren Verwendung Device for the homogeneous heating of substrates or surfaces and their use
11/29/2007DE10122839B4 Verfahren zum Vereinzeln von Halbleiterstrukturen sowie zum Vereinzeln vorbereitetes Halbleitersubstrat A method for separating semiconductor structures, as well as for separating prepared semiconductor substrate
11/29/2007DE10110005B4 Elektronisches Bauteil mit einem Halbleiterchip und Verfahren zu seiner Herstellung Electronic component having a semiconductor chip and method for its preparation
11/29/2007CA2652680A1 Digital alloys and methods for forming the same
11/29/2007CA2651670A1 Semiconductor devices including self aligned refractory contacts and methods of fabricating the same
11/29/2007CA2650894A1 Superconducting thin film material and method for manufacturing the same
11/28/2007EP1860701A2 Solid-state imaging device and method of manufacturing the same
11/28/2007EP1860699A1 Display having thin fim transistors with channel region of varying crystal state
11/28/2007EP1860693A2 Substrate transfer apparatus, substrate process system, and substrate transfer method
11/28/2007EP1860692A1 Gripper and method for holding semiconductor wafer, and shape measuring apparatus
11/28/2007EP1860691A1 Electronic circuit and method for manufacturing same
11/28/2007EP1860690A2 Process for producing silicon oxide films from organoaminosilane precursors
11/28/2007EP1860689A1 Polishing head for semiconductor wafer, polishing apparatus and polishing method
11/28/2007EP1860688A1 Abrasive for semiconductor integrated circuit device, method for polishing semiconductor integrated circuit device and semiconductor integrated circuit device manufacturing method
11/28/2007EP1860686A2 Semiconductor memory device having a recess-type control gate electrode and method of fabricating the semiconductor memory device
11/28/2007EP1860685A1 Transparent conductive film forming apparatus, multilayer transparent conductive film continuously forming apparatus and method of film forming therewith
11/28/2007EP1860684A1 Plate member, substrate holding device, exposure device and exposure method, and device manufacturing method
11/28/2007EP1860683A2 High-Temperature Ion Implantation Apparatus and Methods of Fabricating Semiconductor Devices Using High-Temperature Ion Implantation
11/28/2007EP1860661A1 Floating gate memory cell reading and writing technique
11/28/2007EP1860582A1 Simulation apparatus, simulation method, simulation program, and computer readable recording medium in which that program has been recorded
11/28/2007EP1860508A2 Composition and method for photoresist removal
11/28/2007EP1860506A1 Lithographic apparatus and device manufacturing method
11/28/2007EP1860500A2 Phase shift mask blank, phase shift mask, and pattern transfer method
11/28/2007EP1860477A1 Projection optical system, exposure equipment and device manufacturing method
11/28/2007EP1860428A2 Wafer inspection using short-pulsed continuous broadband illumination
11/28/2007EP1860212A1 Base material processing apparatus and base material processing method
11/28/2007EP1860207A1 Process for target production
11/28/2007EP1860170A1 Adhesive composition, circuit connecting material, connection structure of circuit member, and semiconductor device
11/28/2007EP1859487A2 Photovoltaic cell containing a semiconductor photovoltaically active material
11/28/2007EP1859483A1 Magnetic self-assembly for integrated circuit packages
11/28/2007EP1859481A1 Method for realising a nanometric circuit architecture between standard electronic components and semiconductor device obtained with said method
11/28/2007EP1859480A1 Production of a carrier wafer contact in soi trench insulated integrated circuits provided with a high-voltage components
11/28/2007EP1859479A1 Method for microstructuring solid surfaces
11/28/2007EP1859478A1 Method of producing a light-emitting diode comprising a nanostructured pn junction and diode thus obtained
11/28/2007EP1859477A1 Nitride single crystal seeded growth in supercritical ammonia with alkali metal ions
11/28/2007EP1859476A1 Methods of forming pluralities of capacitors
11/28/2007EP1859475A2 Method of fabrication of ai/ge bonding in a wafer packaging environment and a product produced therefrom
11/28/2007EP1859259A1 Device, in particular, for measuring humidity, comprising corrosion-protected connections
11/28/2007EP1859077A2 Systems and methods for achieving isothermal batch processing of substrates used for the production of micro-electro-mechanical systems
11/28/2007EP1858795A2 Control of fluid conditions in bulk fluid delivery systems
11/28/2007EP1782465A4 Method and apparatus for cleaving brittle materials
11/28/2007EP1754088A4 Silicon optoelectronic device
11/28/2007EP1741131B1 Level realignment following an epitaxy step
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