Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
01/2008
01/08/2008US7316790 Securing a document by applying a metal sulfide phosphor powder containing particles that are spherical and have an average particle size of 0.3 to not greater than 10 mu m.; up-converter particles; emits at least two different wavelengths
01/08/2008US7316786 Method of polishing film to be polished
01/08/2008US7316784 Method of patterning transparent conductive film, thin film transistor substrate using the same and fabricating method thereof
01/08/2008US7316783 Method of wiring formation and method for manufacturing electronic components
01/08/2008US7316772 Immersing substrate into an electroplating bath including ionic copper and defect reducing agent; electroplating copper deposit from bath onto substrate to fill submicron-sized reliefs whereby occurrence of protrusion defects are reduced
01/08/2008US7316761 Apparatus for uniformly etching a dielectric layer
01/08/2008US7316756 Desiccant for top-emitting OLED
01/08/2008US7316747 Seeded single crystal silicon carbide growth and resulting crystals
01/08/2008US7316746 Crystals for a semiconductor radiation detector and method for making the crystals
01/08/2008US7316745 High-resistance silicon wafer and process for producing the same
01/08/2008US7316725 Copper powders methods for producing powders and devices fabricated from same
01/08/2008US7316325 Substrate container
01/08/2008US7316315 Thin plate storage container and lid having at least one thin plate supporting member
01/08/2008US7316199 Method and apparatus for controlling the magnetic field intensity in a plasma enhanced semiconductor wafer processing chamber
01/08/2008US7316174 Cutting machine for plate-shaped material
01/08/2008US7316063 Methods of fabricating substrates including at least one conductive via
01/08/2008CA2443149C Semiconductor device and method of manufacturing the same
01/08/2008CA2364745C Etching method for znse polycrystalline substrate
01/08/2008CA2287814C Grid control electrode manufacturing process for igbt transistor
01/03/2008WO2008003041A2 Circuit and method of reducing body diode reverse recovery time of lateral power semiconduction devices
01/03/2008WO2008003032A1 Nonvolatile memory with variable drain voltage
01/03/2008WO2008002947A1 Method of forming a transistor having gate protection and transistor formed according to the method
01/03/2008WO2008002944A1 Flexible joint methodology to attach a die on an organic substrate
01/03/2008WO2008002943A1 Bit-erasing architecture for seek-scan probe (ssp) memory storage
01/03/2008WO2008002847A1 Methods of employing a thin oxide mask for high dose implants
01/03/2008WO2008002844A2 Method for depositing an amorphous carbon film with improved density and step coverage
01/03/2008WO2008002790A1 Method of producing segmented chips
01/03/2008WO2008002710A1 Method for straining a semiconductor device
01/03/2008WO2008002669A2 Post etch wafer surface cleaning with liquid meniscus
01/03/2008WO2008002521A2 Semiconductor heterojunction devices based on sic
01/03/2008WO2008002443A1 Repairing and restoring strength of etch-damaged low-k dielectric materials
01/03/2008WO2008002415A2 Precursors for depositing silicon containing films and processes thereof
01/03/2008WO2008002326A2 A method of microminiaturizing a nano-structure
01/03/2008WO2008002268A1 Ltcc substrate structure
01/03/2008WO2008002089A1 Neutral particle beam generating apparatus with increased neutral particle flux
01/03/2008WO2008002075A1 Real time leak detection system of process chamber
01/03/2008WO2008002051A1 Chip scale package tray
01/03/2008WO2008002046A1 Apparatus and method for generating solid element neutral particle beam
01/03/2008WO2008002045A1 Method for forming predetermined patterns on a wafer by direct etching with neutral particle beams
01/03/2008WO2008002017A1 Method of depositing chalcogenide film for phase-change memory
01/03/2008WO2008001997A1 Apparatus for marking and vision inspection of the semiconductor device
01/03/2008WO2008001982A1 Apparatus and method for eliminating molding compound of semi-conductor and electronic device
01/03/2008WO2008001969A1 Loading unit of chemical mechanical polishing apparatus and method of detecting proper position of wafer using the same
01/03/2008WO2008001891A1 Inspecting device, and inspecting method
01/03/2008WO2008001871A1 Maintenance method, exposure method and apparatus and device manufacturing method
01/03/2008WO2008001853A1 Plasma processing method and equipment
01/03/2008WO2008001844A1 Process for producing high-purity hexafluoropropylene and cleaning gas
01/03/2008WO2008001809A1 Microwave plasma processing device
01/03/2008WO2008001805A1 Diamond electron radiation cathode, electron source, electron microscope, and electron beam exposer
01/03/2008WO2008001712A1 Switching element, semiconductor device, rewritable logical integrated circuit, and memory element
01/03/2008WO2008001711A1 Fluid container and fluid-containing container using the same
01/03/2008WO2008001703A1 Paper including semiconductor device and manufacturing method thereof
01/03/2008WO2008001698A1 Substrate processing method and substrate processing apparatus
01/03/2008WO2008001697A1 Substrate processing method and substrate processing apparatus
01/03/2008WO2008001688A1 Substrate processing apparatus and semiconductor device manufacturing method
01/03/2008WO2008001685A1 Ion implanting apparatus and ion beam deflection angle correcting method
01/03/2008WO2008001670A1 Monoparticulate-film etching mask and process for producing the same, process for producing fine structure with the monoparticulate-film etching mask, and fine structure obtained by the production process
01/03/2008WO2008001626A1 Wafer bonding apparatus
01/03/2008WO2008001621A1 Calibration method for end portion inspecting device
01/03/2008WO2008001593A1 Exposing method, exposing device, and device manufacturing method
01/03/2008WO2008001547A1 Sputtering target/backing plate conjunction element
01/03/2008WO2008001544A1 Positive resist composition, and method for formation of resist pattern
01/03/2008WO2008001487A1 Microstructural body and process for producing the same
01/03/2008WO2008001483A1 Vaporizer/supplier of material and automatic pressure regulator for use therein
01/03/2008WO2008001461A1 Semiconductor integrated circuit
01/03/2008WO2008001458A1 Semiconductor device and semiconductor manufacturing method
01/03/2008WO2008001411A1 Process for producing semiconductor memory device
01/03/2008WO2008001249A1 Method of manufacturing a bipolar transistor and bipolar transitor obtained therewith
01/03/2008WO2008000949A1 Adjustable capacity device and process thereof
01/03/2008WO2008000581A1 Data communications with an integrated circuit
01/03/2008WO2008000556A1 Improved cmos devices with stressed channel regions, and methods for fabricating the same
01/03/2008WO2008000425A1 Method for producing a transponder
01/03/2008WO2008000245A1 Plasma process system with an electrostatic sample holding arrangement and method for decoupling a dc-voltage source
01/03/2008WO2007130489A3 Plasma reactor with a dynamically adjustable plasma source power applicator
01/03/2008WO2007117802A3 Method for integrating a conformal ruthenium layer into copper metallization of high aspect ratio features
01/03/2008WO2007114983A3 Method of making a multiple crystal orientation semiconductor device
01/03/2008WO2007092293A3 Method of forming copper indium gallium containing precursors and semiconductor compound layers
01/03/2008WO2007087247A3 Wafer level chip packaging
01/03/2008WO2007050288A3 Multiple device types including an inverted-t channel transistor and method therefor
01/03/2008WO2007018850A3 Fabrication of three dimensional integrated circuit employing multiple die panels
01/03/2008WO2006107425A3 Baffle wafers and randomly oriented polycrystallin silicon used therefor
01/03/2008WO2006105466A3 Method and apparatus for selective deposition of materials to surfaces and substrates
01/03/2008WO2006105150A3 Metal cmp process on one or more polishing stations using slurries with oxidizers
01/03/2008WO2006057818A3 Contact doping and annealing systems and processes for nanowire thin films
01/03/2008WO2006053258A3 Method to enhance cmos transistor performance by inducing strain in the gate and channel
01/03/2008WO2005057623A3 Field effect transistor with enhanced insulator structure
01/03/2008WO2005057612A3 SILICON DEVICE ON Si:C-OI and SGOI AND METHOD OF MANUFACTURE
01/03/2008WO2004100231A3 Oblique ion milling of via metallization
01/03/2008WO2003019272A3 Exposure mask
01/03/2008US20080005554 System and method for on-line diagnostics
01/03/2008US20080004823 Defect detection system, defect detection method, and defect detection program
01/03/2008US20080004742 Automatic defect review and classification system
01/03/2008US20080004193 Semiconductor process residue removal composition and process
01/03/2008US20080003936 Polishing pad for eddy current monitoring
01/03/2008US20080003926 Method of Grinding Multilayer Body and Method of Manufacturing Solid State Image Pickup Device
01/03/2008US20080003925 Cmp Polishing Slurry and Method of Polishing Substrate
01/03/2008US20080003924 Polishing slurry and polishing method
01/03/2008US20080003839 Transition metal oxide nanowires
01/03/2008US20080003838 Deposition of complex nitride films
01/03/2008US20080003837 Substrate processing method and semiconductor device manufacturing method carried out in a lithographic process