| Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974) |
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| 01/03/2008 | US20080001232 Substrate of liquid crystal device and method for manufacturing the same |
| 01/03/2008 | US20080001231 Semiconductor device and method of manufacturing the same |
| 01/03/2008 | US20080001230 Semiconductor devices including transistors having recessed channels and methods of fabricating the same |
| 01/03/2008 | US20080001228 Semiconductor device and manufacturing method thereof |
| 01/03/2008 | US20080001226 Semiconductor memory device and method of manufacturing the same |
| 01/03/2008 | US20080001225 Microelectronic structure by selective deposition |
| 01/03/2008 | US20080001224 Semiconductor device and method of manufacturing the same |
| 01/03/2008 | US20080001223 Process for manufacturing a charge-balance power diode and an edge-termination structure for a charge-balance semiconductor power device |
| 01/03/2008 | US20080001222 Semiconductor Device Of High Breakdown Voltage And Manufacturing Method Thereof |
| 01/03/2008 | US20080001220 Power MOS device |
| 01/03/2008 | US20080001218 Metal Oxide Semiconductor (MOS) Transistors Having Three Dimensional Channels |
| 01/03/2008 | US20080001217 Semiconductor device having superjunction structure and method for manufacturing the same |
| 01/03/2008 | US20080001215 Semiconductor device having recess gate and method of fabricating the same |
| 01/03/2008 | US20080001214 Semiconductor device |
| 01/03/2008 | US20080001212 Non-volatile semiconductor memory devices |
| 01/03/2008 | US20080001211 Memory devices including spacer-shaped electrodes on pedestals and methods of manufacturing the same |
| 01/03/2008 | US20080001210 Self-aligned element isolation film structure in a flash cell and forming method thereof |
| 01/03/2008 | US20080001209 Non-volatile memory device and method of manufacturing the non-volatile memory device |
| 01/03/2008 | US20080001208 Managing floating gate-to-floating gate spacing to support scalability |
| 01/03/2008 | US20080001199 Semiconductor storage device |
| 01/03/2008 | US20080001197 Semiconductor device |
| 01/03/2008 | US20080001194 Semiconductor nonvolatile storage element and method of fabricating the same |
| 01/03/2008 | US20080001191 Drain/source extension structure of a field effect transistor with reduced boron diffusion |
| 01/03/2008 | US20080001188 SOI devices and methods for fabricating the same |
| 01/03/2008 | US20080001187 Bulk FinFET Device |
| 01/03/2008 | US20080001174 directly and securely contact an aluminum alloy film with pixel electrodes and achieve a low electrical resistivity between the pixel electrodes even when a low thermal processing temperature is used; display panels; lower power consumption |
| 01/03/2008 | US20080001173 BURIED CHANNEL MOSFET USING III-V COMPOUND SEMICONDUCTORS AND HIGH k GATE DIELECTRICS |
| 01/03/2008 | US20080001171 Field effect transistor, integrated circuit element, and method for manufacturing the same |
| 01/03/2008 | US20080001168 Triggered silicon controlled rectifier for rf esd protection |
| 01/03/2008 | US20080001166 Method of fabricating vertical structure leds |
| 01/03/2008 | US20080001162 Process for Structuring at Least One Layer as Well as Electrical Component with Structures From the Layer |
| 01/03/2008 | US20080001158 Silicon carbide switching devices including p-type channels and methods of forming the same |
| 01/03/2008 | US20080001157 Semiconductor Device and Fabrication Method Thereof |
| 01/03/2008 | US20080001156 Display device, method for manufacturing the same, and electronic device having the same |
| 01/03/2008 | US20080001155 Array substrate for liquid crystal display device and method of fabricating the same |
| 01/03/2008 | US20080001154 Array substrate for liquid crystal display device and method of fabricating the same |
| 01/03/2008 | US20080001148 Semiconductor Device and Manufacturing Method Thereof |
| 01/03/2008 | US20080001136 Electrically Writeable and Erasable Memory Medium |
| 01/03/2008 | US20080001097 Electron beam drawing apparatus, electron beam drawing method, and a semiconductor device manufacturing method |
| 01/03/2008 | US20080000948 Vent Closing Method And The Use Of An Ultrasonic Bonding Machine For Carrying Out The Method |
| 01/03/2008 | US20080000876 Plasma etching apparatus and plasma etching method using the same |
| 01/03/2008 | US20080000776 Method and apparatus for processing substrate |
| 01/03/2008 | US20080000584 Surface treatment method and device thereof |
| 01/03/2008 | US20080000521 Low-temperature doping processes for silicon wafer devices |
| 01/03/2008 | US20080000509 Cleaning apparatus and cleaning method |
| 01/03/2008 | US20080000423 System for improving the wafer to wafer uniformity and defectivity of a deposited dielectric film |
| 01/03/2008 | US20080000293 Spm Cantilever and Manufacturing Method Thereof |
| 01/03/2008 | DE4407044B4 Verfahren zur Herstellung einer Maske A process for the production of a mask |
| 01/03/2008 | DE19649445B4 Verfahren zum Bilden eines Feldoxidfilms in einem Halbleiterelement A method of forming a field oxide film in a semiconductor element |
| 01/03/2008 | DE19618866B4 Verfahren zur Herstellung einer Bauelementisolation in einem Halbleiterbauelement A method for producing a device isolation in a semiconductor device |
| 01/03/2008 | DE112004003019T5 Nicht-flüchtiges Speicherbauelement und Verfahren zu dessen Herstellung Non-volatile memory device and method for its production |
| 01/03/2008 | DE10356035B4 Verfahren zur Herstellung einer Photomaske A process for preparing a photomask |
| 01/03/2008 | DE10234996B4 Verfahren zur Herstellung einer Transistoranordnung mit Trench-Transistorzellen mit Feldelektrode A process for producing a transistor arrangement with a trench transistor cells with field electrode |
| 01/03/2008 | DE10234165B4 Verfahren zum Füllen eines Grabens, der in einem Substrat gebildet ist, mit einem isolierenden Material A method of filling a trench formed in a substrate, with an insulating material |
| 01/03/2008 | DE10205079B4 Verfahren zur Herstellung einer Speicherzelle A method for fabricating a memory cell |
| 01/03/2008 | DE102007027645A1 Array substrate for in-plane switching-liquid crystal display device, has source electrode, drain electrode, data line and pixel electrode with conductive material layers, where one of the material layers is arranged on another layer |
| 01/03/2008 | DE102006032330A1 Condenser structure manufacturing method, involves forming conductive layer on side walls of trench, and applying another conductive layer on connection contacts and side walls, where layers are mechanically supported by dielectric form |
| 01/03/2008 | DE102006031300A1 Verfahren zur Dotierung von Siliziummaterial für Solarzellen, entsprechend dotiertes Siliziummaterial und Solarzelle A method for doping of silicon material for solar cells, suitably doped silicon material and solar cell |
| 01/03/2008 | DE102006031097A1 Speicherzellenanordnung und Verfahren zur Herstellung einer Speicherzellenanordnung Memory cell arrangement and method for fabricating a memory cell arrangement |
| 01/03/2008 | DE102006030268A1 Reduction of surface of silicon structure comprises exposing out the surface of silicon structure at oxygen, and carrying out thermal oxidation and plasma reinforced oxidation between a material of the silicon structure and the oxygen |
| 01/03/2008 | DE102006030267A1 Microstructures producing method involves common stamping of contact opening and cut in ductile material layer, which is formed by substrate, where contact opening and cut correspond to structural components of metallizing structure |
| 01/03/2008 | DE102006030266A1 Reducing contamination of silicon substrate during metallizing process for the production of metallization layers of semiconductor device by selectively forming a support layer and structuring dielectric layer pile by an anisotropic etching |
| 01/03/2008 | DE102006030265A1 Microstructures producing method involves building planarization layer on dielectric layer of metallization structure, which is built on substrate, where processing operation is carried out on base of surface topography |
| 01/03/2008 | DE102006030264A1 Semiconductor component for producing integrated circuits and transistors with deformed channel area, has crystalline semiconductor area, gate electrode, which is formed in crystalline semiconductor area with channel area |
| 01/03/2008 | DE102006030262A1 Method for production of integrated circuits particularly for structuring of lines, involves building covering structure elements over active semiconductor area and area of insulation structure |
| 01/03/2008 | DE102006030261A1 Method for production of integrated circuits, involves building dielectric coating over substrate, which has gate electrode formed over active area and is separated by gate isolation layer |
| 01/03/2008 | DE102006030225A1 Trench transistor manufacturing method, involves forming source structure by inserting dopants into substrate using filed isolation structure as mask, such that dopants are brought into areas of substrate uncovered by isolation structure |
| 01/03/2008 | DE102006029750A1 Trench transistor has active area which is enclosed by edge trench in which edge electrode is embedded, where active area has mesa structure which partly limits on edge trench |
| 01/03/2008 | DE102006029704A1 Integrated semiconductor structure manufacture method involves forming cell transistor for each trench capacitor dividing active area in two sections, in which cell transistors are arranged parallel to columns of trench capacitors |
| 01/03/2008 | DE102006029701A1 Semiconductor component has substrate of conducting type and buried semiconductor layer of other conducting type is arranged on substrate and insulation structure has trench and electrically conducting contact to substrate |
| 01/03/2008 | DE102006029622A1 Verfahren zur Herstellung eines Bauelements, insbesondere ein mikromechanisches und/oder mikrofluidisches und/oder mikroelektronisches Bauelement und Bauelement A method for manufacturing a device, in particular a micromechanical and / or microfluidic and / or microelectronic device, and component |
| 01/03/2008 | DE102006029003A1 Wafer e.g. semiconductor wafer, handling device, has tool rack with tool component, base rack and robot for moving wafers, and robot mounted on coupling rack that is mounted directly on base rack independently of tool rack |
| 01/03/2008 | DE102006004796B4 Verfahren zur Herstellung eines BiCMOS-Bauelements, umfassend ein erstes bipolares Bauelement und ein zweites bipolares Bauelement desselben Dotierungstyps A method for producing a BiCMOS device comprising a first bipolar device and a second bipolar device of the same doping type |
| 01/03/2008 | DE10196361B4 Verfahren zur Herstellung eines Gruppe-III-Nitrid-Halbleiterkristalls A method for producing a group III nitride semiconductor crystal |
| 01/03/2008 | DE10133717B4 Organische Antireflex-Beschichtungspolymere, solche Polymere umfassende Antireflex-Beschichtungszusammensetzungen und Verfahren zur Herstellung derselben Organic anti-reflective coating polymers, such polymers comprising anti-reflective coating compositions and methods for producing the same |
| 01/02/2008 | EP1873880A1 Process for producing gallium nitride-based compound semiconductor laser element and gallium nitride-based compound semiconductor laser element |
| 01/02/2008 | EP1873839A2 Semiconductor device |
| 01/02/2008 | EP1873838A1 Semiconductor device and method for manufacturing same |
| 01/02/2008 | EP1873837A1 Semiconductor power device having an edge-termination structure and manufacturing method thereof |
| 01/02/2008 | EP1873833A1 Thin film transistor array substrate and method of fabricating the same |
| 01/02/2008 | EP1873832A1 Memory device and semiconductor integrated circuit |
| 01/02/2008 | EP1873831A1 Semiconductor device and method of manufacturing the same |
| 01/02/2008 | EP1873825A2 Semiconductor device, LED head and image forming apparatus |
| 01/02/2008 | EP1873824A1 Jet singulation of a substrate |
| 01/02/2008 | EP1873823A1 Method of producing bonded wafer |
| 01/02/2008 | EP1873822A1 Front-rear contacts of electronics devices with induced defects to increase conductivity thereof |
| 01/02/2008 | EP1873821A1 SOI device with contact trenches formed during epitaxial growing |
| 01/02/2008 | EP1873820A1 Wafer transfer apparatus, polishing apparatus and wafer receiving method |
| 01/02/2008 | EP1873819A1 Flip chip mounting method and bump forming method |
| 01/02/2008 | EP1873818A2 Process for curing dielectric films |
| 01/02/2008 | EP1873817A2 Substrate having thin film of GaN joined thereon and method of fabricating the same, and a GaN-based semiconductor device and method of fabricating the same |
| 01/02/2008 | EP1873816A1 Exposure device, exposure method, and device manufacturing method |
| 01/02/2008 | EP1873815A1 Exposure apparatus, exposure method, and device production method |
| 01/02/2008 | EP1873814A2 Hermetic passivation layer structure for capacitors with perovskite or pyrochlore phase dielectrics |
| 01/02/2008 | EP1873813A1 Storage container |
| 01/02/2008 | EP1873812A1 Wafer frame |
| 01/02/2008 | EP1873790A1 Paste composition, electrode and solar cell device comprising same |
| 01/02/2008 | EP1873786A2 Thin film semiconductor device and manufacturing method |
| 01/02/2008 | EP1873280A1 Oxygen-doped N-type gallium nitride single crystal substrate and method for producing the same |
| 01/02/2008 | EP1873174A1 Photocurable composition, article with fine pattern and method for producing same |