| Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974) |
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| 01/03/2008 | US20080003836 Substrate processing method and substrate processing apparatus |
| 01/03/2008 | US20080003835 Method for Fabricating Semiconductor Device |
| 01/03/2008 | US20080003834 Method for fabricating a fine pattern in a semiconductor device |
| 01/03/2008 | US20080003833 Fin mask and method for fabricating saddle type fin using the same |
| 01/03/2008 | US20080003832 Method for fabricating recess gate of semiconductor device |
| 01/03/2008 | US20080003831 Method for forming metal pattern in semiconductor device |
| 01/03/2008 | US20080003830 Reducing contamination of semiconductor substrates during beol processing by providing a protection layer at the substrate edge |
| 01/03/2008 | US20080003829 Chemical mechanical polishing slurry |
| 01/03/2008 | US20080003828 Method for planarizing thin layer of semiconductor device |
| 01/03/2008 | US20080003827 Imprintable medium dispenser |
| 01/03/2008 | US20080003826 Method for increasing the planarity of a surface topography in a microstructure |
| 01/03/2008 | US20080003825 Method of patterning gate electrodes by reducing sidewall angles of a mask layer |
| 01/03/2008 | US20080003824 Method For Depositing an Amorphous Carbon Film with Improved Density and Step Coverage |
| 01/03/2008 | US20080003823 Method of manufacturing semiconductor device |
| 01/03/2008 | US20080003822 Method for fabricating semiconductor device |
| 01/03/2008 | US20080003821 Method for fabricating semiconductor device |
| 01/03/2008 | US20080003820 Bonding pad structure and method for making the same |
| 01/03/2008 | US20080003819 Laser isolation of metal over alumina underlayer and structures formed thereby |
| 01/03/2008 | US20080003818 Nano imprint technique with increased flexibility with respect to alignment and feature shaping |
| 01/03/2008 | US20080003817 Method of manufacturing semiconductor device and semiconductor device |
| 01/03/2008 | US20080003816 Method for forming metal contact in semiconductor device |
| 01/03/2008 | US20080003815 Method of forming a barrier metal layer of a semiconductor device |
| 01/03/2008 | US20080003814 Method of forming metal line of semiconductor memory device |
| 01/03/2008 | US20080003813 Method for patterning metal line in semiconductor device |
| 01/03/2008 | US20080003812 Method of manufacturing self-aligned contact openings |
| 01/03/2008 | US20080003811 Method for fabricating storage node contact in semiconductor device |
| 01/03/2008 | US20080003810 Mask ROM and method of fabricating the same |
| 01/03/2008 | US20080003809 Method for fabricating semiconductor memory device |
| 01/03/2008 | US20080003808 Method of forming metal line of semiconductor device |
| 01/03/2008 | US20080003807 Post passivation interconnection schemes on top of the IC Chips |
| 01/03/2008 | US20080003806 Post passivation interconnection schemes on top of IC chip |
| 01/03/2008 | US20080003805 Method of providing mixed size solder bumps on a substrate using a solder delivery head |
| 01/03/2008 | US20080003804 Method of providing solder bumps of mixed sizes on a substrate using solder transfer in two stages |
| 01/03/2008 | US20080003803 Semiconductor package substrate for flip chip packaging |
| 01/03/2008 | US20080003802 Method of providing solder bumps of mixed sizes on a substrate using a sorting mask and bumped substrate formed according to the method |
| 01/03/2008 | US20080003801 Packaging of integrated circuits with carbon nano-tube arrays to enhance heat dissipation through a thermal interface |
| 01/03/2008 | US20080003800 Method for fabricating semiconductor device |
| 01/03/2008 | US20080003799 Method for forming contact plug in semiconductor device |
| 01/03/2008 | US20080003798 Method for fabricating contact plug in semiconductor device |
| 01/03/2008 | US20080003797 Method for forming tungsten layer of semiconductor device and method for forming tungsten wiring layer using the same |
| 01/03/2008 | US20080003796 Method of forming bit line of semiconductor device |
| 01/03/2008 | US20080003795 Method of manufacturing a pattern |
| 01/03/2008 | US20080003794 Methods for the formation of interconnects separated by air gaps |
| 01/03/2008 | US20080003793 Ultrashallow semiconductor contact by outdiffusion from a solid source |
| 01/03/2008 | US20080003792 Method for forming a gate of a semiconductor device |
| 01/03/2008 | US20080003791 Method for fabricating recess gate in semiconductor device |
| 01/03/2008 | US20080003790 Method for forming a gate of a semiconductor device |
| 01/03/2008 | US20080003789 Providing stress uniformity in a semiconductor device |
| 01/03/2008 | US20080003788 Method of manufacturing semiconductor device |
| 01/03/2008 | US20080003787 Method of manufacturing semiconductor device |
| 01/03/2008 | US20080003786 Large area, uniformly low dislocation density gan substrate and process for making the same |
| 01/03/2008 | US20080003785 Method for Producing Semiconductor Wafer |
| 01/03/2008 | US20080003784 Low temperature fabrication of conductive micro structures |
| 01/03/2008 | US20080003783 Method of reducing a roughness of a semiconductor surface |
| 01/03/2008 | US20080003782 Multilayer gettering structure for semiconductor device and method |
| 01/03/2008 | US20080003781 Electro-chemical processor |
| 01/03/2008 | US20080003780 Detachable stiffener for ultra-thin die |
| 01/03/2008 | US20080003779 Mems device and interposer and method for integrating mems device and interposer |
| 01/03/2008 | US20080003778 Low-temperature welding with nano structures |
| 01/03/2008 | US20080003777 Nickel Tin Bonding System for Semiconductor Wafers and Devices |
| 01/03/2008 | US20080003776 Manufacture Method for Semiconductor Device Having Field Oxide Film |
| 01/03/2008 | US20080003775 Manufacturing method for semiconductor device |
| 01/03/2008 | US20080003774 Semiconductor device manufactured with a double shallow trench isolation process |
| 01/03/2008 | US20080003773 Method for forming isolation structure of semiconductor device |
| 01/03/2008 | US20080003772 Application of Different Isolation Schemes for Logic and Embedded Memory |
| 01/03/2008 | US20080003771 Semiconductor substrate and its fabrication method |
| 01/03/2008 | US20080003770 Method for manufacturing semiconductor device |
| 01/03/2008 | US20080003769 Method for fabricating semiconductor device having trench isolation layer |
| 01/03/2008 | US20080003768 Capacitor of a memory device and method for forming the same |
| 01/03/2008 | US20080003767 Method for fabricating semiconductor device |
| 01/03/2008 | US20080003766 Method for manufacturing semiconductor device free from layer-lifting between insulating layers |
| 01/03/2008 | US20080003765 Method, apparatus, and system for low temperature deposition and irradiation annealing of thin film capacitor |
| 01/03/2008 | US20080003764 Method of providing a pre-patterned high-k dielectric film |
| 01/03/2008 | US20080003763 Method of depositing silicon with high step coverage |
| 01/03/2008 | US20080003762 Method of forming resistor of flash memory device |
| 01/03/2008 | US20080003761 Method for fabricating a wafer level package with device wafer and passive component integration |
| 01/03/2008 | US20080003760 Magnetic vias for inductors and transformers in integrated circuits |
| 01/03/2008 | US20080003759 Methods of fabricating passive element without planarizing and related semiconductor device |
| 01/03/2008 | US20080003758 Varactor structure and method for fabricating the same |
| 01/03/2008 | US20080003757 Semiconductor Device Structures for Bipolar Junction Transistors and Methods of Fabricating Such Structures |
| 01/03/2008 | US20080003756 Method for fabricating MOS transistor |
| 01/03/2008 | US20080003755 Sacrificial oxide layer which enables spacer over-etch in tri-gate architectures |
| 01/03/2008 | US20080003754 Method of forming gate of flash memory device |
| 01/03/2008 | US20080003753 Semiconductor Device Having Buried Gate Electrode and Method of Fabricating the Same |
| 01/03/2008 | US20080003752 Gate dielectric materials for group III-V enhancement mode transistors |
| 01/03/2008 | US20080003751 Methods for forming dual poly gate of semiconductor device |
| 01/03/2008 | US20080003750 Method of manufacturing flash memory device |
| 01/03/2008 | US20080003749 Method Of Manufacturing A Flash Memory Device |
| 01/03/2008 | US20080003748 Method of fabricating recess gate in semiconductor device |
| 01/03/2008 | US20080003747 Non-volatile memory device and manufacturing method thereof |
| 01/03/2008 | US20080003746 Selective spacer formation on transistors of different classes on the same device |
| 01/03/2008 | US20080003745 Method of manufacturing a flash memory device |
| 01/03/2008 | US20080003744 Method of manufacturing nand flash memory device |
| 01/03/2008 | US20080003743 Method of manufacturing NAND flash memory device |
| 01/03/2008 | US20080003742 Method of manufacturing flash memory device |
| 01/03/2008 | US20080003741 Method for fabricating a cylindrical capacitor using amorphous carbon-based layer |
| 01/03/2008 | US20080003740 Method for forming a capacitor structure and a capacitor structure |
| 01/03/2008 | US20080003739 Method for forming isolation structure of flash memory device |
| 01/03/2008 | US20080003738 Manufacturing method of semiconductor device |
| 01/03/2008 | US20080003737 Method of manufacturing MEMS devices providing air gap control |