Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
02/2008
02/28/2008WO2007133603A3 In-situ defect reduction techniques for nonpolar and semipolar (ai, ga, in)n
02/28/2008WO2007120537A3 Patterning a plurality of fields on a substrate
02/28/2008WO2007109486A3 Carrierless chip package for integrated circuit devices, and methods of making same
02/28/2008WO2007011566A8 Semiconductor constructions, memory arrays, electronic systems, and methods of forming semiconductor constructions
02/28/2008US20080051925 Kinematic pin with shear member and substrate carrier for use therewith
02/28/2008US20080051524 Epoxy-Based Compositions Having Improved Impact Resistance
02/28/2008US20080051018 Semiconductor Wafer Handler
02/28/2008US20080051010 Polishing Composition and Polishing Method
02/28/2008US20080050933 Insulator film, manufacturing method of multilayer wiring device and multilayer wiring device
02/28/2008US20080050932 Overall defect reduction for PECVD films
02/28/2008US20080050931 Method for fabricating strained silicon-on-insulator structures and strained silicon-on-insulator structures formed thereby
02/28/2008US20080050930 Method of forming insulating film and method of manufacturing semiconductor device
02/28/2008US20080050929 Method of and Apparatus for Low-Temperature Epitaxy on a Plurality of Semiconductor Substrates
02/28/2008US20080050928 Semiconductor constructions, and methods of forming dielectric materials
02/28/2008US20080050927 Variable temperature and dose atomic layer deposition
02/28/2008US20080050926 Dry etching method
02/28/2008US20080050925 Photoresist processing methods
02/28/2008US20080050924 Substrate carrying apparatus and substrate carrying method
02/28/2008US20080050923 Low-k damage avoidance during bevel etch processing
02/28/2008US20080050922 Chamber recovery after opening barrier over copper
02/28/2008US20080050921 Method for Manufacturing Semiconductor Device
02/28/2008US20080050920 Method of manufacturing semiconductor device
02/28/2008US20080050919 High aspect ratio via etch
02/28/2008US20080050918 Method for producing a device comprising a structure equipped with one or more microwires or nanowires based on a si and ge compound by germanium condensation
02/28/2008US20080050917 Method of manufacturing semiconductor device
02/28/2008US20080050916 Methods and apparatus for depositing tantalum metal films to surfaces and substrates
02/28/2008US20080050915 Method for manufacturing semiconductor device
02/28/2008US20080050914 Method for fabricating semiconductor device
02/28/2008US20080050913 Top layers of metal for high performance IC's
02/28/2008US20080050912 Chip structure and process for forming the same
02/28/2008US20080050911 Microfeature workpieces having conductive interconnect structures formed by chemically reactive processes, and associated systems and methods
02/28/2008US20080050910 Method for producing smooth, dense optical films
02/28/2008US20080050909 Top layers of metal for high performance IC's
02/28/2008US20080050908 Semiconductor device and method of manufacture thereof
02/28/2008US20080050907 Semiconductor Component with Plastic Housing, and Process for Producing the Same
02/28/2008US20080050906 Low fabrication cost, fine pitch and high reliability solder bump
02/28/2008US20080050905 Method of manufacturing semiconductor device
02/28/2008US20080050904 Methods for attaching microfeature dies to external devices
02/28/2008US20080050903 Electrically programmable fuse structures with narrowed width regions configured to enhance current crowding and methods of fabricating thereof
02/28/2008US20080050902 Method for forming an independent bottom gate connection for buried interconnection including bottom gate of a planar double gate MOSFET
02/28/2008US20080050901 Packaged microelectronic devices and methods for manufacturing packaged microelectronic devices
02/28/2008US20080050900 Methods for pitch reduction formation
02/28/2008US20080050899 Method for manufacturing a semiconductor device having a polymetal gate electrode structure
02/28/2008US20080050898 Semiconductor devices and methods of manufacture thereof
02/28/2008US20080050897 Method for doping a fin-based semiconductor device
02/28/2008US20080050896 Fabricating method of silicon layer with high resistance
02/28/2008US20080050895 Method for Manufacturing Semiconductor Device
02/28/2008US20080050894 Preparation method of a coating of gallium nitride
02/28/2008US20080050893 Manufacturing method of display device
02/28/2008US20080050892 Method of manufacturing a thin film structure, method of manufacturing a storage node using the same, method of manufacturing a phase change random access memory using the same and a thin film structure, a storage node and a phase change random access memory formed using the same
02/28/2008US20080050891 Coplanar silicon-on-insulator (soi) regions of different crystal orientations and methods of making the same
02/28/2008US20080050890 Hybrid oriented substrates and crystal imprinting methods for forming such hybrid oriented substrates
02/28/2008US20080050889 Hotwall reactor and method for reducing particle formation in GaN MOCVD
02/28/2008US20080050888 Laser separation of thin laminated glass substrates for flexible display applications
02/28/2008US20080050887 METHOD FOR FABRICATING SiGe-ON-INSULATOR (SGOI) AND Ge-ON-INSULATOR (GOI) SUBSTRATES
02/28/2008US20080050886 Method of producing semiconductor device
02/28/2008US20080050885 System and method for fabricating a fin field effect transistor
02/28/2008US20080050884 Process for manufacturing semiconductor device
02/28/2008US20080050883 Hetrojunction bipolar transistor (hbt) with periodic multilayer base
02/28/2008US20080050882 System and Method for Mitigating Oxide Growth in a Gate Dielectric
02/28/2008US20080050881 Heterojunction tunneling field effect transistors, and methods for fabricating the same
02/28/2008US20080050880 Structure for uniform triggering of multifinger semiconductor devices with tunable trigger voltage
02/28/2008US20080050879 Methods of forming metal-containing gate structures
02/28/2008US20080050878 Method for preparing a memory structure
02/28/2008US20080050877 Superjunction trench device and method
02/28/2008US20080050876 Method for fabricating silicon carbide vertical mosfet devices
02/28/2008US20080050875 Methods of fabricating embedded flash memory devices
02/28/2008US20080050874 Metal-insulator-metal capacitor and method of manufacturing the same
02/28/2008US20080050873 Semiconductor structures with body contacts and fabrication methods thereof
02/28/2008US20080050872 Fabrication of a high speed RRAM having narrow pulse width programming capabilities
02/28/2008US20080050871 Methods for removing material from one layer of a semiconductor device structure while protecting another material layer and corresponding semiconductor device structures
02/28/2008US20080050870 Method for fabricating semiconductor device
02/28/2008US20080050869 Dual stress liner device and method
02/28/2008US20080050868 Method to enhance device performance with selective stress relief
02/28/2008US20080050867 Array substrate of liquid crystal display device and manufacturing method thereof
02/28/2008US20080050866 Semiconductor structures integrating damascene-body finfet's and planar devices on a common substrate and methods for forming such semiconductor structures
02/28/2008US20080050865 Non-planar transistor having germanium channel region and method of manufacturing the same
02/28/2008US20080050864 Method of manufacturing semiconductor device having impurity region under isolation region
02/28/2008US20080050863 Semiconductor structure including multiple stressed layers
02/28/2008US20080050862 Method of manufacturing a single chip semiconductor integrated circuit device including a mask ROM in a short time
02/28/2008US20080050861 Microelectromechanical Systems Encapsulation Process with Anti-Stiction Coating
02/28/2008US20080050860 Adhesion by plasma conditioning of semiconductor chip
02/28/2008US20080050859 Methods for a multiple die integrated circuit package
02/28/2008US20080050858 Method for producing semiconductor device
02/28/2008US20080050857 dispersion comprising crystalline gallium nitride, solvent system, and cellulose-derived dispersant; centrifuging; for use in light emitting devices and laser devices
02/28/2008US20080050856 Method for manufacturing silicon device
02/28/2008US20080050855 Nitride semiconductor laser device and a method for improving its performance
02/28/2008US20080050854 Semiconductor Light Emitting Element and Method for Manufacturing the Same
02/28/2008US20080050853 Method of fabricating display substrate
02/28/2008US20080050852 Manufacturing of flexible display device panel
02/28/2008US20080050851 Method for Manufacturing Display Device
02/28/2008US20080050850 Method for manufacturing semiconductor laser element
02/28/2008US20080050849 Method to eliminate arsenic contamination in trench capacitors
02/28/2008US20080050848 Charged particle beam irradiation method and semiconductor device manufacturing method
02/28/2008US20080050847 Single ic-chip design on wafer with an embedded sensor utilizing rf capabilities to enable real-time data transmission
02/28/2008US20080050846 Liquid crystal display panel device having compensation cell gap, method of fabricating the same and method of using the same
02/28/2008US20080050845 Microelectromechanical systems encapsulation process
02/28/2008US20080050844 Surface Reconstruction Method for Silicon Carbide Substrate
02/28/2008US20080050688 System and Process for Heating Semiconductor Wafers by Optimizing Absorption of Electromagnetic Energy
02/28/2008US20080050661 Photomask fabrication utilizing a carbon hard mask