Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
03/2008
03/26/2008CN101151718A Method and system for forming an oxynitride layer
03/26/2008CN101151717A Method and system for forming a high-K dielectric layer
03/26/2008CN101151716A Etch process for CD reduction of ARC material
03/26/2008CN101151715A Ashing apparatus, ashing method, and impurity doping apparatus
03/26/2008CN101151714A Method for removing particles from a semiconductor surface
03/26/2008CN101151713A Bonded wafer, manufacturing method therefor, and plane grinding apparatus
03/26/2008CN101151712A A method and system for removing an oxide from a substrate
03/26/2008CN101151711A Plasma doping method and apparatus
03/26/2008CN101151710A Plasma doping method and device used for this
03/26/2008CN101151709A Plasma doping method and plasma processing equipment
03/26/2008CN101151708A SOI wafer manufacturing method and soi wafer manufactured by same
03/26/2008CN101151707A 杂质导入装置和杂质导入方法 Impurity introduction apparatus and method for introducing impurities
03/26/2008CN101151681A Paste composition, electrode and solar cell device comprising same
03/26/2008CN101151579A Photosensitive resin composition and circuit substrate employing the same
03/26/2008CN101151522A Method and device for inspecting surface of distorted silicon wafer
03/26/2008CN101151398A Deep-pot-shaped copper sputtering target and process for producing the same
03/26/2008CN101151340A Bonding of air-plasma treated thermoplastics
03/26/2008CN101151197A Automatic material processing system
03/26/2008CN101151132A Resin mold and process for producing molded product using the same
03/26/2008CN101150910A Device with adjustable electrode and method for adjusting adjustable electrode
03/26/2008CN101150909A Plasm restraint device
03/26/2008CN101150173A Nonvolatile memory device and fabrication method thereof
03/26/2008CN101150161A A making method for non coating film semiconductor extension slice
03/26/2008CN101150152A A making method for white LED chip
03/26/2008CN101150147A Printed non-volatile memory
03/26/2008CN101150146A Semiconductor device and method for fabricating thereof
03/26/2008CN101150144A A GaN base field effect tube and its making method
03/26/2008CN101150143A Semiconductor chip and its encapsulation structure and making method
03/26/2008CN101150142A Organic electro-luminescent display and method of fabricating the same
03/26/2008CN101150141A Organic electro-luminescence display device and method of manufacturing the same
03/26/2008CN101150140A Organic light emitting display
03/26/2008CN101150138A Phase change memory devices including memory cells having different phase change materials and related methods and systems
03/26/2008CN101150137A Back lighting imaging device and manufacturing method thereof, semiconductor substrate and imaging device
03/26/2008CN101150136A Metal connection structure for CMOS image sensor integrated circuit and its making method
03/26/2008CN101150135A 半导体器件及其制造方法 Semiconductor device and manufacturing method thereof
03/26/2008CN101150134A Storage device for increasing overlapped area between control grid and floating grid and its making method
03/26/2008CN101150131A Semiconductor device and manufacturing method thereof
03/26/2008CN101150129A Multi-crystal silicon-insulation layer-metal structure capacitance and its making method
03/26/2008CN101150125A Electric sensor formed on semiconductor base and its forming method
03/26/2008CN101150121A Flexible circuits having improved reliability and thermal dissipation
03/26/2008CN101150120A Stacked semiconductor package, method of fabrication, and method of wire-bond monitoring
03/26/2008CN101150119A Stacked semiconductor package and method of manufacturing the same
03/26/2008CN101150117A Semiconductor encapsulation structure and its making process
03/26/2008CN101150116A Semiconductor encapsulation structure with electromagnetic shielding function and its making method
03/26/2008CN101150115A Conductive resistance blocking layer material for copper interconnection and making method
03/26/2008CN101150113A A semiconductor device and a method of increasing a resistance value of an electric fuse
03/26/2008CN101150112A Semiconductor device and fabrication process thereof
03/26/2008CN101150105A Semiconductor device and method of manufacturing the same
03/26/2008CN101150104A External pin structure, active part array base plate, photoelectric device and making method
03/26/2008CN101150103A A crystal wafer chip dimension encapsulation line and its making method
03/26/2008CN101150102A Semiconductor device and method for manufacturing the same
03/26/2008CN101150097A Semiconductor device and method for manufacturing the same
03/26/2008CN101150096A Recycling pressing and printing device for crystal wafer connection
03/26/2008CN101150093A Pixel structure and its making method
03/26/2008CN101150092A Making method for CMOS thin film transistor
03/26/2008CN101150091A Pixel structure and its making method
03/26/2008CN101150090A Semiconductor device and manufacturing method thereof
03/26/2008CN101150089A Integration method for single-wall carbon nano tube part
03/26/2008CN101150088A Method for adjusting and controlling single-wall carbon nano tube axial energy belt
03/26/2008CN101150087A Device with plating through structure and its making method
03/26/2008CN101150086A Method for forming semiconductor device barrier layer
03/26/2008CN101150085A Method for uplifting device and adjusting plane degree of lifting device
03/26/2008CN101150084A Correction auxiliary tools
03/26/2008CN101150083A A device and method for improving detection precision of oxidated layer thickness
03/26/2008CN101150082A Semiconductor with protrusion point and base plate connection method
03/26/2008CN101150081A Solid encapsulation structure and its making method
03/26/2008CN101150080A Ball replanting technology for global array encapsulation chip
03/26/2008CN101150079A A mould release method and machine for glue injection of semiconductor part chip
03/26/2008CN101150078A Making method for semiconductor device and semiconductor device
03/26/2008CN101150077A SMT-free encapsulation method of imaging sensor
03/26/2008CN101150076A Making method for semiconductor encapsulation component and semiconductor part location structure and method
03/26/2008CN101150075A Carrier and its making method
03/26/2008CN101150074A Adulation method for MOS transistor body area
03/26/2008CN101150073A A thin film transistor and its making method
03/26/2008CN101150072A Semiconductor device
03/26/2008CN101150071A Method of manufacturing semiconductor device
03/26/2008CN101150070A Semiconductor structure and its forming method
03/26/2008CN101150069A Making method for low on-resistance power VDMOS transistor
03/26/2008CN101150068A Method for reducing GIDL effect
03/26/2008CN101150067A A phosphor adulterated and impurity absorption method
03/26/2008CN101150066A Substrate processing apparatus
03/26/2008CN101150065A Method for forming aperture on low dielectric permittivity dielectric layer
03/26/2008CN101150064A Method for removing clearance wall, metal semiconductor transistor parts and its making method
03/26/2008CN101150063A A method and reaction device for reducing creepage current on passivated crystal slice surface
03/26/2008CN101150062A Method for forming semiconductor structure
03/26/2008CN101150061A A control method for semiconductor etching device
03/26/2008CN101150060A Method for field separated etching
03/26/2008CN101150059A Wafer thinning method
03/26/2008CN101150058A Sediment method for forming semiconductor metal key cushion
03/26/2008CN101150057A Thin film semiconductor device and manufacturing method for the same
03/26/2008CN101150056A Method for producing p-type group iii nitride semiconductor and method for producing electrode for p-type group iii nitride semiconductor
03/26/2008CN101150055A Making method for large-area 3C-SiC thin film of MEMS part
03/26/2008CN101150054A A method for obtaining low bit discrepancy density extension thin film via using neck down extension
03/26/2008CN101150053A Nitride semiconductor base plate and its manufacturing method
03/26/2008CN101150052A Method of patterning an anti-reflective coating by partial etching
03/26/2008CN101150051A Apparatus and methods for transporting and processing substrates
03/26/2008CN101150050A Oxidation apparatus and method for semiconductor process
03/26/2008CN101150049A Heat-processing furnace and manufacturing method thereof
03/26/2008CN101150048A Method for forming patterns using single mask
03/26/2008CN101150047A Substrate treatment apparatus and substrate treatment method
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