Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
05/2008
05/08/2008US20080105873 Tft lcd array substrate and manufacturing method thereof
05/08/2008US20080105871 Thin film transistor array substrate having lightly doped amorphous silicon layer and method for fabricating same
05/08/2008US20080105870 Two-terminal switching devices and their methods of fabrication
05/08/2008US20080105869 Printed circuit board for mounting semiconductor device package, and method of testing and fabricating semiconductor device package using the same
05/08/2008US20080105868 Organic semiconductor device, process for producing the same, and organic semiconductor apparatus
05/08/2008US20080105864 Ferroelectric Memory Device and Method For Manufacturing the Same
05/08/2008US20080105825 Laser scanning apparatus and method using diffractive optical elements
05/08/2008US20080105664 Energy-efficient, laser-based method and system for processing target material
05/08/2008US20080105662 Laser beam processing method and laser beam processing machine
05/08/2008US20080105660 Apparatus and method to confine plasma and reduce flow resistance in a plasma reactor
05/08/2008US20080105647 Methods for Electrochemically Fabricating Structures Using Adhered Masks, Incorporating Dielectric Sheets, and/or Seed layers That Are Partially Removed Via Planarization
05/08/2008US20080105383 Expanding method and expanding device
05/08/2008US20080105377 Dissolving unnecessary thin liquid film formed on the edges of a substrate surface by jetting solvent toward edge parts of the supported substrate and sucking the solution of dissolved film; vertical and angular substrate movement;suppression of misting; uniform distribution of solvent; displays; resists
05/08/2008US20080105296 Nanostructures and methods for manufacturing the same
05/08/2008US20080105286 Substrate Treatment Apparatus
05/08/2008US20080105277 Methods of proximity head brushing
05/08/2008US20080105204 Substrate processing apparatus and manufacturing method for semiconductor devices
05/08/2008US20080105202 Tandem process chamber
05/08/2008US20080105069 Fine Stage Z Support Apparatus
05/08/2008US20080104935 Collecting unit for semiconductor process
05/08/2008US20080104893 Polishing composition and polishing method
05/08/2008US20080104831 Electronic Component Mounting Apparatus And method Of Mounting Electronic Components
05/08/2008DE19882929B4 Temperaturkontrollsystem für eine Werkstückhalterung Temperature control system for a workpiece holder
05/08/2008DE19807580B4 Verfahren und Vorrichtung zur quantitativen Messung des Korrosionsvorgangs von auf der Oberfläche elektronischer Schaltungsbaugruppen vorhandenen Rückständen Method and device for the quantitative measurement of the corrosion process of present on the surface of electronic circuit modules residues
05/08/2008DE19733097B4 Schleifkörper, Schleifblatt und Schleifverfahren Abrasive wheels and blade and grinding processes
05/08/2008DE112006001809T5 CMOS-Transistoren mit doppeltem Gate-Dielektrikum mit hohem k und Verfahren zur Herstellung derselben CMOS transistors with dual-gate-high-k dielectric and methods of making the same
05/08/2008DE112006001791T5 Nicht-Punch-Through Hochspannungs-IGBT für Schaltnetzteile Non-Punch Through IGBT for high voltage switching power supplies
05/08/2008DE112006001777T5 Folienaufklebtisch Folienaufklebtisch
05/08/2008DE112006001705T5 Integrierter Komplementär-Metalloxid-Halbleiter-Schaltkreis unter Verwendung eines erhöhten Source-Drains und eines Ersatz-Metall-Gates Integrated complementary metal oxide semiconductor circuit using an increased source-drains and a replacement metal gates
05/08/2008DE112006001663T5 Halbleiterchip-Gehäuse und Verfahren zur Herstellung desselben The same semiconductor chip package and method for producing
05/08/2008DE112006001638T5 Struktur und Verfahren zum Bilden einer sich lateral erstreckenden Dielektrikumschicht in einem Trench-Gate-Fet Structure and method for forming a laterally extending dielectric layer in a trench gate FET
05/08/2008DE112006001397T5 Kohlenstoff-Nanoröhren-Verdrahtungskontakte Carbon nanotube interconnect contacts
05/08/2008DE10297636B4 Verfahren zum Steuern von Prozessanlagen in einer Halbleiterfertigungsfabrik #### A method for controlling process plants in a semiconductor manufacturing factory ####
05/08/2008DE10245249B4 Verfahren zum Herstellen eines Trenchtransistors A method of manufacturing a trench transistor
05/08/2008DE102007052011A1 Waferbearbeitungsverfahren Wafer processing method
05/08/2008DE102007051786A1 Laserbearbeitungsvorrichtung Laser processing apparatus
05/08/2008DE102007051177A1 Verfahren zur Herstellung einer Siliziumkarbid-Halbleitervorrichtung A process for producing a silicon carbide semiconductor device
05/08/2008DE102007051176A1 Verfahren zur Herstellung einer Siliziumkarbid-Halbleitervorrichtung A process for producing a silicon carbide semiconductor device
05/08/2008DE102007050610A1 Halbleitervorrichtung, Verdrahtung einer Halbleitervorrichtung und Verfahren zum Bilden einer Verdrahtung A semiconductor device, wiring of a semiconductor device and method of forming a wiring
05/08/2008DE102007046329A1 Substrat zum Befestigen eines Flip-Chips und Herstellungsverfahren desselben Of the same substrate for mounting a flip chip and manufacturing processes
05/08/2008DE102007043832A1 Elektronische Pakete mit Feinpartikel-Wetting- und Non-Wetting-Zonen Electronic Packages fine particle Wetting- and non-wetting zones
05/08/2008DE102007030805A1 Halbleitervorrichtung und Herstellungsverfahren derselben A semiconductor device and manufacturing method thereof
05/08/2008DE102007001077A1 Flash-Speichervorrichtung und Verfahren zum Herstellen derselben A flash memory device and method for manufacturing the same
05/08/2008DE102006056870A1 Integrierte Halbleitervorrichtung und Verfahren zum Herstellen einer integrierten Halbleitervorrichtung An integrated semiconductor device and method of fabricating an integrated semiconductor device
05/08/2008DE102006051942A1 Verfahren zur Messung des Schichtwiderstandes von mindestens zweischichtigen elektronischen Bauelementen über Trenngräben A method for measuring the sheet resistance of at least two-layer electronic components by means of isolating trenches
05/08/2008DE102006051607A1 Verfahren und Vorrichtung zum serienmäßigen Aufbringen und Befestigen von elektronischen Bauteilen auf Substraten Method and device for standard application and mounting electronic components on substrates
05/08/2008DE102006051597A1 Halbleiteranordnung und Verfahren zur Herstellung einer Halbleiteranordnung A semiconductor device and method of manufacturing a semiconductor device
05/08/2008DE102006051577A1 Vorrichtung und Verfahren zur Erfassung elektrischer Eigenschaften einer Probe aus einem anregbaren Material Apparatus and method for detecting electrical properties of a sample from a stimulable material
05/08/2008DE102006051557A1 Solar cells and/or wafers drying system, has transport device transporting solar cells that are to be dried by system, where device includes set of racks with receiving finger that is guided between rollers of conveyor belts
05/08/2008DE102006051556A1 Verfahren zum Strukturieren von Solarmodulen und Strukturierungsvorrichtung Method for structuring of solar modules and structuring device
05/08/2008DE102006051555A1 Verfahren zur Strukturierung eines Dünnschicht-Solarmoduls Method for structuring a thin-film solar module
05/08/2008DE102006051550A1 Verfahren und Vorrichtung zum Strukturieren von Bauteilen unter Verwendung eines Werkstoffs auf der Basis von Siliziumoxid Method and apparatus for patterning of components using a material based on silica
05/08/2008DE102006051496A1 Halbleiterbauelement mit einem porösen Materialschichtstapel mit kleinem ε mit reduzierter UV-Empfindlichkeit Semiconductor component with a porous material layer stack with small ε with reduced UV sensitivity
05/08/2008DE102006051495A1 Verfahren und System zur zufälligen Verteilung von Scheiben in einer komplexen Prozesslinie Method and system for random distribution of slices in a complex process line
05/08/2008DE102006051494A1 Verfahren zum Ausbilden einer Halbleiterstruktur, die einen Feldeffekt-Transistor mit verspanntem Kanalgebiet umfasst A method of forming a semiconductor structure comprising a field effect transistor having strained channel region
05/08/2008DE102006051493A1 System und Verfahren zur vertikalen Scheibenhandhabung in einer Prozesslinie System and method for vertical wafer handling in a process line
05/08/2008DE102006051492A1 Halbleiterbauelement mit NMOS- und PMOS-Transistoren mit eingebettetem Si/Ge-Material zum Erzeugen einer Zugverformung und einer Druckverformung A semiconductor device with NMOS and PMOS transistors with embedded Si / Ge material for generating a tensile strain and a compressive deformation
05/08/2008DE102006051490A1 Technik zur Herstellung einer Passivierungsschicht ohne ein Abschlussmetall Technology for the production of a passivation layer without a final metal
05/08/2008DE102006051199A1 Elektrisches Bauelement mit äußerer Kontaktierung Electrical component with external contact
05/08/2008DE102006051135A1 Connection quality test method, involves comparing reflected signals, which are produced in reaction to test signal or generated signals, with two threshold values, where one value differs from other value
05/08/2008DE102006050360A1 Herstellung eines elektrischen Kontakts auf SiC Making an electrical contact to SiC
05/08/2008DE102006041610B3 Metallisierte Kunststoffoberfläche und Verfahren zum Bearbeiten von metallisierten Kunststoffoberflächen Metallized plastic surface and method for processing of metallized plastic surfaces
05/08/2008DE102006028719B4 Halbleiterbauteil mit Halbleiterchipstapel und Verbindungselementen sowie Verfahren zur Herstellung des Halbleiterbauteils A semiconductor device comprising semiconductor chip stack, and connecting elements and processes for producing the semiconductor device
05/08/2008DE102005026944B4 Verfahren zum Herstellen einer Flash-Speichervorrichtung und mit dem Verfahren hergestellte Flash-Speicheranordnung A method of manufacturing a flash memory device and flash memory array produced by the method
05/08/2008DE102005010926B4 Deckel für optoelektronische Wafermaßstabsgehäuse und Verfahren zu dessen Herstellung Lid for optoelectronic wafer-scale housing and method for its production
05/08/2008DE102004063991A1 Lateraler Trenchtransistor sowie Verfahren zur Herstellung desselben Of the same lateral transistor trench and methods for preparing
05/08/2008DE10046782B4 Magnetisches Bauelement mit einem magnetischen Schichtsystem und dessen Verwendung Magnetic component with a magnetic layer system and its use
05/08/2008CA2750002A1 Compositions of doped, co-doped and tri-doped semiconductor materials
05/08/2008CA2667648A1 Ohmic electrode for sic semiconductor, method of manufacturing ohmic electrode for sic semiconductor, semiconductor device, and method of manufacturing semiconductor device
05/08/2008CA2667247A1 Method of manufacturing silicon carbide semiconductor device
05/07/2008EP1919079A1 Oscillator circuit and semiconductor device including the same
05/07/2008EP1918998A2 Single transistor memory cell and device and fabricating methods
05/07/2008EP1918991A2 Semiconductor device provided with low melting point metal bumps and process for producing same
05/07/2008EP1918990A1 Wafer holder for a semiconductor manufacturing apparatus
05/07/2008EP1918989A1 Circuit connection structure, method for manufacturing same, and semiconductor substrate for circuit connection structure
05/07/2008EP1918988A2 A semiconductor package manufacturing method and semiconductor apparatus
05/07/2008EP1918987A1 Method for manufacturing semiconductor device
05/07/2008EP1918986A2 MOS Device resistant to ionizing radiatiion
05/07/2008EP1918984A2 Charge-trapping device with cylindrical channel and method of manufacturing thereof
05/07/2008EP1918983A1 Stage apparatus and exposure apparatus
05/07/2008EP1918982A2 Substrate supporting member
05/07/2008EP1918981A2 Protective layer for charged-particle-beam processing
05/07/2008EP1918980A2 Semiconductor device and method of manufacturing the same
05/07/2008EP1918979A2 Etching oxide with high selectivity to titanium nitride
05/07/2008EP1918978A2 Mask etch plasma reactor with cathode providing a uniform distribution of etch rate
05/07/2008EP1918977A2 Workpiece rotation apparatus for a plasma reactor system
05/07/2008EP1918745A1 Process for manufacturing a slot waveguide
05/07/2008EP1918427A1 Metal oxide film, laminate, metal member and process for producing the same
05/07/2008EP1918417A1 Method of forming film and apparatus for film formation
05/07/2008EP1918415A1 Low dielectric constant material and method of processing by CVD
05/07/2008EP1918391A2 Metallic material, electroinic component, electronic device and electronic optical component manufactured by using the metallic material and working method of the metallic material
05/07/2008EP1918343A1 Adhesive sheet for water jet laser dicing
05/07/2008EP1918340A2 Polishing composition and polishing method
05/07/2008EP1918069A1 Double side polishing method for wafer
05/07/2008EP1917685A1 Memory device with barrier layer
05/07/2008EP1917679A2 Method for the manufacture of a strained silicon-on-insulator structure
05/07/2008EP1917678A2 Magnetic devices and techniques for formation thereof
05/07/2008EP1917677A1 Silicon surface preparation
05/07/2008EP1917676A2 Low-noise semiconductor photodetectors
05/07/2008EP1917675A2 Selection of wavelenghts for end point in a time division multiplexed process
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