Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
05/2008
05/15/2008US20080113458 Inspection method for protecting image sensor devices with front surface protection
05/15/2008US20080113457 Method of chip manufacturing
05/15/2008US20080113455 Planar etching of dissimilar materials
05/15/2008US20080113454 Processing systems and methods for semiconductor devices
05/15/2008US20080113453 Fabrication process of semiconductor device
05/15/2008US20080113352 Biochips; protein resistant polylysine-grafted-polyethylene glycol; integrated circuits
05/15/2008US20080113304 Pattern formation method
05/15/2008US20080113302 Pattern Forming Process
05/15/2008US20080113280 Creating method of photomask pattern data, photomask created by using the photomask pattern data, and manufacturing method of semiconductor apparatus using the photomask
05/15/2008US20080113186 Method for Growing Si-Ge Semiconductor Materials and Devices on Substrates
05/15/2008US20080113155 Nano transfer and nanoreplication using deterministically grown sacrificial nanotemplates
05/15/2008US20080113104 removing an oxide film from the surfaces of wafers, by conveying the wafer into vessels, then supplying nitrogen flouride gas, allowing the gas to react with the oxide film, to form a reaction-product film, heating to evaporate and remove the reaction-product film; sublimation; surface treatment
05/15/2008US20080112454 Self aligned diode fabrication method and self aligned laser diode
05/15/2008US20080112453 Group-III nitride based laser diode and method for fabricating same
05/15/2008US20080112452 Laser diode and method for fabricating same
05/15/2008US20080112442 Surface-emitting laser and method for producing the same
05/15/2008US20080112108 Method for forming mim in semiconductor device
05/15/2008US20080112037 Hermetic sealing of micro devices
05/15/2008US20080112035 Methods and devices for inhibiting tilting of a movable element in a mems device
05/15/2008US20080111980 Exposure apparatus equipped with interferometer and exposure apparatus using the same
05/15/2008US20080111959 Trans-reflective liquid crystal display and manufacturing method thereof
05/15/2008US20080111956 Thin film transistor substrate capable of avoiding aperture reduction
05/15/2008US20080111935 Pixel structure and fabricating method thereof
05/15/2008US20080111934 Tft-lcd array substrate and manufacturing method thereof
05/15/2008US20080111907 Imaging module and method of manufacturing imaging module
05/15/2008US20080111578 Device for Measurement and Analysis of Electrical Signals of an Integrated Circuit Component
05/15/2008US20080111577 Integrated Substrate Transfer Module
05/15/2008US20080111494 Organic light emitting display device and manufacturing the same
05/15/2008US20080111251 Method of manufacturing an electronic component comprising an integrated circuit and a winding assembly
05/15/2008US20080111250 Structure and method for enhancing resistance to fracture of bonding pads
05/15/2008US20080111249 Semiconductor device and method for manufacturing same
05/15/2008US20080111248 Flip Chip And Wire Bond Semiconductor Package
05/15/2008US20080111247 Electronic device and method of fabricating the same
05/15/2008US20080111244 Copper-metallized integrated circuits having an overcoat for protecting bondable metal contacts and improving mold compound adhesion
05/15/2008US20080111243 High performance system-on-chip using post passivation process
05/15/2008US20080111241 Semiconductor device and manufacturing method thereof
05/15/2008US20080111240 Semiconductor Device and Method for Fabricating the Same
05/15/2008US20080111239 Interconnect structure having enhanced electromigration reliabilty and a method of fabricating same
05/15/2008US20080111238 Integrated circuit processing system
05/15/2008US20080111237 Semiconductor device manufactured using an electrochemical deposition process for copper interconnects
05/15/2008US20080111235 Semiconductor device and method of manufacturing the same
05/15/2008US20080111234 Electronic assembly with hot spot cooling
05/15/2008US20080111233 Semiconductor package with embedded die
05/15/2008US20080111231 Semiconductor Device Comprising a Housing and a Semiconductor Chip Partly Embedded in a Plastic Housing Composition, and Method for Producing the Same
05/15/2008US20080111230 Wiring film having wire, semiconductor package including the wiring film, and method of fabricating the semiconductor package
05/15/2008US20080111229 Semiconductor package and method for manufacturing the same
05/15/2008US20080111228 Wafer Level Chip Size Packaged Chip Device With An N-Shape Junction Inside And Method Of Fabricating The Same
05/15/2008US20080111227 Semiconductor package structure for vertical mount and method
05/15/2008US20080111224 Multi stack package and method of fabricating the same
05/15/2008US20080111221 Radiation Hardened Lateral MOSFET Structure
05/15/2008US20080111219 Package designs for vertical conduction die
05/15/2008US20080111217 Integrated circuit package system with heat sink
05/15/2008US20080111216 Component arrangement comprising a carrier
05/15/2008US20080111215 Integrated circuit package system
05/15/2008US20080111214 Hybrid orientation substrate and method for fabrication thereof
05/15/2008US20080111212 Capacitance structure of a semiconductor device and method for manufacturing the same
05/15/2008US20080111209 Semiconductor device and its manufacturing method
05/15/2008US20080111208 Semiconductor devices having a gate electrode and methods of fabricating the same
05/15/2008US20080111207 High-Voltage Semiconductor Device and Method of Fabricating the Same
05/15/2008US20080111206 Substrate with Two Sided Doping and Method of Producing the Same
05/15/2008US20080111204 Image sensor and method for manufacturing the same
05/15/2008US20080111203 Wafer-level packaging of micro devices
05/15/2008US20080111201 Semiconductor device and method for manufacturing the same
05/15/2008US20080111200 Forming conductive stud for semiconductive devices
05/15/2008US20080111199 Semiconductor device having a pair of fins and method of manufacturing the same
05/15/2008US20080111198 Stacked semiconductor device and method of manufacturing the same
05/15/2008US20080111197 Semiconductor device including a misfet having divided source/drain regions
05/15/2008US20080111196 Semiconductor device having a contact pad
05/15/2008US20080111194 Semiconductor device including a finfet
05/15/2008US20080111192 High-voltage-withstanding semiconductor device and fabrication method thereof
05/15/2008US20080111190 Integration of a floating body memory on SOI with logic transistors on bulk substrate
05/15/2008US20080111187 Semiconductor memory device and manufacturing method thereof
05/15/2008US20080111186 Field-Effect Transistor Structure and Method Therefor
05/15/2008US20080111185 Asymmetric multi-gated transistor and method for forming
05/15/2008US20080111184 PROCESS FOR FABRICATION OF FINFETs
05/15/2008US20080111183 Flash memory device and method of manufacturing the same
05/15/2008US20080111181 Nonvolatile memory devices, methods of operating the same and methods of forming the same
05/15/2008US20080111179 Semiconductor device including transistor with composite gate structure and transistor with single gate structure, and method for manufacturing the same
05/15/2008US20080111178 Nonvolatile semiconductor memory device and method for manufacturing the same
05/15/2008US20080111177 Non-volatile memory cell and non-volatile memory device using said cell
05/15/2008US20080111175 Method for etching single-crystal semiconductor selective to amorphous/polycrystalline semiconductor and structure formed by same
05/15/2008US20080111174 Memory device and a method of manufacturing the same
05/15/2008US20080111173 Semiconductor device and method for manufacturing the same
05/15/2008US20080111172 Semiconductor device and method for manufacturing the same
05/15/2008US20080111171 Node structures under capacitor in ferroelectric random access memory device and methods of forming the same
05/15/2008US20080111168 Transistor and method for manufacturing same
05/15/2008US20080111166 Removable spacer
05/15/2008US20080111164 via is formed of one or more cylindrical structures made up of carbon nanotubes; good resistance to migration causing the breaking of a wiring line, and having improved reliability
05/15/2008US20080111163 Field effect transistor with a fin structure
05/15/2008US20080111162 Structure and method for dual surface orientations for cmos transistors
05/15/2008US20080111159 Image sensor including spatially different active and dark pixel interconnect patterns
05/15/2008US20080111157 High electron mobility transistor semiconductor device and fabrication method thereof
05/15/2008US20080111156 High Performance FET Devices and Methods Thereof
05/15/2008US20080111155 Electronic device including a transistor having a metal gate electrode and a process for forming the electronic device
05/15/2008US20080111154 INTEGRATION OF A SiGe- OR SiGeC-BASED HBT WITH A SiGe- OR SiGeC-STRAPPED SEMICONDUCTOR DEVICE
05/15/2008US20080111153 Electronic device including a heterojunction region and a process for forming the electronic device
05/15/2008US20080111151 Power Module, Method of Producing Same, and Air Conditioner
05/15/2008US20080111147 Phosphor-Converted LED Devices Having Improved Light Distribution Uniformity
05/15/2008US20080111146 Standing transparent mirrorless light emitting diode
05/15/2008US20080111144 LIGHT EMITTING DIODE AND LASER DIODE USING N-FACE GaN, InN, AND AlN AND THEIR ALLOYS