Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
05/2008
05/08/2008WO2008053524A1 Semiconductor inspecting apparatus and semiconductor inspecting method
05/08/2008WO2008053512A1 Semiconductor inspecting apparatus
05/08/2008WO2008053079A1 Method and arrangement for manufacturing optical products with complex three-dimensional forms
05/08/2008WO2008053042A1 Removal of impurities from semiconductor device layers
05/08/2008WO2008052637A1 Printable medium for etching of oxidic, transparent and conducting layers
05/08/2008WO2008052636A1 Etching paste containing particles for silicon surfaces and layers
05/08/2008WO2008052594A1 Device for positioning and/or pressing a planar component relative to a substrate and method for positioning a picking tool relative to a substrate
05/08/2008WO2008052462A1 Light emitting diode device, method of fabrication and use thereof
05/08/2008WO2008052424A1 A cleaning compound for removing photoresist
05/08/2008WO2008033886A3 Method and system for dry etching a hafnium containing material
05/08/2008WO2008033878A3 Enhanced local interconnects employing ferroelectric electrodes
05/08/2008WO2008030802A3 Method for fabricating high-speed thin-film transistors
05/08/2008WO2008022277A3 Selective chemistry for fixed abrasive cmp
05/08/2008WO2008008764A3 Oxide isolated metal silicon-gate jfet
05/08/2008WO2008008758A3 An interconnect structure with dielectric air gaps
05/08/2008WO2008008753A3 A method for fabricating a gate dielectric layer utilized in a gate structure
05/08/2008WO2008005756A3 Apparatus for substrate processing and methods therefor
05/08/2008WO2008005630B1 Methods for minimizing mask undercuts and notches for plasma processing system
05/08/2008WO2008005412A3 Ultrashallow semiconductor contact by outdiffusion from a solid source
05/08/2008WO2008002780B1 Batch processing platform for ald and cvd
05/08/2008WO2007149991A3 Dielectric deposition and etch back processes for bottom up gapfill
05/08/2008WO2007148223A3 Antireflective coating compositions comprising siloxane polymer
05/08/2008WO2007142910A3 Producing soi structure using high-purity ion shower
05/08/2008WO2007142894A3 Apparatus and method of forming a mosfet with atomic layer deposited gate dielectric
05/08/2008WO2007142865A3 Thin film photovoltaic structure and fabrication
05/08/2008WO2007130729A3 Method of forming a semiconductor device and structure thereof
05/08/2008WO2007117546A3 Substrate cassette
05/08/2008WO2007103643A3 Method and apparatus for thermal processing structures formed on a substrate
05/08/2008US20080109755 Scanning electron microscope with measurement function
05/08/2008US20080109089 Dynamic metrology schemes and sampling schemes for advanced process control in semiconductor processing
05/08/2008US20080108516 Synthesis of chemical tags
05/08/2008US20080108288 Conductive Polishing Article for Electrochemical Mechanical Polishing
05/08/2008US20080108229 Manufacturing Method of Semiconductor Device
05/08/2008US20080108228 Device having enhanced stress state and related methods
05/08/2008US20080108227 Method for producing single electron semiconductor element
05/08/2008US20080108226 Method of fabricating thin film transistor substrate and thin film transistor substrate produced using the same
05/08/2008US20080108225 Low temperature aerosol deposition of a plasma resistive layer
05/08/2008US20080108224 Patterning methods
05/08/2008US20080108223 Integrated Etch and Supercritical CO2 Process and Chamber Design
05/08/2008US20080108222 Method for forming pattern in semiconductor device
05/08/2008US20080108221 Microprobe Tips and Methods for Making
05/08/2008US20080108220 Interconnect structure with a barrier-redundancy feature
05/08/2008US20080108219 Semiconductor interconnect and method of making same
05/08/2008US20080108218 Low viscosity precursor compositions and methods for the deposition of conductive electronic features
05/08/2008US20080108217 Esd protection for passive integrated devices
05/08/2008US20080108216 Method for forming contact in semiconductor device
05/08/2008US20080108215 Integrated circuit interconnect lines having reduced line resistance
05/08/2008US20080108214 Threshold voltage targeting in carbon nanotube devices and structures formed thereby
05/08/2008US20080108213 Multi-layer nonvolatile memory devices and methods of fabricating the same
05/08/2008US20080108212 High voltage vertically oriented eeprom device
05/08/2008US20080108211 Method for producing semiconductor device
05/08/2008US20080108210 Low temperature process for depositing a high extinction coefficient non-peeling optical absorber for a scanning laser surface anneal of implanted dopants
05/08/2008US20080108209 Method of forming pn junctions including a post-ion implant dynamic surface anneal process with minimum interface trap density at the gate insulator-silicon interface
05/08/2008US20080108208 Techniques for forming shallow junctions
05/08/2008US20080108207 Silicon semiconductor substrate and production method thereof
05/08/2008US20080108206 Method for manufacturing semiconductor device
05/08/2008US20080108205 Semiconductor device and method for manufacturing the same
05/08/2008US20080108204 Amorphization/templated recrystallization method for hybrid orientation substrates
05/08/2008US20080108203 Multi-Layer Electrode and Method of Forming the Same
05/08/2008US20080108202 Precision high-frequency capacitor formed on semiconductor substrate
05/08/2008US20080108201 Configurable Integrated Circuit Capacitor Array Using Via Mask Layers
05/08/2008US20080108200 Process for self-aligned manufacture of integrated electronic devices
05/08/2008US20080108199 Method of forming an integrated circuit including a transistor
05/08/2008US20080108198 Transistor structures and methods for making the same
05/08/2008US20080108197 Method of fabricating non-volatile flash memory device having at least two different channel concentrations
05/08/2008US20080108196 High Performance FET Devices and Methods Thereof
05/08/2008US20080108195 Fabrication process of memory cell
05/08/2008US20080108194 Memory device and manufacturing method thereof
05/08/2008US20080108193 Cu annealing for improved data retention in flash memory devices
05/08/2008US20080108192 Method for fabricating non-volatile memory cells
05/08/2008US20080108191 Memory device with surface-channel peripheral transistors
05/08/2008US20080108190 SiC MOSFETs and self-aligned fabrication methods thereof
05/08/2008US20080108189 Transistor having field plate
05/08/2008US20080108188 T-gate forming method for high electron mobility transistor and gate structure thereof
05/08/2008US20080108187 Thin film transistor array panel and method for fabricating the same
05/08/2008US20080108186 Method of providing protection against charging damage in hybrid orientation transistors
05/08/2008US20080108185 Multilayer silicon over insulator device
05/08/2008US20080108184 Planar substrate with selected semiconductor crystal orientations formed by localized amorphization and recrystallization of stacked template layers
05/08/2008US20080108183 Method for manufacturing dynamic random access memory
05/08/2008US20080108182 Method for fabricating semiconductor package free of substrate
05/08/2008US20080108181 Method for attaching integrated circuit component to a substrate
05/08/2008US20080108180 Nanoparticle filled underfill
05/08/2008US20080108179 Stackable molded packages and methods of making the same
05/08/2008US20080108178 Thermoplastic fluxing underfill method
05/08/2008US20080108177 Semiconductor Device
05/08/2008US20080108176 Phase change memory and fabricating method thereof
05/08/2008US20080108174 Methods of manufacturing a phase change memory device, in which fine contact holes can be filled stably, with little to no void formation, using metal precursor for low temperature deposition, wherein the metal is germanium, antimony, or tellurium
05/08/2008US20080108171 Release strategies for making transferable semiconductor structures, devices and device components
05/08/2008US20080108170 Cmos imager with cu wiring and method of eliminating high reflectivity interfaces therefrom
05/08/2008US20080108168 Structure of image sensor module and method for manufacturing of wafer level package
05/08/2008US20080108167 Solid state image pickup device and method of producing solid state image pickup DMCE
05/08/2008US20080108165 Anchors for microelectromechanical systems having an SOI substrate, and method of fabricating same
05/08/2008US20080108164 Sensor System and Method
05/08/2008US20080108163 Microelectromechanical system device and method for preparing the same for subsequent processing
05/08/2008US20080108162 Light-Emitting Device Structure Using Nitride Bulk Single Crystal Layer
05/08/2008US20080108160 Semiconductor Light Emitting Device, Its Manufacturing Method, Semiconductor Device and Its Manufacturing Method
05/08/2008US20080108159 Method for Producing Color-Converting Light-Emitting Device Using Electrophoresis
05/08/2008US20080108157 Method for manufacturing a display device
05/08/2008US20080108156 Method for fabricating led lamp and high-output led fabricated by using the method
05/08/2008US20080108155 Method For Evaluating Dopant Contamination Of Semiconductor Wafer
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