Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
05/2008
05/01/2008US20080102642 Method of seasoning idle silicon nitride etcher and method of activating
05/01/2008US20080102641 Grayscale reticle for precise control of photoresist exposure
05/01/2008US20080102640 Etching oxide with high selectivity to titanium nitride
05/01/2008US20080102639 Method for fabricating semiconductor device with recess gate
05/01/2008US20080102638 Etch depth control for dual damascene fabrication process
05/01/2008US20080102637 Method and semiconductor structure for reliability characterization
05/01/2008US20080102636 Method for manufacturing semiconductor device
05/01/2008US20080102635 Chemical-mechanical polishing method
05/01/2008US20080102634 Sacrificial CMP etch stop layer
05/01/2008US20080102633 Method for manufacturing semiconductor device and semiconductor device
05/01/2008US20080102632 Deposition process for iodine-doped ruthenium barrier layers
05/01/2008US20080102631 Chemical dissolution of barrier and adhesion layers
05/01/2008US20080102630 Method of manufacturing semiconductor device
05/01/2008US20080102629 Systems and methods of forming tantalum silicide layers
05/01/2008US20080102628 Method for manufacturing semiconductor device
05/01/2008US20080102627 Semiconductor Scheme for Reduced Circuit Area in a Simplified Process
05/01/2008US20080102626 Method of forming copper wiring in semiconductor device
05/01/2008US20080102625 Method for producing a layer arrangement
05/01/2008US20080102624 Method of fabricating semiconductor device with recess gate
05/01/2008US20080102623 Semiconductor device manufacturing method
05/01/2008US20080102622 Method of forming metal line in semiconductor device
05/01/2008US20080102621 Methods of fabricating a barrier layer with varying composition for copper metallization
05/01/2008US20080102620 Solder ball mounting method and solder ball mounting substrate manufacturing method
05/01/2008US20080102619 Method of manufacturing a semiconductor device
05/01/2008US20080102618 Method of manufacturing semiconductor device
05/01/2008US20080102617 Method of Fabricating Flash Memory Device
05/01/2008US20080102616 Semiconductor device having a gate insulating film structure including an insulating film containing metal, silicon and oxygen and manufacturing method thereof
05/01/2008US20080102615 Method of forming semiconductor device
05/01/2008US20080102614 Method for forming semiconductor device
05/01/2008US20080102613 Controlled composition using plasma-enhanced atomic layer deposition
05/01/2008US20080102612 Silicided polysilicon spacer for enhanced contact area
05/01/2008US20080102611 Method for fabricating a polysilicon layer having large and uniform grains
05/01/2008US20080102610 Method of controlling stress in gallium nitride films deposited on substrates
05/01/2008US20080102609 Method for producing a wired circuit board
05/01/2008US20080102608 Producing method of wired circuit board
05/01/2008US20080102607 Iii-v compound semiconductor device with a surface layer in access regions having charge of polarity opposite to channel charge and method of making the same
05/01/2008US20080102606 Wafer dividing method and apparatus
05/01/2008US20080102605 Method and Apparatus for Forming a Silicon Wafer
05/01/2008US20080102604 Electrical die contact structure and fabrication method
05/01/2008US20080102603 Method for Producing Direct Bonded Wafer and Direct Bonded Wafer
05/01/2008US20080102602 Structure of strained silicon on insulator and method of manufacturing the same
05/01/2008US20080102601 Method for producing a semiconductor substrate
05/01/2008US20080102600 Manufacturing method of high voltage semiconductor device
05/01/2008US20080102599 Reduced leakage interconnect structure
05/01/2008US20080102598 III-Nitride wafer fabrication
05/01/2008US20080102597 Method for Preparing a Gate Oxide Layer
05/01/2008US20080102596 Methods of Forming Semiconductor Structures
05/01/2008US20080102595 Etching method for manufacturing semiconductor device
05/01/2008US20080102594 Method for forming semiconductor memory capacitor without cell-to-cell bridges
05/01/2008US20080102593 Method for fabricating a semiconductor structure
05/01/2008US20080102592 Method for manufacturing bipolar transistor
05/01/2008US20080102591 Method of manufacturing silicon carbide semiconductor device
05/01/2008US20080102590 Method of forming a semiconductor structure comprising a field effect transistor having a stressed channel region
05/01/2008US20080102589 Method of manufacturing semiconductor device
05/01/2008US20080102588 Method for forming mos transistor
05/01/2008US20080102587 Method of manufacturing high voltage device
05/01/2008US20080102586 Phosphorous doping methods of manufacturing field effect transistors having multiple stacked channels
05/01/2008US20080102585 Method of manufacturing silicon carbide semiconductor device
05/01/2008US20080102584 Structure and Method for Improved Heat Conduction for Semiconductor Devices
05/01/2008US20080102583 Spacer-less transistor integration scheme for high-k gate dielectrics and small gate-to-gate spaces applicable to si, sige and strained silicon schemes
05/01/2008US20080102582 Manufacturing method of a super-junction semiconductor device
05/01/2008US20080102581 High-voltage vertical transistor with a multi-gradient drain doping profile
05/01/2008US20080102580 Method for fabricating semiconductor device
05/01/2008US20080102579 Method of forming isolation layer of semiconductor device
05/01/2008US20080102578 Manufacturing method for an integrated semiconductor structure
05/01/2008US20080102577 Method for Preparing a Trench Capacitor Structure
05/01/2008US20080102576 Semiconductor device and manufacturing method thereof
05/01/2008US20080102575 Method of manufacturing semiconductor device
05/01/2008US20080102574 Manufacturing method of semiconductor device
05/01/2008US20080102573 CMOS device with raised source and drain regions
05/01/2008US20080102572 Manufacturing method of semiconductor device
05/01/2008US20080102571 Methods for fabricating a stress enhanced mos transistor
05/01/2008US20080102570 Fin field emission transistor apparatus and processes
05/01/2008US20080102569 Method of fabricating vertical body-contacted SOI transistor
05/01/2008US20080102568 Soi bipolar transistors with reduced self heating
05/01/2008US20080102567 Method for making thin film transistor
05/01/2008US20080102566 Multiple layer and crystal plane orientation semiconductor substrate
05/01/2008US20080102565 Substrate with lossy material insert
05/01/2008US20080102564 Method For Cooling A Semiconductor Device
05/01/2008US20080102563 Non-Pull Back Pad Package with an Additional Solder Standoff
05/01/2008US20080102562 Method of making multi-chip electronic package with reduced line skew
05/01/2008US20080102561 Methods of manufacturing printed circuit board assembly
05/01/2008US20080102558 Closely Spaced, High-Aspect Extruded Gridlines
05/01/2008US20080102557 Method of forming an isolation layer and method of manufacturing an image device using the same
05/01/2008US20080102556 Method of manufacturing complementary metal oxide semiconductor image sensor
05/01/2008US20080102554 Solid state image pickup device and method of producing solid state image pickup device
05/01/2008US20080102553 Stabilizing an opened carbon hardmask
05/01/2008US20080102552 Wafer level method of locating focal plane of imager devices
05/01/2008US20080102551 Cmos image sensor and method of fabricating the same
05/01/2008US20080102550 Thin film transistor using a metal induced crystallization process and method for fabricating the same and active matrix flat panel display using the thin film transistor
05/01/2008US20080102548 Liquid crystal display device
05/01/2008US20080102544 Optical module producing method and apparatus
05/01/2008US20080102543 Increasing an electrical resistance of a resistor by oxidation
05/01/2008US20080102542 Wafer processing method
05/01/2008US20080102541 Method for manufacturing light emitting diode chip and light emitting diode light source module
05/01/2008US20080102540 Technique for forming a passivation layer without a terminal metal
05/01/2008US20080102539 Wire-bonding method for wire-bonding apparatus
05/01/2008US20080102538 Apparatus and Method For Controlling Relative Particle Concentrations In A Plasma
05/01/2008US20080102409 Inductor for a system-on-a-chip and a method for manufacturing the same
05/01/2008US20080102383 photomasks comprising a non-phase shifting, phase shifting and opaque segemnts, for use in photolithography to produce patterns having a very fine pitch
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