Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
05/2008
05/14/2008CN101179015A Preparation of InN/germanium or InN/silicon thin film with InN material as substrate or cushion breaker and preparation method
05/14/2008CN101179014A Method for manufacturing semiconductor substrate
05/14/2008CN101179013A Preparation method of self slow-release metal inducing crystallization polycrystalline silicon thin film material and applications
05/14/2008CN101179012A Method for manufacturing semiconductor device
05/14/2008CN101179011A Method of forming a cell identification, display substrate and display device having the same
05/14/2008CN101179010A Process chamber having gate slit opening and closing apparatus
05/14/2008CN101179009A Jet cleaning method and device
05/14/2008CN101179008A Substrate processing apparatus and analysis method therefor
05/14/2008CN101179007A Ultrasonic cleaning monocrystalline silicon piece method and device thereof
05/14/2008CN101179006A Method for protecting an alignment mark
05/14/2008CN101179005A Exhaust air system, semi-conductor manufacturing installation for manufacturing thin film by the same and method thereof
05/14/2008CN101178582A Power controller in semi-conductor production facility and method
05/14/2008CN101178549A Method for removing photoresist layer and method for forming opening
05/14/2008CN101178547A Lithography apparatus and device manufacturing method
05/14/2008CN101178546A Image portrayal device and method
05/14/2008CN101178543A Absorption workbench and base plate treating apparatus
05/14/2008CN101178537A Asymmetric high-pressure MOS component grid oxidizing layer protection method and uses thereof
05/14/2008CN101178527A Semi-penetrate through type liquid crystal display board and pixel structure thereof
05/14/2008CN101178502A Lift pin driving device and a flat panel display manufacturing apparatus having same
05/14/2008CN101178500A Conveying clamp for substrate assembling device and conveying method
05/14/2008CN101178490A Method of manufacturing an electro-optical device
05/14/2008CN101178419A Integrate circuit system pressing impedance detection method
05/14/2008CN101178368A Infrared penetrating image forming apparatus for detecting bonding quality and regulating method
05/14/2008CN101178328A Gas flow rate control device verify method
05/14/2008CN101178327A Gas flow rate calibrating method
05/14/2008CN101177603A Polishing composition and polishing method
05/14/2008CN101177602A Lapping liquid
05/14/2008CN101177598A Adhesive sheet for water jet laser dicing
05/14/2008CN101177597A Adhesive sheet for water jet laser dicing
05/14/2008CN101177592A Composition for polishing
05/14/2008CN101177336A Aluminium-manganese glass powder and its application in a-Al2O3 single crystal wafer
05/14/2008CN101177234A Electronic device and method for manufacturing thereof
05/14/2008CN101177199A Resonance type high-speed high-precision multi-station turning table
05/14/2008CN101176988A Endpoint detection for electro chemical mechanical polishing and electropolishing processes
05/14/2008CN101176984A Method for effectively controlling useful time of grinding pad
05/14/2008CN100388759C Imaging apparatus and device
05/14/2008CN100388636C Semiconductor thin film and method of manufacturing the same and semiconductor device and method of manufacturing the same
05/14/2008CN100388575C Method for making structure of wedge chamber and parallel chamber in indium phosphide based photoelectronic device
05/14/2008CN100388518C Nitride-based compound semiconductor light emitting device
05/14/2008CN100388517C Nitride-based compound semiconductor light emitting device and fabricating method thereof
05/14/2008CN100388508C Thin film transistor and method for fabricating the same
05/14/2008CN100388507C Thin film transistor, method of fabricating the same, and flat panel display using thin film transistor
05/14/2008CN100388506C Contact structure of a wires and method manufacturing the same, and thin film transistor substrate including the contact structure and method manufacturing the same
05/14/2008CN100388505C Semiconductor device and method of manufacturing the same
05/14/2008CN100388504C High voltage LDMOS transistor having an isolated structure
05/14/2008CN100388502C Method of manufacturing displays and apparatus for manufacturing displays
05/14/2008CN100388501C NAND gate type flash memory cell array and producing method thereof
05/14/2008CN100388500C Three-dimensional read-only memory integrated circuit
05/14/2008CN100388499C Memory cell design with vertically stacked crossovers
05/14/2008CN100388498C Semiconductor device and method of manufacturing the same
05/14/2008CN100388497C Metal thin film and method of manufacturing the same, dielectric capacitor and method of manufacturing the same, and semiconductor memory device
05/14/2008CN100388496C Semiconductor device
05/14/2008CN100388494C System and method of heat dissipation in semiconductor devices
05/14/2008CN100388493C Semiconductor device
05/14/2008CN100388492C Semiconductor integrated circuit for controlling output impedance and conversion speed
05/14/2008CN100388490C Thin film transistor array substrate and fabricating method thereof
05/14/2008CN100388488C Semiconductor integrated circuit devices having a hybrid dielectric layer and methods of fabricating the same
05/14/2008CN100388485C Resin sealing semiconductor device and producing method thereof
05/14/2008CN100388482C Semiconductor device and switching element
05/14/2008CN100388480C Thin film in low dielectric constant and fabricating method
05/14/2008CN100388479C Buried digit line stack and process for making same
05/14/2008CN100388478C Semiconductor device
05/14/2008CN100388477C Interconnection structure and its forming method
05/14/2008CN100388476C Semiconductor device with multi-layered wiring arrangement including reinforcing patterns, and production method for manufacturing such semiconductor device
05/14/2008CN100388469C 电路装置及其制造方法 Circuit device and manufacturing method thereof
05/14/2008CN100388468C Holder and mask structure, interconnected circuit structure and its manufacturing method
05/14/2008CN100388467C Semiconductor package and producing method thereof and semiconductor device
05/14/2008CN100388466C IC and its manufacturing method
05/14/2008CN100388465C Method for forming a semiconductor device
05/14/2008CN100388464C Method for forming a semiconductor device
05/14/2008CN100388463C Method for manufacturing precision silicon-containing resistor
05/14/2008CN100388462C Method of protecting cmos from electrostatic discharge effect
05/14/2008CN100388461C Device having dual etch stop liner and protective layer and related methods
05/14/2008CN100388460C Method for repairing thin film transistor wire on display panel
05/14/2008CN100388459C Aluminum etching process for controlling key size and its deviation
05/14/2008CN100388458C Electrostatic chuck
05/14/2008CN100388457C Vacuum mechanical-arm
05/14/2008CN100388456C Vacuum lock transitional cavity
05/14/2008CN100388455C Guide track transmissioner of crystal-boat box with safety baffle
05/14/2008CN100388454C Testing device and testing method of a semiconductor device
05/14/2008CN100388453C Method and system for inspecting semiconductor defect
05/14/2008CN100388452C Device and method for detecting the overheating of a semiconductor device
05/14/2008CN100388451C Defect detection method
05/14/2008CN100388450C Evaluation method of semiconductor device, its mfg. method and design management system
05/14/2008CN100388449C Substrate having a plurality of bumps, method of forming the same, and method of bonding substrate to another
05/14/2008CN100388448C Wafer-grade packing method
05/14/2008CN100388447C Semiconductor structured chip embedded structure of base plate and method of preparation
05/14/2008CN100388446C Sticking and positioning technology based system and method for chip substrate packaging
05/14/2008CN100388445C Method for manufacturing large power MOS tube with small wire wide slot type structure
05/14/2008CN100388444C Method for reducing injecting hot carrier of I/O NMOS device
05/14/2008CN100388443C Method for fabricating a thin film semiconductor device
05/14/2008CN100388442C Method for producing high-voltage assembly capable of improving assembly characteristic
05/14/2008CN100388441C Method for manufacturing double-diffused drain electrode
05/14/2008CN100388440C Manufacturing method of semiconductor transistor element with supershallow connection surface drain/source expansion
05/14/2008CN100388439C Method for depositing silicide on silicon substrate
05/14/2008CN100388438C Fabrication process of a semiconductor device
05/14/2008CN100388437C Etching method for 0.18 micrometre contact hole
05/14/2008CN100388436C Metal fuse structure of semiconductor assembly part and its manufacturing method
05/14/2008CN100388435C Semiconductor structure and method for manufacturing semiconductor structure
05/14/2008CN100388434C Substrate supporting structure for semiconductor processing, and plasma processing device
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