Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
05/2008
05/06/2008US7368229 Composite layer method for minimizing PED effect
05/06/2008US7368226 Method for forming fine patterns of semiconductor device
05/06/2008US7368209 Method for evaluating sensitivity of photoresist, method for preparation of photoresist and manufacturing method of semiconductor device
05/06/2008US7368206 Forming first separated features on a surface, forming second separated features on surface interleaved between first separated features, and illuminating first and second separated features and detecting an interference pattern
05/06/2008US7368204 Includes a transmissive portion defining a crystallization pattern and an alignment pattern, and a shielding portion surrounding the transmissive portion; use making an liquid crystal display (LCD) device where a driving circuit and a pixel thin film transistor are formed on a single substrate
05/06/2008US7368172 epitaxial growth on semiconductor while keeping conformity; increased polarization; thin layer of zirconium oxide and a layer having a simple perovskite structure; ferroelectric
05/06/2008US7368166 Polymerase chain reaction using metallic glass-coated microwire
05/06/2008US7368067 P-type zinc oxide semiconductor film and process for preparation thereof
05/06/2008US7368064 Hydrofluoric acid, ammonium fluoride, or amine fluoride; chelating agent (ammonium malonate, glycolate, tartrate or citrate); carboxylic ammonium salt having acid dissociation constant pKan of 2.5 or greater at 25 degrees C.; water; for cleaning a substrate on which a nickel silicide layer is formed
05/06/2008US7368030 Intermediate suction support and its utilisation for producing a thin film structure
05/06/2008US7368020 Reduced particle contamination manufacturing and packaging for reticles
05/06/2008US7368018 Chemical vapor deposition apparatus
05/06/2008US7368017 Method and apparatus for semiconductor wafer planarization
05/06/2008US7368016 Substrate processing unit and substrate processing apparatus
05/06/2008US7368014 Variable temperature deposition methods
05/06/2008US7367873 Substrate processing apparatus
05/06/2008US7367871 Semiconductor processing methods of removing conductive material
05/06/2008US7367870 Polishing fluid and polishing method
05/06/2008US7367865 Methods for making wafers with low-defect surfaces, wafers obtained thereby and electronic components made from the wafers
05/06/2008US7367845 Modular sockets using flexible interconnects
05/06/2008US7367769 Semiconductor production system, cluster tool, control method of semiconductor production system and maintenance method of cluster tool
05/06/2008US7367710 Developing solution supply nozzle with stirrer
05/06/2008US7367489 Method and apparatus for flip chip attachment by post collapse re-melt and re-solidification of bumps
05/06/2008US7367446 Methods and apparatus for transporting substrate carriers
05/06/2008US7367350 Processing device and method of maintaining the device
05/06/2008US7367344 Atmospheric pressure non-thermal plasma device to clean and sterilize the surfaces of probes, cannulas, pin tools, pipettes and spray heads
05/06/2008US7367281 Plasma antenna
05/06/2008US7367252 Integrated circuit package separators
05/06/2008US7367196 Spinning cold plasma apparatus and methods relating thereto
05/06/2008US7367135 Vacuum processing apparatus and operating method therefor
05/06/2008CA2447282C Support with integrated deposit of gas absorbing material for manufacturing microelectronic, microoptoelectronic or micromechanical devices
05/02/2008WO2008052102A2 Deposition analysis for robot motion correction
05/02/2008WO2008052017A2 Flexible fingerprint sensor
05/02/2008WO2008051883A2 Debris management for wafer sungulation
05/02/2008WO2008051880A2 Method and apparatus for sample extraction and handling
05/02/2008WO2008051853A2 High density ic module
05/02/2008WO2008051717A1 Temperature controlled multi-gas distribution assembly
05/02/2008WO2008051675A1 Solid state field emission charge storage
05/02/2008WO2008051674A2 Electrical fuse and method of making the same
05/02/2008WO2008051656A1 Magnetic tunnel junction memory and method with etch-stop layer
05/02/2008WO2008051544A1 Improved calibration of a substrate handling robot
05/02/2008WO2008051454A1 Solid-phase mediated synthesis of molecular microarrays
05/02/2008WO2008051415A1 Method of manufacturing stacked chip packages
05/02/2008WO2008051390A1 Metal substrate having electronic devices formed thereon
05/02/2008WO2008051369A2 Low-cost electrostatic clamp with fast declamp time and the manufacture
05/02/2008WO2008051359A1 Apparatus and method for substrate electroless plating
05/02/2008WO2008051324A2 Semiconductor wafer suitable for forming a semiconductor junction diode device and method of forming same
05/02/2008WO2008051308A2 A nanopore particle analyzer, method of preparation and use thereof
05/02/2008WO2008051172A2 METHOD FOR PRODUCING CUBICAL GaN FILMS ON SUBTRACTS OF A POROUS GaAs LAYER
05/02/2008WO2008051058A1 Apparatus for sorting semiconductor device
05/02/2008WO2008050954A1 Memory module handler with automatic spacing aligner and picker spacing adjusting method using the same
05/02/2008WO2008050886A1 Bis(aminophenol) derivative, process for producing the same, polyamide resin, positive photosensitive resin compositions, protective film, interlayer dielectric, semiconductor device, and display element
05/02/2008WO2008050832A1 Substrate cleaning apparatus, substrate cleaning method, program and recording medium
05/02/2008WO2008050785A1 Liquid composition for removing photoresist residue and polymer residue
05/02/2008WO2008050775A1 Semiconductor device, and its manufacturing method
05/02/2008WO2008050710A1 Al-BASE ALLOY WIRING MATERIAL AND ELEMENT STRUCTURE USING THE SAME
05/02/2008WO2008050708A1 Method for forming high dielectric film and method for manufacturing semiconductor device
05/02/2008WO2008050644A1 Sputtering target used for production of reflective mask blank for euv lithography
05/02/2008WO2008050635A1 Semiconductor element mounting structure and semiconductor element mounting method
05/02/2008WO2008050596A1 Plasma doping method and plasma doping apparatus
05/02/2008WO2008050567A1 Shower plate sintered integrally with gas release hole member and method for manufacturing the same
05/02/2008WO2008050518A1 Prober device
05/02/2008WO2008050479A1 ZnO LAYER AND SEMICONDUCTOR LIGHT-EMITTING DEVICE
05/02/2008WO2008050477A1 Copolymer and composition for semiconductor lithography and process for producing the copolymer
05/02/2008WO2008050476A1 Method for manufacturing epitaxial silicon wafer, and epitaxial silicon wafer
05/02/2008WO2008050475A1 Polishing head and polishing apparatus
05/02/2008WO2008050376A1 Process for producing semiconductor device and apparatus therefor
05/02/2008WO2008050300A1 Electronic device having a plastic substrate
05/02/2008WO2008050271A2 Ferroelectric varactor with improved tuning range
05/02/2008WO2008050176A1 Improved process for transfer of a thin layer formed in a substrate with vacancy clusters
05/02/2008WO2008050079A1 Multi-directional mechanical scanning in an ion implanter
05/02/2008WO2008049816A1 Metallizing device and method
05/02/2008WO2008049463A1 Method and apparatus for manufacturing cleaned substrates or clean substrates which are further processed
05/02/2008WO2008049332A1 A cleaning compound for removing photoresist
05/02/2008WO2008049290A1 A semiconductor processing equipment
05/02/2008WO2008027305A3 Method of tuning thermal conductivity of electrostatic chuck support assembly
05/02/2008WO2008027196A3 Dynamic surface annealing of implanted dopants with low temperature hdpcvd process for depositing a high extinction coefficient optical absorber layer
05/02/2008WO2008008586A3 A method to provide substrate-ground coupling for semiconductor integrated circuit dice constructed from soi and related materials in stacked-die packages
05/02/2008WO2008008154A3 Barrier structure and nozzle device for use in tools used to process microelectronic workpieces with one or more treatment fluids
05/02/2008WO2008007223A3 Product designed to be used with handling system
05/02/2008WO2008005911A3 Exposed top side copper leadframe manufacturing
05/02/2008WO2008002669A3 Post etch wafer surface cleaning with liquid meniscus
05/02/2008WO2007147956A3 Method and device for monitoring a heat treatment of a microtechnological substrate
05/02/2008WO2007147075A3 Patterning 3d features in a substrate
05/02/2008WO2007139862A3 Integrated circuit interconnect
05/02/2008WO2007136928A3 Low profile managed memory component
05/02/2008WO2007092759A3 Aluminum leadframes for semiconductor qfn/son devices
05/02/2008WO2007075998A3 Three dimensional microstructures and methods for making three dimensional microstructures
05/02/2008WO2006096639A3 Semiconductor package fabrication
05/02/2008CA2664516A1 Method and apparatus for manufacturing cleaned substrates or clean substrates which are further processed
05/01/2008US20080103078 Hydroxylated organic amine(s), and corrosion inhibitor of arabitol, erythritol, xylitol, mannitol, sorbitol, ethylene glycol, glycerol,1,2-cyclopentanediol, 1,2-cyclohexanediol, and/or methylpentanediol; polar solvent; amino acid-free; photoresist strippers; copper or aluminum metallization
05/01/2008US20080103037 Extreme ultraviolet lithography exposure devices;
05/01/2008US20080102650 Method of fabricating a nitrided silicon oxide gate dielectric layer
05/01/2008US20080102649 Mixture of compound having two or more protected carboxylic groups, a compound having two or more epoxy groups, and a solvent; baking; semiconductors with high dry etching rate; capable of flattening the surface of a semiconductor substrate having holes of a high aspect ratio
05/01/2008US20080102648 Method and System For Making Photo-Resist Patterns
05/01/2008US20080102647 Post-lithography misalignment correction with shadow effect for multiple patterning
05/01/2008US20080102646 Integrated method and apparatus for efficient removal of halogen residues from etched substrates
05/01/2008US20080102645 Plasma for resist removal and facet control of underlying features
05/01/2008US20080102644 Methods for removing photoresist from a semiconductor substrate
05/01/2008US20080102643 Patterning method