Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
05/2008
05/14/2008CN101180724A Self-aligned sti sonos
05/14/2008CN101180723A Semiconductor device and method of manufacture
05/14/2008CN101180722A Semiconductor device and method for manufacture
05/14/2008CN101180721A Electrostatic chuck
05/14/2008CN101180720A Method of holding an electronic component in a controlled orientation during parametric testing
05/14/2008CN101180719A Container transporting apparatus and container transporting system
05/14/2008CN101180718A Electrostatic holding apparatus and electrostatic tweezers using same
05/14/2008CN101180717A Method of forming solder bump and method of mounting semiconductor device
05/14/2008CN101180716A IC label mounting structure and IC chip for installation
05/14/2008CN101180715A 半导体用粘合膜 Adhesive film semiconductor
05/14/2008CN101180714A System for and method of planarizing the contact region of a via by use of a continuous inline vacuum deposition
05/14/2008CN101180713A Method of fabricating a bipolar transistor
05/14/2008CN101180712A Etchant for substrates having BPSG and SOD layers
05/14/2008CN101180711A Semiconductor chip cleaning system
05/14/2008CN101180710A Group 3-5 nitride semiconductor multilayer substrate, method for manufacturing group 3-5 nitride semiconductor free-standing substrate, and semiconductor element
05/14/2008CN101180709A Asymmetric bidirectional transient voltage suppressor and method of forming same
05/14/2008CN101180708A Methods for forming arrays of a small, closely spaced features
05/14/2008CN101180707A Exposure apparatus and method for manufacturing device
05/14/2008CN101180706A Exposure apparatus and exposure method
05/14/2008CN101180705A Manufacturing method for semiconductor device
05/14/2008CN101180641A Semiconductor device, and method for manufacturing thereof
05/14/2008CN101180580A Coating-type underlayer film forming composition containing naphthalene resin derivative for lithography
05/14/2008CN101180579A Polysilane compound-containing lower layer film forming composition for lithography
05/14/2008CN101180569A Transflective liquid crystal device and method of manufacturing the same
05/14/2008CN101180545A Sheet probe for wafer inspection and applications thereof
05/14/2008CN101180420A Method for growth of GaN single crystal, method for preparation of GaN substrate, process for producing GaN-based element, and GaN-based element
05/14/2008CN101180418A Method and system for improving coupling between a surface wave plasma source and a plasma space
05/14/2008CN101180335A Modified polyurethane resin and adhesive composition using the same, method for connecting circuit member and connection structure of circuit member
05/14/2008CN101180229A Paper taking out device and method
05/14/2008CN101180170A Molding apparatus for resin encapsulation of electronic part
05/14/2008CN101180167A Device for the separation of substrates from a stack
05/14/2008CN101180158A Polishing pad
05/14/2008CN101179113A Hermetic seal for light emitting display device, method, and apparatus
05/14/2008CN101179111A Organic light emitting display and fabrication method thereof
05/14/2008CN101179108A Non-volatile organic thin-film transistor memory based on floating gate structure and manufacturing method therefor
05/14/2008CN101179103A Luminous chip packaging body and manufacturing method therefor
05/14/2008CN101179102A LED lamp and producing process
05/14/2008CN101179098A Metal/gallium nitride aluminum /gallium nitride lateral direction schottky diode with low current collection side effect and method of producing the same
05/14/2008CN101179096A Film transistor and its making method
05/14/2008CN101179095A Field-effect tranisistor realizing memory function and method of producing the same
05/14/2008CN101179094A MOSFET with parallel laminar drain structure and drain manufacturing method thereof
05/14/2008CN101179093A Organic light-emitting display device and fabricating method of the same
05/14/2008CN101179091A Three-dimensional stacked WO3 resistor accidental memory structure and manufacturing method therefor
05/14/2008CN101179090A Method for improving sensitivity of backside illuminated image sensors
05/14/2008CN101179089A Image sensor and manufacturing method therefor
05/14/2008CN101179088A Multidirection conductive electric enhanced type CCM packaging structure and encapsulation method thereof
05/14/2008CN101179087A Silicon thin-film solar cell and manufacturing method therefor
05/14/2008CN101179085A Active elements array substrates and manufacturing method therefor
05/14/2008CN101179084A Display device and manufacturing method thereof
05/14/2008CN101179083A Semiconductor structures incorporating multiple crystallographic planes and methods for fabrication thereof
05/14/2008CN101179082A The thin fime transistor plate and method for making the same
05/14/2008CN101179079A Rail stack array of charge storage devices and method of making same
05/14/2008CN101179077A Nonvolatile memory devices and methods of fabricating the same
05/14/2008CN101179076A Electron mobility enhancement for mos devices with nitrided polysilicon re-oxidation
05/14/2008CN101179075A High-voltage-withstanding semiconductor device and fabrication method thereof
05/14/2008CN101179074A Integration semiconductor device and manufacturing method thereof
05/14/2008CN101179068A Multi stack package and method of fabricating the same
05/14/2008CN101179061A Electronic diode for ferroalloy lead wire commutation and method of producing the same
05/14/2008CN101179059A Clip type semconductor device and making method thereof
05/14/2008CN101179058A 半导体芯片及半导体装置 The semiconductor chip and semiconductor device
05/14/2008CN101179057A Novel bond pad design to minimize dielectric cracking
05/14/2008CN101179054A Method for manufacturing SOQ substrate
05/14/2008CN101179053A Thin-film transistor array substrates and manufacturing method therefor
05/14/2008CN101179052A Manufacturing method of non-volatility memory with high coupling ratio
05/14/2008CN101179051A Complementary type metal oxide semiconductor image sensor and manufacturing method therefor
05/14/2008CN101179050A Method of fabricating semiconductor integrated circuit device and semiconductor integrated circuit device by the same
05/14/2008CN101179049A Method of forming contact hole, method of manufacturing wiring board, method of manufacturing semiconductor device, and method of manufacturing electro-optical device
05/14/2008CN101179048A Method of manufacturing semiconductor device
05/14/2008CN101179047A Method for forming contact structure by double beset process in low-K-material
05/14/2008CN101179046A Silicon chip shallow plow groove isolation etching method
05/14/2008CN101179045A Mounting device, plasma processing apparatus and plasma processing method
05/14/2008CN101179044A Novel crystal round locating bias correcting method
05/14/2008CN101179043A Scheduling method in silicon chip working process
05/14/2008CN101179042A Optical constant calculating method and base plate treating system
05/14/2008CN101179041A Method for identifying main reference plane position of burnishing epitaxial slice
05/14/2008CN101179040A Method for identifying whether main reference plane position of silicon chip is correct or not
05/14/2008CN101179039A Method of manufacturing semiconductor device
05/14/2008CN101179038A Three-dimensional integrate circuit realization method of transfer-free disc
05/14/2008CN101179037A High, depth and width three-dimensional uprightness interconnect and realization method of three-dimensional integrate circuit
05/14/2008CN101179036A Manufacturing method of semiconductor device
05/14/2008CN101179035A Tin paste printed steel mesh opening method of pin-free flat pack type dense-feet-free type component
05/14/2008CN101179034A Tin paste printed steel mesh opening method of pin-free flat pack type dense feet type component
05/14/2008CN101179033A Chip encapsulation method
05/14/2008CN101179032A Sealing device and method of manufacturing display device using the same
05/14/2008CN101179031A Die bonding machine
05/14/2008CN101179030A Trench transistor with chained implanted body
05/14/2008CN101179029A Film transistor and its making method
05/14/2008CN101179028A Metal-oxide-semiconductor transistor and manufacturing method thereof
05/14/2008CN101179027A Method for manufacturing metal-oxide-semiconductor transistor
05/14/2008CN101179026A Method for reducing HVLDNMOS to cut-off current
05/14/2008CN101179025A Heterojunction bipolar transistor with monocrystalline base and related methods
05/14/2008CN101179024A Monocrystalline extrinsic base and emitter heterojunction bipolar transistor and related methods
05/14/2008CN101179023A Gas distribution control system, polysilicon gate etching and silicon chip shallow groove isolation etching method
05/14/2008CN101179022A Gas injection apparatus
05/14/2008CN101179021A Silicon chip etching method
05/14/2008CN101179020A Semiconductor device method for manufacturing semiconductor device with groove grids
05/14/2008CN101179019A Method of forming cobalt silicide film and method of manufacturing semiconductor device having cobalt silicide film
05/14/2008CN101179018A SONOS structure corrode process used for memory cell
05/14/2008CN101179017A Manufacturing method of floating gate tip of separate gate
05/14/2008CN101179016A Thin-film transistor, active layer manufacturing method and LCD device
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