| Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974) |
|---|
| 05/01/2008 | US20080099813 Semiconductor device and semiconductor device manufacturing method |
| 05/01/2008 | US20080099811 Single transistor memory device having source and drain insulating regions and method of fabricating the same |
| 05/01/2008 | US20080099810 Semiconductor device and semiconductor device manufacturing method |
| 05/01/2008 | US20080099809 Semiconductor device having a capacitance element and method of manufacturing the same |
| 05/01/2008 | US20080099806 Image sensor having heterojunction bipolar transistor and method of fabricating the same |
| 05/01/2008 | US20080099804 Image sensor having curved micro-mirrors over the sensing photodiode and method for fabricating |
| 05/01/2008 | US20080099801 Metal-oxide-semiconductor transistor and method of forming the same |
| 05/01/2008 | US20080099799 Micropad for bonding and a method therefor |
| 05/01/2008 | US20080099796 Device with patterned semiconductor electrode structure and method of manufacture |
| 05/01/2008 | US20080099795 FinFET TRANSISTOR AND CIRCUIT |
| 05/01/2008 | US20080099794 Semiconductor device comprising nmos and pmos transistors with embedded si/ge material for creating tensile and compressive strain |
| 05/01/2008 | US20080099789 Self-aligned method of forming a semiconductor memory array of floating gate memory cells with source side erase, and a memory array made thereby |
| 05/01/2008 | US20080099788 Semiconductor device and method for manufacturing the same |
| 05/01/2008 | US20080099786 Low noise and high performance LSI device, layout and manufacturing method |
| 05/01/2008 | US20080099785 Defect Reduction Using Aspect Ratio Trapping |
| 05/01/2008 | US20080099783 Semiconductor integrated circuit and method for manufacturing the same |
| 05/01/2008 | US20080099781 Method of manufacturing III group nitride semiconductor thin film and method of manufacturing III group nitride semiconductor device using the same |
| 05/01/2008 | US20080099776 Nitride semiconductor light emitting device and method of manufacturing the same |
| 05/01/2008 | US20080099771 Light emitting diode and wafer level package method, wafer level bonding method thereof, and circuit structure for wafer level package |
| 05/01/2008 | US20080099769 PRODUCTION OF AN INTEGRATED CIRCUIT INCLUDING ELECTRICAL CONTACT ON SiC |
| 05/01/2008 | US20080099768 Diamond Transistor And Method Of Manufacture Thereof |
| 05/01/2008 | US20080099767 Gan related compound semiconductor element and process for producing the same and device having the same |
| 05/01/2008 | US20080099765 Thin film transistor substrate and fabricating method thereof |
| 05/01/2008 | US20080099764 Array substrate for liquid crystal display device and method of fabricating the same |
| 05/01/2008 | US20080099763 Display panel |
| 05/01/2008 | US20080099761 Test structure for opc-related shorts between lines in a semiconductor device |
| 05/01/2008 | US20080099754 Method for providing a nanoscale, high electron mobility transistor (hemt) on insulator |
| 05/01/2008 | US20080099753 Phase change memory devices having dual lower electrodes and methods of fabricating the same |
| 05/01/2008 | US20080099717 Silicon wafer etching process and composition |
| 05/01/2008 | US20080099681 Infrared Detector and Process for Fabricating the Same |
| 05/01/2008 | US20080099453 Energy-efficient, laser-based method and system for processing target material |
| 05/01/2008 | US20080099451 Workpiece rotation apparatus for a plasma reactor system |
| 05/01/2008 | US20080099450 Mask etch plasma reactor with backside optical sensors and multiple frequency control of etch distribution |
| 05/01/2008 | US20080099443 Peak-based endpointing for chemical mechanical polishing |
| 05/01/2008 | US20080099441 Apparatus and method for reactive atom plasma processing for material deposition |
| 05/01/2008 | US20080099439 Apparatus and Method For Controlling Relative Particle Speeds In A Plasma |
| 05/01/2008 | US20080099437 Plasma reactor for processing a transparent workpiece with backside process endpoint detection |
| 05/01/2008 | US20080099431 Method and apparatus for photomask plasma etching |
| 05/01/2008 | US20080099430 Method for connecting array of optical waveguides to an array of optical fibers with very small pitch |
| 05/01/2008 | US20080099426 Method and apparatus for photomask plasma etching |
| 05/01/2008 | US20080099344 Immersing a contact electrode in a solution;contacting the surface of the conductive layer with the contact solution to define a contact region;immersing a process electrode in a process solution;contacting the surface of the conductive layer with the process solution, applying an electrical potential |
| 05/01/2008 | US20080099338 Depositing a first pattern onto a substrate using the first mask to forming a first layer, removing the first mask, depositing a second material, building additional layers adjacent to and adhered to previously formed layers; removing undesired elements of material via etching or electropolishing |
| 05/01/2008 | US20080099181 Method to cool a bake plate using an actively chilled transfer shuttle |
| 05/01/2008 | US20080099144 Etching system |
| 05/01/2008 | US20080099137 Method for holding substrate in vacuum |
| 05/01/2008 | US20080098833 Apparatus and method for evaluating a substrate mounting device |
| 04/30/2008 | EP1916717A2 Method for doping a fin-based semiconductor device |
| 04/30/2008 | EP1916712A2 Method for mounting electronic component on substrate and method for forming solder surface |
| 04/30/2008 | EP1916711A2 Electronic device and method of manufacturing the same |
| 04/30/2008 | EP1916710A1 Nonvolatile semiconductor memory device and method of producing the same |
| 04/30/2008 | EP1916709A1 Method of bonding |
| 04/30/2008 | EP1916708A2 Patterning of doped poly-silicon gates |
| 04/30/2008 | EP1916707A2 Methods for depositing metal films by CVD or ALD processes onto diffusion barrier layers |
| 04/30/2008 | EP1916706A2 Method for forming a semiconductor device and semiconductor device thus obtained |
| 04/30/2008 | EP1916705A2 Semiconductor device comprising a doped metal comprising main electrode |
| 04/30/2008 | EP1916704A1 Method for forming film of group iii nitride such as gallium nitride |
| 04/30/2008 | EP1916703A2 Integrated method for removal of halogen residues from etched substrates by thermal process |
| 04/30/2008 | EP1916702A2 Method of manufacturing a thin-film transistor substrate |
| 04/30/2008 | EP1916701A2 Facility connection positioning template |
| 04/30/2008 | EP1916557A1 Optical scanner and image reader for reading images and decoding optical information including one and two dimensional symbologies at variable depth of field |
| 04/30/2008 | EP1916314A1 Method of optimizing process recipe of substrate processing system |
| 04/30/2008 | EP1915782A1 Field-effect semiconductor device and method of forming the same |
| 04/30/2008 | EP1915779A1 A novel approach for high temperature wafer processing |
| 04/30/2008 | EP1915778A1 Single crystal based through the wafer connections |
| 04/30/2008 | EP1915777A1 Semiconductor substrate and methods for the production thereof |
| 04/30/2008 | EP1915776A2 Technique for efficiently patterning an underbump metallization layer using a dry etch process |
| 04/30/2008 | EP1915775A2 Directed purge for contact free drying of wafers |
| 04/30/2008 | EP1915774A2 Printable semiconductor structures and related methods of making and assembling |
| 04/30/2008 | EP1915773A1 Semiconductor device manufacturing method |
| 04/30/2008 | EP1915435A1 Low dielectric constant silicon coating, method for the preparation and application thereof to integrated circuits |
| 04/30/2008 | EP1915233A1 Transparent microporous materials for cmp |
| 04/30/2008 | EP1915230A1 Thermode device for a multitude of semiconductor components |
| 04/30/2008 | EP1668679A4 Illumination optical system and exposure apparatus using the same |
| 04/30/2008 | EP1644970A4 Electrolytic processing apparatus and electrolytic processing method |
| 04/30/2008 | EP1573810B1 Method for forming patterns aligned on either side of a thin film |
| 04/30/2008 | EP1567580A4 Sacrificial compositions, methods of use thereof, and methods of decomposition thereof |
| 04/30/2008 | EP1549357B1 Workpiece processing system |
| 04/30/2008 | EP1495154B1 Method for forming housings for electronic components and electronic components that are hermetically encapsulated thereby |
| 04/30/2008 | EP1461832A4 Organic semiconductor and method |
| 04/30/2008 | EP1358681A4 Silicon carbide and related wide-bandgap transistors on semi-insulating epitaxy for high-speed, high-power applications |
| 04/30/2008 | EP1102872A4 Novel organocuprous precursors for chemical vapor deposition of a copper film |
| 04/30/2008 | EP1010198B1 Method for making a thin film of solid material |
| 04/30/2008 | DE4337675B4 Verfahren zur Herstellung von stapelbaren Halbleitergehäusen A process for the production of stackable semiconductor packages |
| 04/30/2008 | DE19955034B4 Chipsatz mit nur einem Anschlusspin für die Grafikschnittstellen-Vergleichsspannung Chipset with only one connection pin for the graphic interface reference voltage |
| 04/30/2008 | DE19829609B4 Verfahren zur Herstellung eines Mikrosystems A process for producing a microsystem |
| 04/30/2008 | DE19818060B4 Beschleunigungssensor, Winkelbeschleunigungssensor und Herstellverfahren für diese Sensoren Acceleration sensor, angular acceleration sensor and manufacturing method for these sensors |
| 04/30/2008 | DE19708031B4 Nichtflüchtiger Halbleiterspeicher und Verfahren zu dessen Herstellung A non-volatile semiconductor memory and method for its production |
| 04/30/2008 | DE19650331B4 Verfahren zur Herstellung eines Halbleiterbauelementes mit einer Schichtfolge aus zwei metallischen Schichten mit Siliciumanteilen sowie zugehöriges Halbleiterbauelement A process for producing a semiconductor component with a layer sequence of two metallic layers with silicon contents and associated semiconductor device |
| 04/30/2008 | DE112006001634T5 Oberflächenmontierbare elektrische Lichtemissionsvorrichtung mit einem Kühlkörper A surface-mountable electrical light-emitting device with a heat sink |
| 04/30/2008 | DE112006001589T5 Halbleiterbauelementstrukturen und Verfahren zur Bildung von Halbleiterstrukturen A semiconductor device structures and methods of forming semiconductor structures |
| 04/30/2008 | DE112006001520T5 Prozess für die Herstellung erhabener Source- und Drain-Gebiete mit zu entfernenden Abstandshaltern Process for forming raised source and drain regions to be removed with spacers |
| 04/30/2008 | DE112006001509T5 Vorrichtung und Verfahren zum Übertragen, Vorrichtung und Verfahren zum Ablösen und Vorrichtung und Verfahren zum Laminieren Apparatus and method for transmitting, apparatus and methods for peeling and apparatus and method for laminating |
| 04/30/2008 | DE112006000133T5 Eine dielektrische Schicht mit hoher dielektrischer Konstante nutzender Quantentopf-Transistor A dielectric layer having a high dielectric constant-use quantum-well transistor |
| 04/30/2008 | DE112005003584T5 Trench-Metalloxid-Halbleiter-Feldeffekttransistor Trench metal-oxide-semiconductor field-effect transistor |
| 04/30/2008 | DE10250353B4 Einrichtung zur Detektion von übereinander mit einem bestimmten Abstand angeordneten Substraten Means for detecting one above the other with a certain distance disposed substrates |
| 04/30/2008 | DE10250204B4 Verfahren zur Herstellung von Kollektorbereichen einer Transistorstruktur A process for producing collector regions of a transistor structure |
| 04/30/2008 | DE10219361B4 Ein Halbleiterelement mit einer verbesserten lokalen Verbindungsstruktur und ein Verfahren zur Herstellung eines derartigen Elements A semiconductor element with improved local interconnect structure and a method for manufacturing such element |
| 04/30/2008 | DE102007050594A1 Substrate e.g. semiconductor wafer, cleaning device for e.g. use during manufacturing of flat panel display device, has fluid guide opening, where fluid film is formed on section around opening so that section and substrate are processed |
| 04/30/2008 | DE102007048007A1 Warpage preventing circuit substrate for semiconductor package, has warpage preventing region comprising warpage pattern formed in adjacent corners of substrate and warpage elements provided in diagonal direction of corners |
| 04/30/2008 | DE102007039728A1 Tastkopfanordnung Probe assembly |