Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
05/2008
05/13/2008US7372088 Vertical gate semiconductor device and method for fabricating the same
05/13/2008US7372086 Semiconductor device including MOSFET and isolation region for isolating the MOSFET
05/13/2008US7372085 Top layers of metal for high performance IC's
05/13/2008US7372077 Semiconductor device
05/13/2008US7372073 Semiconductor thin film, semiconductor device and manufacturing method thereof
05/13/2008US7372072 Semiconductor wafer with test structure
05/13/2008US7372070 Organic field effect transistor and method of manufacturing the same
05/13/2008US7372062 Defect inspection device and substrate manufacturing system using the same
05/13/2008US7372050 Method of preventing charging, and apparatus for charged particle beam using the same
05/13/2008US7372047 Charged particle system and a method for measuring image magnification
05/13/2008US7371997 Thermal processing apparatus and thermal processing method
05/13/2008US7371992 Method for non-contact cleaning of a surface
05/13/2008US7371974 Multilayer printed wiring board
05/13/2008US7371887 Oligo(p-phenylene vinylene) amphiphiles and methods for self-assembly
05/13/2008US7371698 Method of forming film pattern, active matrix substrate, electro-optic device, and electronic apparatus
05/13/2008US7371697 Ion-assisted oxidation methods and the resulting structures
05/13/2008US7371696 Carbon nanotube structure and method of vertically aligning carbon nanotubes
05/13/2008US7371695 Use of TEOS oxides in integrated circuit fabrication processes
05/13/2008US7371694 Semiconductor device fabrication method and fabrication apparatus
05/13/2008US7371693 Manufacturing method of semiconductor device with chamfering
05/13/2008US7371692 Method for manufacturing a semiconductor device having a W/WN/polysilicon layered film
05/13/2008US7371691 Silicon recess improvement through improved post implant resist removal and cleans
05/13/2008US7371690 Dry etching method and apparatus
05/13/2008US7371689 Backside unlayering of MOSFET devices for electrical and physical characterization
05/13/2008US7371688 Removal of transition metal ternary and/or quaternary barrier materials from a substrate
05/13/2008US7371686 Method and apparatus for polishing a semiconductor device
05/13/2008US7371685 Low stress barrier layer removal
05/13/2008US7371684 Process for preparing electronics structures using a sacrificial multilayer hardmask scheme
05/13/2008US7371683 Method for carrying object to be processed
05/13/2008US7371682 Production method for electronic component and electronic component
05/13/2008US7371681 Method of manufacturing a semiconductor device
05/13/2008US7371680 Method of manufacturing semiconductor device
05/13/2008US7371679 Semiconductor device with a metal line and method of forming the same
05/13/2008US7371678 Semiconductor device with a metal line and method of forming the same
05/13/2008US7371677 Laterally grown nanotubes and method of formation
05/13/2008US7371675 Method and apparatus for bonding a wire
05/13/2008US7371674 Nanostructure-based package interconnect
05/13/2008US7371673 Method and apparatus for attaching an IC package to a PCB assembly
05/13/2008US7371672 Semiconductor device and method of manufacturing the same
05/13/2008US7371671 System and method for photolithography in semiconductor manufacturing
05/13/2008US7371670 Method for forming a (TaO)1-x(TiO)xN dielectric layer in a semiconductor device
05/13/2008US7371669 Method of forming a gate of a semiconductor device
05/13/2008US7371668 Method for making a metal oxide semiconductor device
05/13/2008US7371667 Semiconductor device and method of fabricating same
05/13/2008US7371666 with an emission spanning the visible spectrum; reacting a silicon precursor in the presence of a sheath gas with heat from a radiation beam under conditions effective to produce silicon nanoparticles; acid etching
05/13/2008US7371665 Method for fabricating shallow trench isolation layer of semiconductor device
05/13/2008US7371664 Process for wafer thinning
05/13/2008US7371663 Three dimensional IC device and alignment methods of IC device substrates
05/13/2008US7371661 Wafer bonding method
05/13/2008US7371660 Controlled cleaving process
05/13/2008US7371659 Substrate laser marking
05/13/2008US7371658 Trench isolation structure and a method of manufacture therefor
05/13/2008US7371657 Method for forming an isolating trench with a dielectric material
05/13/2008US7371656 Method for forming STI of semiconductor device
05/13/2008US7371655 Method of fabricating low-power CMOS device
05/13/2008US7371654 Manufacturing method of semiconductor device with filling insulating film into trench
05/13/2008US7371653 Metal interconnection structure of semiconductor device and method of forming the same
05/13/2008US7371652 Alignment using fiducial features
05/13/2008US7371651 Flat-type capacitor for integrated circuit and method of manufacturing the same
05/13/2008US7371650 Method for producing a transistor structure
05/13/2008US7371649 Method of forming carbon-containing silicon nitride layer
05/13/2008US7371648 Method for manufacturing a transistor device having an improved breakdown voltage and a method for manufacturing an integrated circuit using the same
05/13/2008US7371647 Methods of forming transistors
05/13/2008US7371646 Manufacture of insulated gate type field effect transistor
05/13/2008US7371645 Method of manufacturing a field effect transistor device with recessed channel and corner gate device
05/13/2008US7371644 Semiconductor device and method of fabricating the same
05/13/2008US7371643 Nonvolatile semiconductor memory device
05/13/2008US7371642 Multi-state NROM device
05/13/2008US7371641 Method of making a trench MOSFET with deposited oxide
05/13/2008US7371640 Semiconductor device with floating trap type nonvolatile memory cell and method for manufacturing the same
05/13/2008US7371639 Nonvolatile memory device and method for fabricating the same
05/13/2008US7371638 Nonvolatile memory cells having high control gate coupling ratios using grooved floating gates and methods of forming same
05/13/2008US7371637 Oxide-nitride stack gate dielectric
05/13/2008US7371636 Method for fabricating storage node contact hole of semiconductor device
05/13/2008US7371635 Semiconductor device and method of manufacturing the same
05/13/2008US7371634 Amorphous carbon contact film for contact hole etch process
05/13/2008US7371633 Dielectric layer for semiconductor device and method of manufacturing the same
05/13/2008US7371632 Semiconductor device having high-voltage transistor and PIP capacitor and method for fabricating the same
05/13/2008US7371631 Method of manufacturing a nonvolatile semiconductor memory device, and a nonvolatile semiconductor memory device
05/13/2008US7371629 N/PMOS saturation current, HCE, and Vt stability by contact etch stop film modifications
05/13/2008US7371628 Method for fabricating semiconductor device
05/13/2008US7371626 Method for maintaining topographical uniformity of a semiconductor memory array
05/13/2008US7371625 Semiconductor device and manufacturing method thereof, liquid crystal television system, and EL television system
05/13/2008US7371624 Method of manufacturing thin film semiconductor device, thin film semiconductor device, electro-optical device, and electronic apparatus
05/13/2008US7371623 Semiconductor device with semiconductor circuit comprising semiconductor units, and method for fabricating it
05/13/2008US7371622 Etchant for signal wire and method of manufacturing thin film transistor array panel using etchant
05/13/2008US7371621 Thin film transistor array panel and fabrication
05/13/2008US7371620 Apparatus and method for laser radiation
05/13/2008US7371618 Method of manufacturing wafer-level chip-size package and molding apparatus used in the method
05/13/2008US7371617 Method for fabricating semiconductor package with heat sink
05/13/2008US7371616 Clipless and wireless semiconductor die package and method for making the same
05/13/2008US7371615 Heat sink and method for its production
05/13/2008US7371614 Image sensor device and methods thereof
05/13/2008US7371613 Semiconductor device and method of manufacturing the same
05/13/2008US7371612 Method of fabrication of stacked semiconductor devices
05/13/2008US7371610 Process for fabricating an integrated circuit package with reduced mold warping
05/13/2008US7371609 Stacked module systems and methods
05/13/2008US7371608 Method of fabricating a stacked die having a recess in a die BGA package
05/13/2008US7371607 Method of manufacturing semiconductor device and method of manufacturing electronic device
05/13/2008US7371606 Manufacturing method of a semiconductor device