| Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974) |
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| 05/13/2008 | US7371604 Method of forming a contact structure |
| 05/13/2008 | US7371603 Method of fabricating light emitting diode package |
| 05/13/2008 | US7371602 Semiconductor package structure and method for manufacturing the same |
| 05/13/2008 | US7371601 Piezoresistive sensing structure |
| 05/13/2008 | US7371600 Thin-film structure and method for manufacturing the same, and acceleration sensor and method for manufacturing the same |
| 05/13/2008 | US7371599 Image sensor and method of forming the same |
| 05/13/2008 | US7371598 Wiring substrate and method of manufacturing thereof, and thin film transistor and method of manufacturing thereof |
| 05/13/2008 | US7371597 Diode having vertical structure and method of manufacturing the same |
| 05/13/2008 | US7371596 Parallel-beam scanning for surface patterning of materials |
| 05/13/2008 | US7371595 Method for manufacturing semiconductor laser device |
| 05/13/2008 | US7371593 Method for manufacturing semiconductor light emitting device |
| 05/13/2008 | US7371592 Manufacturing method of thin film transistor array panel using an optical mask |
| 05/13/2008 | US7371591 Process for manufacturing liquid ejection head |
| 05/13/2008 | US7371590 Integrated inspection system and defect correction method |
| 05/13/2008 | US7371589 Ferroelectric random access memory capacitor and method for manufacturing the same |
| 05/13/2008 | US7371588 Method of manufacturing a semiconductor device |
| 05/13/2008 | US7371587 Method for reducing diffusion through ferromagnetic materials |
| 05/13/2008 | US7371586 Superconductor and process for producing the same |
| 05/13/2008 | US7371509 reflow stabilizing solution polymer is applied after the photoresist material has been developed and patterned; integrated circuit semiconductors |
| 05/13/2008 | US7371507 Multilayer; electroconductive layer, dielectrics, antireflectivity layer; forming photoresist pattern; dry etching using photoresist pattern as mask |
| 05/13/2008 | US7371489 Scanning the photomask which has sub-patterns formed inside rectangular region including all the main patterns; scan target range is regulated by inspecting apparatus; every scan target range in the rectangular region includes a main pattern and a sub-pattern; preventing alignment mixup in target range |
| 05/13/2008 | US7371484 Photomask blank and method of fabricating a photomask from the same |
| 05/13/2008 | US7371483 Monitoring apertures in radiation transparent substrate; masking; halftone film; stacks of radiation transparent materials and opacque film ; etching |
| 05/13/2008 | US7371473 Film of an oxide: Pb(ZrTi)1-xNbxO3 where x is greater than 0.1 and less than or equal to 0.4; does not require a barrier film |
| 05/13/2008 | US7371461 Multilayer hardmask scheme for damage-free dual damascene processing of SiCOH dielectrics |
| 05/13/2008 | US7371436 Method and apparatus for depositing materials with tunable optical properties and etching characteristics |
| 05/13/2008 | US7371434 Liquid film forming method and solid film forming method |
| 05/13/2008 | US7371427 Preconditioning a processing chamber used to form a barrier layer on top of a copper layer by depositing a seasoning layer of silicon oxide on exposed surfaces and optionally exposing the chamber to a plasma before introducing a substrate bearing a copper layer |
| 05/13/2008 | US7371332 Uniform etch system |
| 05/13/2008 | US7371312 Using cell voltage as a monitor for deposition coverage |
| 05/13/2008 | US7371299 Set of resin sheets and method for producing ceramic structure using the same, and ceramic structure |
| 05/13/2008 | US7371287 Substrate handling system |
| 05/13/2008 | US7371286 Wiring repair apparatus |
| 05/13/2008 | US7371285 Motorized chamber lid |
| 05/13/2008 | US7371263 Plasmaless dry contact cleaning method using interhalogen compounds |
| 05/13/2008 | US7371156 Off-line tool for breaking in multiple pad conditioning disks used in a chemical mechanical polishing system |
| 05/13/2008 | US7371072 Spring interconnect structures |
| 05/13/2008 | US7371071 Connection structure of circuit substrate |
| 05/13/2008 | US7370848 Bubbler for substrate processing |
| 05/13/2008 | US7370786 Bonding method and bonding apparatus |
| 05/13/2008 | US7370785 Wire bonding method and apparatus |
| 05/13/2008 | US7370764 Transport module |
| 05/13/2008 | US7370746 Ball transfer unit and ball table |
| 05/13/2008 | US7370659 Photolithographic stepper and/or scanner machines including cleaning devices and methods of cleaning photolithographic stepper and/or scanner machines |
| 05/13/2008 | US7370530 Package for MEMS devices |
| 05/13/2008 | US7370416 Method of manufacturing an injector plate |
| 05/13/2008 | US7370414 Methods for manufacturing lead frame connectors for optical transceiver modules |
| 05/13/2008 | US7370412 Method for connecting electronic device |
| 05/13/2008 | CA2501580C Method of forming strained silicon on insulator (ssoi) and structures formed thereby |
| 05/13/2008 | CA2267453C Fluid coupling |
| 05/08/2008 | WO2008055174A2 Peak-based endpointing for chemical mechanical polishing |
| 05/08/2008 | WO2008055150A2 Method of fabricating a nitrided silicon oxide gate dielectric layer |
| 05/08/2008 | WO2008055134A2 Electronic device with inductor and integrated componentry |
| 05/08/2008 | WO2008055105A2 Non-pull back pad package with an additional solder standoff |
| 05/08/2008 | WO2008055095A2 Junction isolated poly-silicon gate jfet |
| 05/08/2008 | WO2008055089A2 Semiconductor device, design method and structure |
| 05/08/2008 | WO2008055007A2 Methods of fabricating a barrier layer with varying composition for copper metallization |
| 05/08/2008 | WO2008054967A2 Method for providing a nanoscale, high electron mobility transistor (hemt) on insulator |
| 05/08/2008 | WO2008054957A1 System and method for providing a nanoscale, highly selective, and thermally resilient silicon, germanium, or silicon-germanium etch-stop |
| 05/08/2008 | WO2008054946A1 Method for sealing vias in a substrate |
| 05/08/2008 | WO2008054919A1 One transistor dram cell structure and method for forming |
| 05/08/2008 | WO2008054832A2 Nanowire device and method of making |
| 05/08/2008 | WO2008054692A1 Baffled liner cover |
| 05/08/2008 | WO2008054680A2 A metallization layer stack without a terminal aluminum metal layer |
| 05/08/2008 | WO2008054679A1 Method of forming a semiconductor structure comprising a field effect transistor having a stressed channel region |
| 05/08/2008 | WO2008054678A1 A semiconductor device comprising nmos and pmos transistors with embedded si/ge material for creating tensile and compressive strain |
| 05/08/2008 | WO2008054400A2 Control layer for a nanoscale electronic switching device |
| 05/08/2008 | WO2008054379A2 Shape controlled growth of nanostructured films and objects |
| 05/08/2008 | WO2008054332A2 A unit lifter assembly |
| 05/08/2008 | WO2008054326A1 Device, unit, system and method for the magnetically-assisted assembling of chip-scale, and nano and micro-scale components onto a substrate |
| 05/08/2008 | WO2008054324A1 Double-stacked ebg structure |
| 05/08/2008 | WO2008054240A1 Growth manipulator of a vacuum chamber used for growing semiconductor heterostructures |
| 05/08/2008 | WO2008054239A1 Growth manipulator of a vacuum chamber used for growing semiconductor heterostructures |
| 05/08/2008 | WO2008054153A1 Chemical vapor deposition apparatus for equalizing heating temperature |
| 05/08/2008 | WO2008054039A1 Atmospheric pressure plasma system |
| 05/08/2008 | WO2008054014A1 Method of planarizing solid surface with gas cluster ion beam and solid surface planarizing apparatus |
| 05/08/2008 | WO2008054013A1 Method of working solid surface with gas cluster ion beam |
| 05/08/2008 | WO2008053974A1 Radiation-sensitive composition |
| 05/08/2008 | WO2008053948A1 Method for manufacturing chemical mechanical polishing pad and method for processing material to be polished |
| 05/08/2008 | WO2008053934A1 Electrostatic chuck device |
| 05/08/2008 | WO2008053929A1 Apparatus for inspecting fine structure, method for inspecting fine structure and substrate holding apparatus |
| 05/08/2008 | WO2008053918A1 Liquid holding apparatus, liquid holding method, exposure apparatus, exposure method and device manufacturing method |
| 05/08/2008 | WO2008053899A1 Contact with solder and method for manufacturing the contact |
| 05/08/2008 | WO2008053881A1 Dimmer plate, exposure apparatus, method of exposure and process for manufacturing device |
| 05/08/2008 | WO2008053879A1 Method for flattening solid surface with gas cluster ion beam, and solid surface flattening device |
| 05/08/2008 | WO2008053877A1 Polymer, resist composition, and method for producing substrate provided with pattern |
| 05/08/2008 | WO2008053873A1 Circuit connection structure |
| 05/08/2008 | WO2008053840A1 Thermally strippable double faced adhesive sheet and method of working work piece |
| 05/08/2008 | WO2008053748A1 Semiconductor device |
| 05/08/2008 | WO2008053734A1 Method for compression molding electric component and compression molding apparatus for use in the method |
| 05/08/2008 | WO2008053704A1 Variable-capacity element, resonator, and modulator |
| 05/08/2008 | WO2008053698A1 Compound and polymeric compound |
| 05/08/2008 | WO2008053697A1 Positive resist composition and method for formation of resist pattern |
| 05/08/2008 | WO2008053677A1 Write-in verifying mram |
| 05/08/2008 | WO2008053673A1 Pickup device for semiconductor chip |
| 05/08/2008 | WO2008053628A1 Method for manufacturing silicon carbide semiconductor device |
| 05/08/2008 | WO2008053627A1 OHMIC ELECTRODE FOR SiC SEMICONDUCTOR, METHOD FOR MANUFACTURE OF OHMIC ELECTRODE FOR SiC SEMICONDUCTOR, SEMICONDUCTOR DEVICE, AND METHOD FOR MANUFACTURE OF SEMICONDUCTOR DEVICE |
| 05/08/2008 | WO2008053625A1 Method of film deposition and apparatus for treating substrate |
| 05/08/2008 | WO2008053622A1 Device substrate and display device substrate |
| 05/08/2008 | WO2008053590A1 Liquid resin composition, semiconductor wafer with adhesive layer, semiconductor element with adhesive layer, semiconductor package, method for manufacturing semiconductor element, and method for manufacturing semiconductor package |