| Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974) |
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| 05/15/2008 | US20080111141 Light emitting diode assembly and method of fabrication |
| 05/15/2008 | US20080111137 Thin film transistor substrate with bonding layer and method for fabricating the same |
| 05/15/2008 | US20080111136 Tft-lcd pixel unit and method for manufacturing the same |
| 05/15/2008 | US20080111135 Organic light emitting diode display device and method of manufacturing the same |
| 05/15/2008 | US20080111134 Semiconductor device, method of making the same and liquid crystal display device |
| 05/15/2008 | US20080111133 Thin film transistor and method of fabricating the same |
| 05/15/2008 | US20080111132 Thin film transistor array substrate and fbricating method thereof |
| 05/15/2008 | US20080111130 Electro-optic device manufacturing method, electro-optic device, liquid crystal device, organic electroluminescent device, and electronic apparatus |
| 05/15/2008 | US20080111127 Ferrocene-containing conductive polymer, organic memory device using the same and fabrication method of the organic memory device |
| 05/15/2008 | US20080111125 Organic light emitting display and fabricating method thereof |
| 05/15/2008 | US20080111058 Integrated optical systems and associated methods |
| 05/15/2008 | US20080110861 Substrate Processing Apparatus and Method |
| 05/15/2008 | US20080110860 Method of plasma confinement for enhancing magnetic control of plasma radial distribution |
| 05/15/2008 | US20080110857 Method of Electrochemical Fabrication |
| 05/15/2008 | US20080110856 Manufacture of devices having complex structures by selective electroplating of layers that include both structural materials (metals) and support (sacrificial) materials; removal(etching, melting, or electrolytically dissolving) of the support defines a microscopicelement for an electrical device |
| 05/15/2008 | US20080110751 Microelectronic Workpiece Processing Tool Including A Processing Reactor Having A Paddle Assembly for Agitation of a Processing Fluid Proximate to the Workpiece |
| 05/15/2008 | US20080110747 Self-ionized and inductively-coupled plasma for sputtering and resputtering |
| 05/15/2008 | US20080110567 Plasma confinement baffle and flow equalizer for enhanced magnetic control of plasma radial distribution |
| 05/15/2008 | US20080110530 for a flip chip having solder bumps suited for a simple one step application to a printed circuit board; assists in solder assembly of integrated circuit device to circuit board and for shock resistance; resin, solvent, and fluxing agent |
| 05/15/2008 | US20080110473 Ultrasonic-wave washing unit, ultrasonic-wave washing apparatus, ultrasonic-wave washing method, method of manufacturing a semiconductor device, and method of manufacturing a liquid crystal display |
| 05/15/2008 | US20080110401 Susceptor For Vapor-Phase Growth Reactor |
| 05/15/2008 | US20080110021 Component-embedded board fabrication method and apparatus for high-precision and easy fabrication of component-embedded board with electronic components embedded in wiring board |
| 05/15/2008 | US20080110015 Chip element holder and method of handling chip elements |
| 05/15/2008 | DE19956978B4 Verfahren zur Herstellung eines tiefen flaschenförmigen Graben-Kondensators A process for producing a deep bottle-shaped trench capacitor |
| 05/15/2008 | DE19920757B4 Verfahren zum Bilden eines nicht-linearen Schaltelementes auf einer integrierten Schaltung und elektrische Zwischenverbindungsstruktur A method of forming a non-linear switching element on an integrated circuit and electrical interconnect structure |
| 05/15/2008 | DE19803712B4 Einrichtung zur Steuerung von in der Halbleiterindustrie vorgesehenen Fertigungsmaschinen Means for controlling provided in the semiconductor industry, manufacturing machinery |
| 05/15/2008 | DE112006001893T5 Normalerweise abgeschaltetes Gruppe-III-Nitrid-Halbleiter-Bauteil mit einem programmierbaren Gate Normally Off Group III nitride semiconductor device with a programmable gate |
| 05/15/2008 | DE112006001869T5 Verfahren zum Unterdrücken der Verzerrung eines Arbeitslaserstrahls eines Laserverbindungsbearbeitungssystems A method for suppressing the distortion of a working laser beam of a laser link processing system |
| 05/15/2008 | DE112006001866T5 Gefalzter Rahmenträger für MOSFET GBA Folded frame support for MOSFET GBA |
| 05/15/2008 | DE112006001813T5 Folien-Anklebeeinrichtung und Anklebeverfahren Foil Anklebeeinrichtung and Anklebeverfahren |
| 05/15/2008 | DE112006001812T5 Folien-Anklebeeinrichtung Foil Anklebeeinrichtung |
| 05/15/2008 | DE112006001766T5 Substrat und Halbleiter-Lichtemittirende-Vorrichtung Substrate and semiconductor device Lichtemittirende |
| 05/15/2008 | DE112006001431T5 Integrierter Schaltungsträger mit Metall und Partikeln gefüllten Durchkontaktierungen Integrated circuit substrate with metal particles and filled vias |
| 05/15/2008 | DE112006000623T5 Sondenkarte und Verfahren zur Herstellung derselben A probe card and method of producing same |
| 05/15/2008 | DE112005003376T5 Niederdruck-Entfernung von Photoresist und Ätzresten A low-pressure removal of photoresist and etching residues |
| 05/15/2008 | DE102007052289A1 Semiconductor device i.e. dynamic random access memory device, producing method, involves forming recess by isotropic etching of base area of another recess, where former recess includes larger width than width of latter recess |
| 05/15/2008 | DE102007050358A1 Nichtflüchtige Speicherbauelementstruktur und Verfahren zur Herstellung derselben A non-volatile memory device structure and method of manufacturing the same |
| 05/15/2008 | DE102007047247A1 Semiconductor component for use in semiconductor chip package, has electrode contact point arranged on substrate, where external connection having conductive liquid is arranged on point, and container arranged on point is filled with liquid |
| 05/15/2008 | DE102007038515A1 Vorrichtung zur Passivierung eines Bauelements und Verfahren zur Herstellung der Vorrichtung Apparatus for passivation of a device and method for manufacturing the device |
| 05/15/2008 | DE102006053982A1 Electromagnetic screening structure for e.g. molded interconnect device of electronic or opto-electronic assembly, has flat metal coating applied over flat metal seed layer and in electrical contact with seed layer |
| 05/15/2008 | DE102006053862A1 Method for manufacturing packaged components, involves mounting plate-like top substrate on support substrate, where trenches are added on exposed side of plate-like top substrate |
| 05/15/2008 | DE102006053438A1 Halbleiterstruktur, Halbleiterspeichereinrichtung und Verfahren zur Herstellung derselben A semiconductor structure, the semiconductor memory device and method of manufacturing the same |
| 05/15/2008 | DE102006053211A1 Enclosed electronic and/or opto-electronic component producing method, involves separating interconnection substrate along predetermined trace within frame, so that interconnection substrate is divided into individual components |
| 05/15/2008 | DE102006053159A1 Herstellungsverfahren für eine integrierte Halbleiterstruktur Manufacturing method of an integrated semiconductor structure |
| 05/15/2008 | DE102006053070A1 New dyes, e.g. useful in molecular electronics, comprise three perylenetetracarboxydiimide groups bonded to a tetrahydrodibenzo(2,3:4,5)pentaleno(1,6-ab)indene group |
| 05/15/2008 | DE102006052754A1 Transistor, Inverter und Verfahren zur Herstellung eines Transistors Transistor, and inverter process for the preparation of a transistor |
| 05/15/2008 | DE102006051491A1 Metallisierungsschichtstapel mit einer Aluminiumabschlussmetallschicht Metallization layer with an aluminum final metal layer |
| 05/15/2008 | DE102005033036B4 Vorrichtung und Verfahren zur Inspektion eines Wafers Apparatus and method for inspecting a wafer |
| 05/15/2008 | DE102005014427B4 Verfahren zum Verkapseln eines Halbleiterbauelements A method for encapsulating a semiconductor device |
| 05/15/2008 | DE102004058128B4 System zur Inspektion eines scheibenförmigen Objekts System for inspecting a disk-shaped object |
| 05/15/2008 | DE102004029355B4 Verfahren mit selbstausgerichteter Maske zum Verringern der Zellenlayoutfläche Method with self-aligned mask to reduce the cell layout area |
| 05/15/2008 | DE10030308B4 Verfahren zur Herstellung eines Kontaktstifts und eines Halbleiterbauelementes A process for producing a contact pin and of a semiconductor device |
| 05/15/2008 | CA2668862A1 Silicon carbide semiconductor device and method of manufacturing the same |
| 05/15/2008 | CA2666519A1 Methods of fabricating semiconductor devices including implanted regions for providing low-resistance contact to buried layers and related devices |
| 05/14/2008 | EP1921682A2 Method for producing single crystal silicon solar cell and single crystal silicon solar cell |
| 05/14/2008 | EP1921672A2 Method for manufacturing SOQ substrate |
| 05/14/2008 | EP1921671A1 Wafer level burn-in method and wafer level burn-in system |
| 05/14/2008 | EP1921670A2 Manufacturing method of semiconductor device |
| 05/14/2008 | EP1921669A1 GaN based HEMTs with buried field plates |
| 05/14/2008 | EP1921668A2 Compound semiconductor substrate grown on metal layer, method for manufacturing the same, and compund semiconductor device using the same |
| 05/14/2008 | EP1921667A2 Method for manufacturing semiconductor device |
| 05/14/2008 | EP1921120A1 Self-rolling laminated sheet and self-rolling pressure-sensitive adhesive sheet |
| 05/14/2008 | EP1921111A1 Epoxy resin composition and die bonding material comprising the composition |
| 05/14/2008 | EP1921061A1 Metal-containing compound, process for producing the same, metal-containing thin film, and method of forming the same |
| 05/14/2008 | EP1920885A1 Method of improving nanotopography of surface of wafer and wire saw apparatus |
| 05/14/2008 | EP1920874A1 Laser processing method |
| 05/14/2008 | EP1920467A2 Fin-type field effect transistor |
| 05/14/2008 | EP1920461A1 Method for producing through-contacts in semi-conductor wafers |
| 05/14/2008 | EP1920460A1 Methods of forming through-wafer interconnects and structures resulting therefrom |
| 05/14/2008 | EP1920459A1 Manufacturing method of semiconductor device |
| 05/14/2008 | EP1920458A1 Substrate processing unit, substrate transfer method, substrate cleansing process unit, and substrate plating apparatus |
| 05/14/2008 | EP1920457A2 Methods of forming openings into dielectric material |
| 05/14/2008 | EP1920456A1 Low resistance titanium nitride films |
| 05/14/2008 | EP1920455A2 Method of forming stacked capacitor dram cells |
| 05/14/2008 | EP1920454A2 Manufacture of photovoltaic devices |
| 05/14/2008 | EP1920007A1 Insulating liquid die-bonding agent and semiconductor device |
| 05/14/2008 | EP1620884B1 Organic polymers, laminates, and capacitors |
| 05/14/2008 | EP1551768A4 Process for manufacturing a gallium rich gallium nitride film |
| 05/14/2008 | EP1541667B1 Technique on ozone water for use in cleaning semiconductor substrate |
| 05/14/2008 | EP1537601B1 Jet singulation of a substrate |
| 05/14/2008 | EP1513962A4 Device for handling flat panels in a vacuum |
| 05/14/2008 | EP1454324B1 Segmented write line architecture |
| 05/14/2008 | EP1396027A4 Low-voltage punch-through bi-directional transient-voltage suppression devices and methods of making the same |
| 05/14/2008 | EP1373997B1 Method and apparatus for controlling a tool using a baseline control script |
| 05/14/2008 | EP0910870B1 Power semiconductor devices with a temperature sensor circuit |
| 05/14/2008 | EP0898785B1 Active matrix displays and method of making |
| 05/14/2008 | CN201060877Y Method for producing metal electrode of luminous diode |
| 05/14/2008 | CN201060863Y Vacuum suction nozzle device for semiconductor manufacture |
| 05/14/2008 | CN201060862Y Faulty goods acquisition and salable product complement device for full-automatic tray IC marking machine |
| 05/14/2008 | CN201060861Y Chain transferring apparatus for deflashing machine |
| 05/14/2008 | CN201060860Y Feeding box device for wafer back marking machine |
| 05/14/2008 | CN201060859Y Marking detector for wafer back marking machine |
| 05/14/2008 | CN201060858Y Component packaging system |
| 05/14/2008 | CN201060857Y Wafer in/out gate device for wafer back marking machine |
| 05/14/2008 | CN201060111Y Example random inspection device of integrated circuit die cutting molding apparatus |
| 05/14/2008 | CN201058765Y Material pushing device |
| 05/14/2008 | CN101180738A Complementary asymmetric high voltage devices and method of fabrication |
| 05/14/2008 | CN101180737A Power semiconductor devices and methods of manufacture |
| 05/14/2008 | CN101180734A Semiconductor device and method for manufacturing same |
| 05/14/2008 | CN101180725A Method for fabricating soi device |