Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
05/2008
05/29/2008US20080124192 Relay Station And Substrate Processing System Using Relay Station
05/29/2008US20080123935 Mask data creation method
05/29/2008US20080123713 Two-light flux interference exposure device, two-light flux interference exposure method, semiconductor light emitting element manufacturing method, and semiconductor light emitting element
05/29/2008US20080123711 Nitride light-emitting device
05/29/2008US20080123697 Method for making a high power semiconductor laser diode
05/29/2008US20080123696 Semiconductor laser device having scattering portion and method of fabricating the device
05/29/2008US20080123413 Multiple use memory chip
05/29/2008US20080123404 Reading voltage generator for a non-volatile eeprom memory cell matrix of a semiconductor device and corresponding manufacturing process
05/29/2008US20080123401 Damascene metal-insulator-metal (MIM) device with improved scaleability
05/29/2008US20080123397 Enhanced memory density resistance variable memory cells, arrays, devices and systems including the same, and methods of fabrication
05/29/2008US20080123390 Non-volatile memory device and method of fabricating the same
05/29/2008US20080123385 Interconnecting bit lines in memory devices for multiplexing
05/29/2008US20080123349 Optical device for led-based lamp
05/29/2008US20080123318 Multi-component electronic package with planarized embedded-components substrate
05/29/2008US20080123313 Semiconductor mount
05/29/2008US20080123299 Circuit Device and Manufacturing Method of the Same
05/29/2008US20080123246 Semiconductor device and method for fabricating the same
05/29/2008US20080123241 Mobile electrostatic carrier wafer with electrically isolated charge storage
05/29/2008US20080123200 Method and device for forming poly-silicon film
05/29/2008US20080123176 Process for creating ohmic contact
05/29/2008US20080123089 Quality control method for making a biochip displaying an encoded bead array
05/29/2008US20080122896 Inkjet printhead with backside power return conductor
05/29/2008US20080122895 Nozzle members, compositions, and methods for micro-fluid ejection heads
05/29/2008US20080122574 Polysilicon containing resistor with enhanced sheet resistance precision and method for fabrication thereof
05/29/2008US20080122560 Three dimensional integrated passive device and method of fabrication
05/29/2008US20080122479 Low power consumption mis semiconductor device
05/29/2008US20080122462 Method of inspecting pattern and inspecting instrument
05/29/2008US20080122395 Driving apparatus, exposure apparatus, and device manufacturing method
05/29/2008US20080122125 Methods to reduce the critical dimension of semiconductor devices and partially fabricated semiconductor devices having reduced critical dimensions
05/29/2008US20080122124 Overlay mark, method for forming the same and application thereof
05/29/2008US20080122122 Semiconductor package with encapsulant delamination-reducing structure and method of making the package
05/29/2008US20080122121 Semiconductor device having a interlayer insulation film with low dielectric constant and high mechanical strength
05/29/2008US20080122119 Method and apparatus for creating rfid devices using masking techniques
05/29/2008US20080122118 Silica nanoparticles thermoset resin compositions
05/29/2008US20080122117 Fusible I/O interconnection systems and methods for flip-chip packaging involving substrate-mounted stud-bumps
05/29/2008US20080122116 Method of forming metal layer wiring structure on backside of wafer, metal layer wiring structure formed using the method, method of stacking chip package, and chip package stack structure formed using the method
05/29/2008US20080122115 Three-dimensional Wafer Stacking with Vertical Interconnects
05/29/2008US20080122114 Bonding structures and methods of forming bonding structures
05/29/2008US20080122113 Semiconductor device assemblies and systems including at least one conductive pathway extending around a side of at least one semiconductor device and methods for forming the same
05/29/2008US20080122111 Semiconductor device and fabricating method thereof
05/29/2008US20080122110 Contact aperture and contact via with stepped sidewall and methods for fabrication thereof
05/29/2008US20080122109 Porous and dense hybrid interconnect structure and method of manufacture
05/29/2008US20080122107 Poly silicon hard mask
05/29/2008US20080122106 Method to generate airgaps with a template first scheme and a self aligned blockout mask
05/29/2008US20080122105 Structure for preventing pad peeling and method of fabricating the same
05/29/2008US20080122104 Damascene interconnect structure having air gaps between metal lines and method for fabricating the same
05/29/2008US20080122103 Embedded nano uv blocking barrier for improved reliability of copper/ultra low k interlevel dielectric electronic devices
05/29/2008US20080122101 Manufacturing Method Of Semiconductor Device And Semiconductor Device Produced Therewith
05/29/2008US20080122100 Novel bond pad design to minimize dielectric cracking
05/29/2008US20080122098 Nonvolatile semiconductor memory and method for fabricating the same
05/29/2008US20080122097 Method of forming metal wiring in semiconductor device
05/29/2008US20080122096 Methods for lateral current carrying capability improvement in semiconductor devices
05/29/2008US20080122094 Method of manufacturing semiconductor device and semiconductor device
05/29/2008US20080122093 Semiconductor device and method for manufacturing the same
05/29/2008US20080122092 Semiconductor Device and Method of Manufacturing the Same
05/29/2008US20080122091 Semiconductor device and method for producing a semiconductor device
05/29/2008US20080122090 Interconnect Structures with Liner Repair Layers and Methods for Forming Such Interconnection Structures
05/29/2008US20080122088 Electronic Packaging Materials for Use with Low-K Dielectric-Containing Semiconductor Devices
05/29/2008US20080122087 Semiconductor device with no base member and method of manufacturing the same
05/29/2008US20080122086 Solder bump structure and method of manufacturing same
05/29/2008US20080122085 Semiconductor device and a method of manufacturing the same
05/29/2008US20080122084 Flip-chip assembly and method of manufacturing the same
05/29/2008US20080122083 Semiconductor module and method of manufacturing the same
05/29/2008US20080122081 Method of fabricating electronic device having sacrificial anode, and electronic device fabricated by the same
05/29/2008US20080122079 Package substrate and manufacturing method thereof
05/29/2008US20080122078 Systems and methods to passivate on-die redistribution interconnects
05/29/2008US20080122077 Chip and manufacturing method and application thereof
05/29/2008US20080122075 Semiconductor module with at least two substrates
05/29/2008US20080122074 Multi-chip electronic circuit module and a method of manufacturing
05/29/2008US20080122070 Heat dissipating semiconductor package and fabrication method therefor
05/29/2008US20080122065 Integrated circuit package system with pedestal structure
05/29/2008US20080122058 Partially stacked semiconductor devices
05/29/2008US20080122055 Method and system for fabricating semiconductor components with lens structures and lens support structures
05/29/2008US20080122050 Semiconductor Device And Production Method For Semiconductor Device
05/29/2008US20080122049 Leadframe finger design to ensure lead-locking for enhanced fatigue life of bonding wire in an overmolded package
05/29/2008US20080122045 Dual liner capping layer interconnect structure
05/29/2008US20080122044 Method manufacturing capacitor dielectric
05/29/2008US20080122043 Layered Semiconductor Wafer With Low Warp And Bow, And Process For Producing It
05/29/2008US20080122042 Applications of polycrystalline wafers
05/29/2008US20080122041 Semiconductor device and method for producing such a device
05/29/2008US20080122040 Varying Pitch Adapter and a Method of Forming a Varying Pitch Adapter
05/29/2008US20080122039 Intergrated circuit device, chip, and method of fabricating the same
05/29/2008US20080122038 Guard ring structure with metallic materials
05/29/2008US20080122037 Prevention of backside cracks in semiconductor chips or wafers using backside film or backside wet etch
05/29/2008US20080122035 Semiconductor device
05/29/2008US20080122033 Semiconductor device and manufacturing the same
05/29/2008US20080122032 Semiconductor devices with MIM-type decoupling capacitors and fabrication method thereof
05/29/2008US20080122031 Vertical electrical device
05/29/2008US20080122030 Methods for enhancing trench capacitance and trench capacitor
05/29/2008US20080122028 Inductor formed on a semiconductor substrate and method for forming the same
05/29/2008US20080122027 Semiconductor device and method of cutting electrical fuse
05/29/2008US20080122023 Method of manufacturing cmos image sensor
05/29/2008US20080122022 Solid state imaging device and method of manufacturing the same
05/29/2008US20080122020 Microelectromechanical devices and fabrication methods
05/29/2008US20080122019 Semiconductor Device and Method of Manufacturing the Same
05/29/2008US20080122018 work function adjustment on fully silicided (fusi) gate
05/29/2008US20080122017 Semiconductor device and fabricating method thereof
05/29/2008US20080122016 Semiconductor device and fabricating method thereof
05/29/2008US20080122015 Modulated-Vt transistor
05/29/2008US20080122013 Semiconductor structure with multiple fins having different channel region heights and method of forming the semiconductor structure
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