Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
06/2008
06/26/2008WO2008076663A1 Method for selective removal of damaged multi-stack bilayer films
06/26/2008WO2008076651A1 Semiconductor structure and method of manufacture
06/26/2008WO2008076644A1 Method of creating a solid object from a material and apparatus thereof
06/26/2008WO2008076635A2 Stacked flip-assembled semiconductor chips embedded in thin hybrid substrate
06/26/2008WO2008076634A1 Method for manufacturing an isolation structure using an energy beam treatment
06/26/2008WO2008076428A1 Chip capacitor embedded pwb
06/26/2008WO2008076408A1 Showerhead electrode assembly with gas flow modification for extended electrode life
06/26/2008WO2008076319A1 Heater apparatus and associated method
06/26/2008WO2008076292A1 In-situ reclaim of volatile components
06/26/2008WO2008076171A1 Method of transferring strained semiconductor structures
06/26/2008WO2008076126A1 High thermal performance packaging for circuit dies
06/26/2008WO2008076080A2 A clamping assembly
06/26/2008WO2008075970A1 Method and device for se aration of silicon wafers
06/26/2008WO2008075841A1 Device for generating haze on a photomask
06/26/2008WO2008075840A1 Device for generating haze on a photomask
06/26/2008WO2008075838A1 Semiconductor integrated circuit having heat release pattern
06/26/2008WO2008075749A1 Exposure method and apparatus and substrate holding apparatus
06/26/2008WO2008075742A1 Maintenance method, exposure method and exposure device, and method for fabricating device
06/26/2008WO2008075727A1 Semiconductor device and method for manufacturing semiconductor device
06/26/2008WO2008075714A1 Method for manufacturing thin film electronic device mounted substrate, and electronic apparatus
06/26/2008WO2008075656A1 Semiconductor device
06/26/2008WO2008075643A1 Substrate treating apparatus and method of treating substrate
06/26/2008WO2008075642A1 Semiconductor device and method for manufacturing the same
06/26/2008WO2008075637A1 Gas for plasma reaction, dry etching method, and method for forming fluorocarbon film
06/26/2008WO2008075625A1 Semiconductor device
06/26/2008WO2008075611A1 Circuit simulator, circuit simulation method and program
06/26/2008WO2008075609A1 Adhesive sheet for semiconductor device production and method for producing semiconductor device by using the same
06/26/2008WO2008075599A1 Electron lithography method
06/26/2008WO2008075581A1 Nitride semiconductor light emitting element and method for manufacturing the same
06/26/2008WO2008075550A1 Sheet bonding device and method
06/26/2008WO2008075537A1 Electrode structure and method for forming bump
06/26/2008WO2008075495A1 Photosensitive resin composition for forming insulating film, hardened film thereof and electronic part having the same
06/26/2008WO2008075488A1 Lateral junction field effect transistor
06/26/2008WO2008075449A1 Method for manufacturing deformation silicon substrate
06/26/2008WO2008075446A1 Individuating device for producing electronic component
06/26/2008WO2008075404A1 Semiconductor manufacturing system
06/26/2008WO2008075401A1 Board structure, process for manufacturing circuit board, method of inspecting circuit board and electronic equipment
06/26/2008WO2008075399A1 Slide conveyance device
06/26/2008WO2008075340A1 A chuck and a method for supporting an object
06/26/2008WO2008075328A1 A method of fabricating heat sinks and heat exchangers
06/26/2008WO2008074862A1 Method for forming microwires and/or nanowires
06/26/2008WO2008074688A1 Process for fabricating a high-integration-density image sensor
06/26/2008WO2008074672A1 Improving adhesion of diffusion barrier on cu containing interconnect element
06/26/2008WO2008074291A1 Method for the production of vias and conductor tracks
06/26/2008WO2008074185A1 Integrated circuit package and its manufacturing method, memory system
06/26/2008WO2008074064A1 Method of coating
06/26/2008WO2008057872A3 Vertical integration of passive component in semiconductor device package for high electrical performance
06/26/2008WO2008057770A3 Partially patterned lead frames and methods of making and using the same in semiconductor packaging
06/26/2008WO2008057567A3 Vacuum end effector for handling highly shaped substrates
06/26/2008WO2008055105A3 Non-pull back pad package with an additional solder standoff
06/26/2008WO2008054680A3 A metallization layer stack without a terminal aluminum metal layer
06/26/2008WO2008042566A3 Semiconductor device with circuits formed with essentially uniform pattern density
06/26/2008WO2008042304A3 Interconnect structure using through wafer vias and method of fabrication
06/26/2008WO2008039745A3 Terminal structure of an ion implanter
06/26/2008WO2008038237A3 Silicide formation on a wafer
06/26/2008WO2008036590A3 Method for aligning color filters to a back-illuminated imaging array
06/26/2008WO2008020972A3 Technique for low-temperature ion implantation
06/26/2008WO2008016740A3 Interconnect structure and process of making the same
06/26/2008WO2007127533A3 Method for forming a semiconductor device having a fin and structure thereof
06/26/2008WO2007103643B1 Method and apparatus for thermal processing structures formed on a substrate
06/26/2008WO2007081964A3 Silicon carbide dimpled substrate
06/26/2008WO2007081510A3 Back side contact solar cell structures and fabrication processes
06/26/2008WO2006039669A3 E-fuse with reverse bias p-n junction
06/26/2008US20080155489 Macrocell, integrated circuit device, and electronic instrument
06/26/2008US20080155045 Group management system, server system and program therefor
06/26/2008US20080154365 Method for integrating pre-fabricated chip structures into functional electronic systems
06/26/2008US20080153731 wafer cleaning during chemical mechanical polish to prevent an electrical charge and remove particles while producing wafer of semiconductors; mixture comprising citric acid and a modified polyoxyethylene glycol with hydroxyacetic acid, and fatty alcohol
06/26/2008US20080153400 Chemical mechanical polishing apparatus
06/26/2008US20080153315 Wafer processing method
06/26/2008US20080153314 Semiconductor manufacture; improved substrate processing efficiency; gas inlet tube is positioned for side flow; substrate can be effectively heated via the reaction tube because a heating element is disposed between the reaction tube and the heat insulator of the heating apparatus
06/26/2008US20080153313 Method for producing a semiconductor-on-insulator structure
06/26/2008US20080153312 Methods for Exposure for the Purpose of Thermal Management for Imprint Lithography Processes
06/26/2008US20080153311 Method for depositing an amorphous carbon film with improved density and step coverage
06/26/2008US20080153310 Integrated Circuit Having Ultralow-K Dielectric Layer
06/26/2008US20080153309 Substrate Processing Apparatus and Semiconductor Device Producing Method
06/26/2008US20080153308 Substrate Processing Apparatus
06/26/2008US20080153307 Method of producing semiconductor device
06/26/2008US20080153306 Dry photoresist stripping process and apparatus
06/26/2008US20080153305 Exposing the metal surface to a passivation gas, and exposing the freshly etched metal structures to a second particle beam in the presence of the passivation gas; stabilizing metal structures on a substrate such as a semiconductor wafer or photomask; prevents overetching
06/26/2008US20080153304 Method of producing a semiconductor device
06/26/2008US20080153303 Field effect transistor, compound semiconductor substrate and process for forming a recess therein
06/26/2008US20080153302 Forming heaters for phase change memories
06/26/2008US20080153301 Set of masks, method of generating mask data and method for forming a pattern
06/26/2008US20080153300 Method for forming fine pattern of semiconductor device
06/26/2008US20080153299 Semiconductor Device And Method For Forming A Pattern In The Same With Double Exposure Technology
06/26/2008US20080153298 Memory device etch methods
06/26/2008US20080153297 Fabricating Method of a Semiconductor Device
06/26/2008US20080153296 Method of formation of a damascene structure utilizing a protective film
06/26/2008US20080153295 Method of fabricating openings and contact holes
06/26/2008US20080153294 Method for forming self aligned contacts for integrated circuit devices
06/26/2008US20080153293 Silicon carbide polishing method utilizing water-soluble oxidizers
06/26/2008US20080153292 Silicon carbide polishing method utilizing water-soluble oxidizers
06/26/2008US20080153291 Method and Apparatus for Material Deposition
06/26/2008US20080153290 Method of forming contact
06/26/2008US20080153289 Method for manufacturing semiconductor devices and plug
06/26/2008US20080153288 Method for manufacturing semiconductor device
06/26/2008US20080153287 Method for patterning a semiconductor device
06/26/2008US20080153286 Semiconductor chip and method of manufacturing semiconductor chip
06/26/2008US20080153285 Patterning Metal Layers
06/26/2008US20080153284 Method of Manufacturing Semiconductor Device
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