Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
09/2008
09/04/2008WO2008105531A1 Pellicle frame apparatus, mask, exposure method, exposure apparatus and device manufacturing method
09/04/2008WO2008105520A1 Polishing composition
09/04/2008WO2008105496A1 Interposer with capacitor mounted thereon and method for manufacturing the interposer
09/04/2008WO2008105460A1 Observation device, inspection device and inspection method
09/04/2008WO2008105451A1 METHOD FOR FORMING SrTiO3 FILM AND STORAGE MEDIUM
09/04/2008WO2008105444A1 Substrate transfer apparatus
09/04/2008WO2008105426A1 Bonding apparatus, and bonding method
09/04/2008WO2008105425A1 Bonding apparatus, and bonding method
09/04/2008WO2008105378A1 Field effect transistor of semiconductor formed from nitride of an element belonging to group-iii on the periodic table
09/04/2008WO2008105372A1 Method for manufacturing magnetic storage device and magnetic storage device
09/04/2008WO2008105360A1 Semiconductor device manufacturing method and semiconductor device manufacturing apparatus
09/04/2008WO2008105344A1 Interlayer insulation film, interconnect structure, and methods for production thereof
09/04/2008WO2008105342A1 Metal polishing liquid and polishing method
09/04/2008WO2008105321A1 Method for forming amorphous carbon film, amorphous carbon film, multilayer resist film, method for manufacturing semiconductor device, and computer-readable recording medium
09/04/2008WO2008105315A1 Method for manufacturing magnetic memory chip device
09/04/2008WO2008105309A1 Resin composition for nanoimprinting
09/04/2008WO2008105293A1 Resin composition for micropattern formation and method of micropattern formation
09/04/2008WO2008105266A1 Resist lower layer film forming composition for electron lithography
09/04/2008WO2008105255A1 Method of cleaning plasma-treating apparatus, plasma-treating apparatus where the cleaning method is practiced, and memory medium memorizing program executing the cleaning method
09/04/2008WO2008105226A1 Work stage for exposure device, exposure method, and method of manufacturing structure body
09/04/2008WO2008105223A1 Cmp slurry for silicon film
09/04/2008WO2008105204A1 Semiconductor device and process for producing the semiconductor device
09/04/2008WO2008105169A1 Adhesive film for semiconductor and semiconductor device using the adhesive film
09/04/2008WO2008105136A1 Method for manufacturing silicon single crystal wafer
09/04/2008WO2008105101A1 Process for producing laminated substrate and laminated substrate
09/04/2008WO2008105100A1 Semiconductor device and process for manufacturing the same
09/04/2008WO2008105077A1 Compound semiconductor device and process for producing the same
09/04/2008WO2008104881A1 Silicon-based antifrelective coating compositions
09/04/2008WO2008104874A1 Process for making siloxane polymers
09/04/2008WO2008104596A1 Carrier system and method for processing a plurality of substrates fixed to the carrier system
09/04/2008WO2008104560A1 Method for producing a component using asymmetrical energy input along the parting or predetermined breaking line
09/04/2008WO2008104066A1 Method and system for the inspection of integrated circuit devices having leads
09/04/2008WO2008089401A3 Flexible transparent electrodes via nanowires and sacrificial conductive layer
09/04/2008WO2008088831A3 Coiled circuit device with active circuitry and methods for making the same
09/04/2008WO2008080087A3 Recessed active trench for wide transistors
09/04/2008WO2008079684A3 Electron blocking layers for electronic devices
09/04/2008WO2008073414A8 Crystal growth of m-plane and semipolar planes of(ai, in, ga, b)n on various substrates
09/04/2008WO2008070632B1 Phosphorus-stabilized transition metal oxide diffusion barrier
09/04/2008WO2008051880B1 Method and apparatus for sample extraction and handling
09/04/2008WO2008014228A3 Raised sti structure and superdamascene technique for nmosfet performance enhancement with embedded silicon carbon
09/04/2008WO2007127872A3 Method and system to measure flow velocity and volume
09/04/2008WO2007124209A3 Stressor integration and method thereof
09/04/2008WO2007109568A3 Method and structure for fabricating solar cells
09/04/2008WO2007001838B1 Methods and apparatus for igniting a low pressure plasma
09/04/2008WO2006055601B1 Method for fabricating and separating semiconductor devices
09/04/2008US20080216046 Pattern management method and pattern management program
09/04/2008US20080216045 Mask data processing method for optimizing hierarchical structure
09/04/2008US20080216027 Electronic Design for Integrated Circuits Based on Process Related Variations
09/04/2008US20080215914 Self-reparable semiconductor and method thereof
09/04/2008US20080215295 Method Of Analysis, Exposure Apparatus, And Exposure Apparatus System
09/04/2008US20080215275 Overlay Inspection System
09/04/2008US20080215274 Evaluation method of fine pattern feature, its equipment, and method of semiconductor device fabrication
09/04/2008US20080214422 Thinner composition and method of removing photoresist using the same
09/04/2008US20080214093 cerium oxide particles, a dispersing agent (lauryl betaine), a water-soluble polymer containing N-mono-substituted product and an N,N-di-substituted product of any one selected from acrylamide, methacrylamide and alpha -substituted product; polishing a silicon dioxide film
09/04/2008US20080214021 Method of crystallizing semiconductor film and method of manufacturing semiconductor device
09/04/2008US20080214020 Manufacturing method of semiconductor device subjected to heat treatment by use of optical heating apparatus
09/04/2008US20080214019 Jetting high pressure solution containing oxygen source; low temperature, damage prevention technique
09/04/2008US20080214018 Template derivative for forming ultra-low dielectric layer and method of forming ultra-low dielectric layer using the same
09/04/2008US20080214017 Forming Method and Forming System for Insulation Film
09/04/2008US20080214016 Process for reactive ion etching a layer of diamond like carbon
09/04/2008US20080214015 Semiconductor devices and methods of manufacture thereof
09/04/2008US20080214014 Absorber layer candidates and techniques for application
09/04/2008US20080214013 Method for Removal of Bulk Metal Contamination from III-V Semiconductor Substrates
09/04/2008US20080214012 Apparatus and method for fabricating semiconductor devices and substrates
09/04/2008US20080214011 Method for Fabricating Dual Damascene Structures
09/04/2008US20080214010 Semiconductor device fabrication method and pattern formation mold
09/04/2008US20080214009 Methods of Forming a Recess Structure and Methods of Manufacturing a Semiconductor Device Having a Recessed-Gate Structure
09/04/2008US20080214008 Method of manufacturing semiconductor device
09/04/2008US20080214007 Method for removing diamond like carbon residue from a deposition/etch chamber using a plasma clean
09/04/2008US20080214006 Including amino phosphonates, polyamines and/or polycarboxylic acids in aqueous oxide and metal etchant solution
09/04/2008US20080214005 Chemical solution feeding apparatus and method for preparing slurry
09/04/2008US20080214004 Method for manufacturing a semiconductor device and semiconductor device
09/04/2008US20080214003 Methods for forming a ruthenium-based film on a substrate
09/04/2008US20080214002 Cleaning solution and manufacturing method for semiconductor device
09/04/2008US20080214001 Unsymmetrical ligand sources, reduced symmetry metal-containing compounds, and systems and methods including same
09/04/2008US20080214000 Polishing composition and polishing method using the same
09/04/2008US20080213999 Compositions and methods for forming and depositing metal films on semiconductor substrates using supercritical solvents
09/04/2008US20080213998 Method for manufacturing semiconductor device, semiconductor manufacturing apparatus and storage medium for executing the method
09/04/2008US20080213997 Selective copper-silicon-nitride layer formation for an improved dielectric film/copper line interface
09/04/2008US20080213996 Designs and methods for conductive bumps
09/04/2008US20080213995 Ultrasonic electropolishing of conductive material
09/04/2008US20080213994 Treating a liner layer to reduce surface oxides
09/04/2008US20080213993 Method and Apparatus of Stress Relief in Semiconductor Structures
09/04/2008US20080213992 Semiconductor package having enhanced heat dissipation and method of fabricating the same
09/04/2008US20080213991 Method of forming plugs
09/04/2008US20080213990 Method for forming gate electrode in semiconductor device
09/04/2008US20080213989 Silicon wafer for manufacturing soi wafer, soi wafer, and method for manufacturing soi wafer
09/04/2008US20080213988 Substrate heating apparatus and semiconductor fabrication method
09/04/2008US20080213987 Method of Fabricating a Sige Semiconductor Structure
09/04/2008US20080213986 Laser annealing method and laser annealing device
09/04/2008US20080213985 Method of forming polycrystalline silicon thin film and method of manufacturing thin film transistor using the method
09/04/2008US20080213984 Manufacturing method of semiconductor device
09/04/2008US20080213983 Method for manufacturing semiconductor device
09/04/2008US20080213982 Method of fabricating semiconductor wafer
09/04/2008US20080213981 Method of Fabricating a Silicon-On-Insulator Structure
09/04/2008US20080213980 Process Applied to Semiconductor
09/04/2008US20080213979 Method and apparatus for breaking semiconductor substrate, method for breaking solar cell and method for fabrication of solar cell module
09/04/2008US20080213978 Debris management for wafer singulation
09/04/2008US20080213977 Vacuum expansion of integrated circuits at sort
09/04/2008US20080213976 Methods for fabricating semiconductor components and packaged semiconductor components