Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
10/2008
10/02/2008US20080238702 Electrostatic discharge protection device with phosphors and method of fabricating the same
10/02/2008US20080238533 Semiconductor Device
10/02/2008US20080237898 Semiconductor device, method for manufacturing the same, heat sink, semiconductor chip, interposer substrate, and glass plate
10/02/2008US20080237896 Wafer level packages capable of reducing chipping defect and manufacturing methods thereof
10/02/2008US20080237894 Integrated circuit package and method for the same
10/02/2008US20080237889 Semiconductor package, method of fabricating the same, and semiconductor package mold
10/02/2008US20080237888 Multichip semiconductor device, chip therefor and method of formation thereof
10/02/2008US20080237883 Semiconductor device and method of manufacturing the same
10/02/2008US20080237882 Annular via drilling (AVD) technology
10/02/2008US20080237880 Integrated circuit package system with protected conductive layers
10/02/2008US20080237879 Semiconductor device package with die receiving through-hole and dual build-up layers over both side-surfaces for wlp and method of the same
10/02/2008US20080237878 Semiconductor device and method of producing the same
10/02/2008US20080237876 Semiconductor device and method for manufacturing the same
10/02/2008US20080237875 Semiconductor device and method for manufacturing the same
10/02/2008US20080237874 Method of Producing a Silicon Oxide-Based Material with a Low Dielectric Constant
10/02/2008US20080237873 Integrated circuit package system with bonding in via
10/02/2008US20080237872 Semiconductor Device and Method For Manufacturing Same
10/02/2008US20080237871 Method of Manufacturing a Semiconductor Device and Semiconductor Device Obtained With Such a Method
10/02/2008US20080237868 Method and structure for ultra narrow crack stop for multilevel semiconductor device
10/02/2008US20080237867 Low contact resistance metal contact
10/02/2008US20080237865 Semiconductor device including an amorphous nitrided silicon adhesion layer and method of manufacture therefor
10/02/2008US20080237863 Semiconductor device and manufacturing method of semiconductor device
10/02/2008US20080237861 Novel Fluorine-Free Precursors and Methods for the Deposition of Conformal Conductive Films for Nanointerconnect Seed and Fill
10/02/2008US20080237860 Interconnect structures containing a ruthenium barrier film and method of forming
10/02/2008US20080237859 Diffusion barrier for integrated circuits formed from a layer of reactive metal and method of fabrication
10/02/2008US20080237858 Electronic device and method of manufacturing the same
10/02/2008US20080237857 Semiconductor package
10/02/2008US20080237856 Semiconductor Package and Method for Fabricating the Same
10/02/2008US20080237853 Semiconductor device and manufacturing method of the same
10/02/2008US20080237851 Semiconductor device, manufacturing method thereof, composite metal body and manufacturing method thereof
10/02/2008US20080237850 Compliant bump structure and bonding structure
10/02/2008US20080237849 Method and apparatus providing integrated circuit having redistribution layer with recessed connectors
10/02/2008US20080237846 Semiconductor device and manufacturing method thereof
10/02/2008US20080237843 Microelectronic package including thermally conductive sealant between heat spreader and substrate
10/02/2008US20080237841 Microelectronic package, method of manufacturing same, and system including same
10/02/2008US20080237826 Method for protecting encapsulated sensor structures using stack packaging
10/02/2008US20080237823 Aluminum Based Bonding of Semiconductor Wafers
10/02/2008US20080237818 Methods and apparatus for multi-stage molding of integrated circuit package
10/02/2008US20080237816 Integrated circuit package system with encapsulating features
10/02/2008US20080237815 Tape carrier, semiconductor device, and method for manufacturing semiconductor device
10/02/2008US20080237812 Method of manufacturing semiconductor device and semiconductor device
10/02/2008US20080237810 Controlling substrate surface properties via colloidal coatings
10/02/2008US20080237805 Semiconductor Device and Method for Manufacturing Semiconductor Device
10/02/2008US20080237804 Quality of a thin layer through high-temperature thermal annealing
10/02/2008US20080237800 Integrated circuit having resistor between beol interconnect and feol structure and related method
10/02/2008US20080237798 Memory cell and process for manufacturing the same
10/02/2008US20080237797 Electrically tunable resistor and related methods
10/02/2008US20080237796 Increasing the surface area of a memory cell capacitor
10/02/2008US20080237795 Semiconductor device and method for manufacturing the same
10/02/2008US20080237794 Thin film capacitor
10/02/2008US20080237793 Semiconductor device having projection on lower electrode and method for forming the same
10/02/2008US20080237786 Non-planar fuse structure including angular bend and method for fabrication thereof
10/02/2008US20080237784 Semiconductor device and method of manufacturing a semiconductor device
10/02/2008US20080237781 Chip-stacked semiconductor device and manufacturing method thereof
10/02/2008US20080237780 SOI substrate and method for manufacturing SOI substrate
10/02/2008US20080237779 SOI substrate and method for manufacturing SOI substrate
10/02/2008US20080237778 Semiconductor device and method for manufacturing the same
10/02/2008US20080237775 Depletable cathode low charge storage diode
10/02/2008US20080237773 Integrated High Voltage Power Device Having an Edge Termination of Enhanced Effectiveness
10/02/2008US20080237772 Semiconductor device and temperature sensor structure for a semiconductor device
10/02/2008US20080237760 Substrate for Transparent Electrodes
10/02/2008US20080237757 Micro movable device, wafer, and method of manufacturing wafer
10/02/2008US20080237756 Microelectromechanical systems, and methods for encapsualting and fabricating same
10/02/2008US20080237752 Method for manufacturing semiconductor integrated circuit device
10/02/2008US20080237751 CMOS Structure and method of manufacturing same
10/02/2008US20080237744 Semiconductor Device and Manufacturing Method Thereof
10/02/2008US20080237743 Integration Scheme for Dual Work Function Metal Gates
10/02/2008US20080237742 Methods of forming improved epi fill on narrow isolation bounded source/drain regions and structures formed thereby
10/02/2008US20080237741 Methods of forming improved epi fill on narrow isolation bounded source/drain regions and structures formed thereby
10/02/2008US20080237740 Semiconductor device and the manufacturing method thereof
10/02/2008US20080237739 Method of manufacturing a semiconductor device and a semiconductor device
10/02/2008US20080237738 Integrated circuit, cell, cell arrangement, method for manufacturing an integrated circuit, method for manufacturing a cell arrangement; memory module
10/02/2008US20080237737 Overlapped stressed liners for improved contacts
10/02/2008US20080237735 Hetero-Bimos injection process for non-volatile flash memory
10/02/2008US20080237734 Complementary metal-oxide-semiconductor transistor and method of fabricating the same
10/02/2008US20080237733 Structure and method to enhance channel stress by using optimized sti stress and nitride capping layer stress
10/02/2008US20080237732 Semiconductor device and manufacturing method thereof
10/02/2008US20080237731 Semiconductor device and method of producing the same
10/02/2008US20080237730 Semiconductor device and method of producing the same
10/02/2008US20080237729 Patterned backside stress engineering for transistor performance optimization
10/02/2008US20080237728 Semiconductor device and method for manufacturing the same
10/02/2008US20080237727 Semiconductor device and method for manufacturing a semiconductor device
10/02/2008US20080237726 Structure and methods for stress concentrating spacer
10/02/2008US20080237725 Semiconductor device and method for manufacturing same
10/02/2008US20080237724 semiconductor thin film on which crystal grains with large diameters are formed over a wide range. A beam pattern including a plurality of recessed patterns is scan-irradiated to amorphous silicon in a first scanning direction (first crystallization step).
10/02/2008US20080237723 Method for creating tensile strain by repeatedly applied stress memorization techniques
10/02/2008US20080237722 Semiconductor device and method for fabricating the same
10/02/2008US20080237720 High mobility cmos circuits
10/02/2008US20080237719 Multi-gate structure and method of doping same
10/02/2008US20080237718 Methods of forming highly oriented diamond films and structures formed thereby
10/02/2008US20080237717 Fully Depleted SOI Multiple Threshold Voltage Application
10/02/2008US20080237716 Integrated circuit structures having a boron etch-stop layer and methods, devices and systems related thereto
10/02/2008US20080237715 Semiconductor device and manufacturing method thereof
10/02/2008US20080237714 Manufacturing Process for Zero-Capacitor Random Access Memory Circuits
10/02/2008US20080237713 Semiconductor device and manufacturing method thereof
10/02/2008US20080237712 Soi transistor having drain and source regions of reduced length and a stressed dielectric material adjacent thereto
10/02/2008US20080237711 Manufacturing method of thin-film semiconductor apparatus and thin-film semiconductor apparatus
10/02/2008US20080237710 Localized spacer for a multi-gate transistor
10/02/2008US20080237709 After gate fabrication of field effect transistor having tensile and compressive regions
10/02/2008US20080237701 Semiconductor component and method for producing it
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