Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
10/2008
10/01/2008CN100423287C Reverse conducting semiconductor device and a fabrication method thereof
10/01/2008CN100423286C Transistor structure with minimized parasitics and method of fabricating the same
10/01/2008CN100423285C Semiconductor substrate and its mfg. method, and semiconductor device and its mfg. method
10/01/2008CN100423284C Flat panel display
10/01/2008CN100423282C CMOS image sensor and method for fabricating the same
10/01/2008CN100423281C CMOS image sensor and method for manufacturing the same
10/01/2008CN100423280C Method for manufacturing CMOS image sensor
10/01/2008CN100423278C CMOS image sensors and methods for fabricating the same
10/01/2008CN100423277C Manufacturing method of semiconductor wafer having lid part and manufacturing method of semiconductor device
10/01/2008CN100423276C Semiconductor device and its producing method
10/01/2008CN100423275C TFT LCD array substrate peripheral wiring structure and its producing method
10/01/2008CN100423273C Nonvolatile semiconductor memory device and method of manufacturing the same
10/01/2008CN100423272C Semiconductor storage device and its operating method,semiconductordevice and portable electronic device
10/01/2008CN100423271C Dense array structure for non-volatile semiconductor memories
10/01/2008CN100423269C Method for forming storage node of capacitor in semiconductor device
10/01/2008CN100423267C Semiconductor storage device and its mfg method
10/01/2008CN100423265C Three dimension complementary metal oxide semiconductor transistor structure and it spreparing method
10/01/2008CN100423263C Field effect transistor structure, associated semiconductor storage cell, and corresponding production method
10/01/2008CN100423259C Stacked electronic part
10/01/2008CN100423258C Semiconductor device and its mfg. method
10/01/2008CN100423255C Semiconductor devices with wire bond inductor and method
10/01/2008CN100423254C Semiconductor device, method of manufacturing the same, capacitor structure, and method of manufacturing the same
10/01/2008CN100423252C Low profile integrated module interconnects
10/01/2008CN100423251C Semiconductor device package and lead frame with die overhanging lead frame pad
10/01/2008CN100423250C Double layer lead wire package structure and its producing method
10/01/2008CN100423249C N shape electric connectioned wafer stage chip size packaging structure and mfg. method thereof
10/01/2008CN100423245C Metal silicide nano-wire and its making method
10/01/2008CN100423241C 电路装置及其制造方法 Circuit device and manufacturing method thereof
10/01/2008CN100423239C Manufacture process for erase improvement in a non-volatile memory device
10/01/2008CN100423238C Bit line structure and method for the production thereof
10/01/2008CN100423237C Method for making cover screen type read only memory
10/01/2008CN100423236C Method of forming bit line of flash memory device
10/01/2008CN100423235C Manufacturing method for a recessed channel array transistor and corresponding recessed channel array transistor
10/01/2008CN100423234C Semiconductor device manufacturing method
10/01/2008CN100423233C Method of fabricating nano-scale resistance cross-point memory array and device
10/01/2008CN100423232C Method for preparing nanoelectronic memory by electron beam exposure and mechanochemical polishing process
10/01/2008CN100423231C Preparation method of nanometer heating electrode of phase-change storage
10/01/2008CN100423230C Method for operating a memory element,Non-volatile memory device and method producing the same
10/01/2008CN100423229C Method for forming contact window
10/01/2008CN100423228C Dual-metal inserting structure and producing method thereof
10/01/2008CN100423227C Method for manufacturing semiconductor device
10/01/2008CN100423226C Method for producing double embedded structure
10/01/2008CN100423225C Method of forming protruding metal portions by differential planarization
10/01/2008CN100423224C Wafer lifting device and lifting method
10/01/2008CN100423223C Testing method for detecting localized failure on a semiconductor wafer
10/01/2008CN100423222C Method and device for detecting contact holes in plasma processing system
10/01/2008CN100423221C Method for manufacturing electrical contact element for testing electro device and electrical contact element thereby
10/01/2008CN100423220C Electronic element press connection device
10/01/2008CN100423219C Capillary for wire bonding
10/01/2008CN100423218C Method for gluing a circuit component to a circuit substrate
10/01/2008CN100423217C Substrate for device bonding, device bonded substrate, and method for producing same
10/01/2008CN100423216C Method for forming suspended transmission line structures in back end of line processing
10/01/2008CN100423215C Shaped nanocrystal particles and methods for working the same
10/01/2008CN100423214C Method for manufacturing metal oxide semiconductor transistor
10/01/2008CN100423213C Non-volatile memory operating method
10/01/2008CN100423212C Component of metal oxide semiconductor transistor in high voltage, and fabricating method
10/01/2008CN100423211C Capacitor and method for producing a capacitor
10/01/2008CN100423210C Super low dielectric constant film and its producing method
10/01/2008CN100423209C Method for selectively removing material from the surface of a substrate, masking material for a wafer and wafer provided with a masking material
10/01/2008CN100423208C Dielectric etch method with high source and low bombardment plasma providing high etch rates
10/01/2008CN100423207C Process monitor and system for producing semiconductor
10/01/2008CN100423206C Method and system for processing substrate using mist chemical agent produced by heating chemical gas
10/01/2008CN100423205C Substrate cleaning method, substrate cleaning apparatus and computer-readable recording medium
10/01/2008CN100423204C Method of processing silicon wafer
10/01/2008CN100423203C Substrate holding device and polishing device
10/01/2008CN100423202C Method for using special chelant for micro electronic
10/01/2008CN100423201C Hardenable pressure sensitive adhesive sheet for dicing/die-bonding and method for manufacturing semiconductor device
10/01/2008CN100423200C Semiconductor manufacturing apparatus and pattern formation method
10/01/2008CN100423199C Composition for forming silicon-cobalt film, silicon-cobalt film, and forming method therefor
10/01/2008CN100423198C Method for producing MOS transistor with shallow-source electrode/drain electrode junction region
10/01/2008CN100423197C Composition for forming silicon film and method for forming silicon film
10/01/2008CN100423196C Helical resonator type plasma processing apparatus
10/01/2008CN100423195C Fluid feeding apparatus
10/01/2008CN100423194C Plasma film forming system
10/01/2008CN100423193C Semiconductor producing method for preventing crystal border film layer from stripping and interconnection wire producing method
10/01/2008CN100423192C Method and apparatus for multilayer photoresist dry development
10/01/2008CN100423191C Method and compositions for hardening photoresist in etching processes
10/01/2008CN100423190C Silicon wafer cleaning method
10/01/2008CN100423189C Semiconductor device manufacturing method for preventing patterns from inclining in drying process
10/01/2008CN100423188C Fault detection method in chip etching technology
10/01/2008CN100423187C Silicon-chip separating process
10/01/2008CN100423186C Method and device for preventing grain defect of wafer in use for vacuum system
10/01/2008CN100423185C Apparatus and method for alignment of a bonding tool
10/01/2008CN100423184C Wafer temperature trajectory control method for high temperature ramp rate applications using dynamic predictive thermal modeling
10/01/2008CN100423183C Umbilical cord facilities connection for an ion beam implanter
10/01/2008CN100423182C Methods of reducing photoresist distortion while etching in a plasma processing system
10/01/2008CN100423181C Method for controlling critical dimensions during an etch process
10/01/2008CN100423180C Shared sensors for detecting substrate position/presence
10/01/2008CN100423179C Transfer chamber for vacuum processing system
10/01/2008CN100423178C Integrated driver process flow
10/01/2008CN100423134C Internal power supply voltage controller with two standard voltage generation circuit
10/01/2008CN100423128C Semiconductor stroage device with storage unit of low unit ratio
10/01/2008CN100423064C Displaying device and its mfg. method
10/01/2008CN100423043C Two-dimensional display panel construction and manufacturing method thereof
10/01/2008CN100422888C System and method for controlling batches in layers of reaction chamber
10/01/2008CN100422856C Measuring method and correction method for illumination irregularity of exposure device
10/01/2008CN100422855C Lithographic apparatus and device manufacturing method and device made therefrom
10/01/2008CN100422854C Method for reducing lead wire figure by T-shaped photoresist pattern
10/01/2008CN100422853C Anticorrosion agent composition
10/01/2008CN100422832C Liquid crystal display device and fabricating method thereof