| Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974) |
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| 10/01/2008 | CN100423287C Reverse conducting semiconductor device and a fabrication method thereof |
| 10/01/2008 | CN100423286C Transistor structure with minimized parasitics and method of fabricating the same |
| 10/01/2008 | CN100423285C Semiconductor substrate and its mfg. method, and semiconductor device and its mfg. method |
| 10/01/2008 | CN100423284C Flat panel display |
| 10/01/2008 | CN100423282C CMOS image sensor and method for fabricating the same |
| 10/01/2008 | CN100423281C CMOS image sensor and method for manufacturing the same |
| 10/01/2008 | CN100423280C Method for manufacturing CMOS image sensor |
| 10/01/2008 | CN100423278C CMOS image sensors and methods for fabricating the same |
| 10/01/2008 | CN100423277C Manufacturing method of semiconductor wafer having lid part and manufacturing method of semiconductor device |
| 10/01/2008 | CN100423276C Semiconductor device and its producing method |
| 10/01/2008 | CN100423275C TFT LCD array substrate peripheral wiring structure and its producing method |
| 10/01/2008 | CN100423273C Nonvolatile semiconductor memory device and method of manufacturing the same |
| 10/01/2008 | CN100423272C Semiconductor storage device and its operating method,semiconductordevice and portable electronic device |
| 10/01/2008 | CN100423271C Dense array structure for non-volatile semiconductor memories |
| 10/01/2008 | CN100423269C Method for forming storage node of capacitor in semiconductor device |
| 10/01/2008 | CN100423267C Semiconductor storage device and its mfg method |
| 10/01/2008 | CN100423265C Three dimension complementary metal oxide semiconductor transistor structure and it spreparing method |
| 10/01/2008 | CN100423263C Field effect transistor structure, associated semiconductor storage cell, and corresponding production method |
| 10/01/2008 | CN100423259C Stacked electronic part |
| 10/01/2008 | CN100423258C Semiconductor device and its mfg. method |
| 10/01/2008 | CN100423255C Semiconductor devices with wire bond inductor and method |
| 10/01/2008 | CN100423254C Semiconductor device, method of manufacturing the same, capacitor structure, and method of manufacturing the same |
| 10/01/2008 | CN100423252C Low profile integrated module interconnects |
| 10/01/2008 | CN100423251C Semiconductor device package and lead frame with die overhanging lead frame pad |
| 10/01/2008 | CN100423250C Double layer lead wire package structure and its producing method |
| 10/01/2008 | CN100423249C N shape electric connectioned wafer stage chip size packaging structure and mfg. method thereof |
| 10/01/2008 | CN100423245C Metal silicide nano-wire and its making method |
| 10/01/2008 | CN100423241C 电路装置及其制造方法 Circuit device and manufacturing method thereof |
| 10/01/2008 | CN100423239C Manufacture process for erase improvement in a non-volatile memory device |
| 10/01/2008 | CN100423238C Bit line structure and method for the production thereof |
| 10/01/2008 | CN100423237C Method for making cover screen type read only memory |
| 10/01/2008 | CN100423236C Method of forming bit line of flash memory device |
| 10/01/2008 | CN100423235C Manufacturing method for a recessed channel array transistor and corresponding recessed channel array transistor |
| 10/01/2008 | CN100423234C Semiconductor device manufacturing method |
| 10/01/2008 | CN100423233C Method of fabricating nano-scale resistance cross-point memory array and device |
| 10/01/2008 | CN100423232C Method for preparing nanoelectronic memory by electron beam exposure and mechanochemical polishing process |
| 10/01/2008 | CN100423231C Preparation method of nanometer heating electrode of phase-change storage |
| 10/01/2008 | CN100423230C Method for operating a memory element,Non-volatile memory device and method producing the same |
| 10/01/2008 | CN100423229C Method for forming contact window |
| 10/01/2008 | CN100423228C Dual-metal inserting structure and producing method thereof |
| 10/01/2008 | CN100423227C Method for manufacturing semiconductor device |
| 10/01/2008 | CN100423226C Method for producing double embedded structure |
| 10/01/2008 | CN100423225C Method of forming protruding metal portions by differential planarization |
| 10/01/2008 | CN100423224C Wafer lifting device and lifting method |
| 10/01/2008 | CN100423223C Testing method for detecting localized failure on a semiconductor wafer |
| 10/01/2008 | CN100423222C Method and device for detecting contact holes in plasma processing system |
| 10/01/2008 | CN100423221C Method for manufacturing electrical contact element for testing electro device and electrical contact element thereby |
| 10/01/2008 | CN100423220C Electronic element press connection device |
| 10/01/2008 | CN100423219C Capillary for wire bonding |
| 10/01/2008 | CN100423218C Method for gluing a circuit component to a circuit substrate |
| 10/01/2008 | CN100423217C Substrate for device bonding, device bonded substrate, and method for producing same |
| 10/01/2008 | CN100423216C Method for forming suspended transmission line structures in back end of line processing |
| 10/01/2008 | CN100423215C Shaped nanocrystal particles and methods for working the same |
| 10/01/2008 | CN100423214C Method for manufacturing metal oxide semiconductor transistor |
| 10/01/2008 | CN100423213C Non-volatile memory operating method |
| 10/01/2008 | CN100423212C Component of metal oxide semiconductor transistor in high voltage, and fabricating method |
| 10/01/2008 | CN100423211C Capacitor and method for producing a capacitor |
| 10/01/2008 | CN100423210C Super low dielectric constant film and its producing method |
| 10/01/2008 | CN100423209C Method for selectively removing material from the surface of a substrate, masking material for a wafer and wafer provided with a masking material |
| 10/01/2008 | CN100423208C Dielectric etch method with high source and low bombardment plasma providing high etch rates |
| 10/01/2008 | CN100423207C Process monitor and system for producing semiconductor |
| 10/01/2008 | CN100423206C Method and system for processing substrate using mist chemical agent produced by heating chemical gas |
| 10/01/2008 | CN100423205C Substrate cleaning method, substrate cleaning apparatus and computer-readable recording medium |
| 10/01/2008 | CN100423204C Method of processing silicon wafer |
| 10/01/2008 | CN100423203C Substrate holding device and polishing device |
| 10/01/2008 | CN100423202C Method for using special chelant for micro electronic |
| 10/01/2008 | CN100423201C Hardenable pressure sensitive adhesive sheet for dicing/die-bonding and method for manufacturing semiconductor device |
| 10/01/2008 | CN100423200C Semiconductor manufacturing apparatus and pattern formation method |
| 10/01/2008 | CN100423199C Composition for forming silicon-cobalt film, silicon-cobalt film, and forming method therefor |
| 10/01/2008 | CN100423198C Method for producing MOS transistor with shallow-source electrode/drain electrode junction region |
| 10/01/2008 | CN100423197C Composition for forming silicon film and method for forming silicon film |
| 10/01/2008 | CN100423196C Helical resonator type plasma processing apparatus |
| 10/01/2008 | CN100423195C Fluid feeding apparatus |
| 10/01/2008 | CN100423194C Plasma film forming system |
| 10/01/2008 | CN100423193C Semiconductor producing method for preventing crystal border film layer from stripping and interconnection wire producing method |
| 10/01/2008 | CN100423192C Method and apparatus for multilayer photoresist dry development |
| 10/01/2008 | CN100423191C Method and compositions for hardening photoresist in etching processes |
| 10/01/2008 | CN100423190C Silicon wafer cleaning method |
| 10/01/2008 | CN100423189C Semiconductor device manufacturing method for preventing patterns from inclining in drying process |
| 10/01/2008 | CN100423188C Fault detection method in chip etching technology |
| 10/01/2008 | CN100423187C Silicon-chip separating process |
| 10/01/2008 | CN100423186C Method and device for preventing grain defect of wafer in use for vacuum system |
| 10/01/2008 | CN100423185C Apparatus and method for alignment of a bonding tool |
| 10/01/2008 | CN100423184C Wafer temperature trajectory control method for high temperature ramp rate applications using dynamic predictive thermal modeling |
| 10/01/2008 | CN100423183C Umbilical cord facilities connection for an ion beam implanter |
| 10/01/2008 | CN100423182C Methods of reducing photoresist distortion while etching in a plasma processing system |
| 10/01/2008 | CN100423181C Method for controlling critical dimensions during an etch process |
| 10/01/2008 | CN100423180C Shared sensors for detecting substrate position/presence |
| 10/01/2008 | CN100423179C Transfer chamber for vacuum processing system |
| 10/01/2008 | CN100423178C Integrated driver process flow |
| 10/01/2008 | CN100423134C Internal power supply voltage controller with two standard voltage generation circuit |
| 10/01/2008 | CN100423128C Semiconductor stroage device with storage unit of low unit ratio |
| 10/01/2008 | CN100423064C Displaying device and its mfg. method |
| 10/01/2008 | CN100423043C Two-dimensional display panel construction and manufacturing method thereof |
| 10/01/2008 | CN100422888C System and method for controlling batches in layers of reaction chamber |
| 10/01/2008 | CN100422856C Measuring method and correction method for illumination irregularity of exposure device |
| 10/01/2008 | CN100422855C Lithographic apparatus and device manufacturing method and device made therefrom |
| 10/01/2008 | CN100422854C Method for reducing lead wire figure by T-shaped photoresist pattern |
| 10/01/2008 | CN100422853C Anticorrosion agent composition |
| 10/01/2008 | CN100422832C Liquid crystal display device and fabricating method thereof |