Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
09/2008
09/25/2008US20080233422 Coated nickel-containing powders
09/25/2008US20080233017 chemical reactor for oxidizing a specific portion of the semiconductor sample, to leave a central portion of the layer non-oxidized, by a current constricting part; monitoring window capable of confronting and control the semiconductor sample from outside the window; oxidation process control
09/25/2008US20080232948 Semiconductor wafer handling and transport
09/25/2008US20080232947 Semiconductor wafer handling and transport
09/25/2008US20080232939 Flat Panel Display Substrate Testing System
09/25/2008US20080232937 Substrate transfer apparatus, substrate transfer method, and storage medium
09/25/2008US20080232934 Modular cluster tool
09/25/2008US20080232933 Robotic Chamber Support Pedestal
09/25/2008US20080232755 Photonic crystals based on nanostructures
09/25/2008US20080232674 Method and apparatus for inspecting pattern defects
09/25/2008US20080232420 Light Emitting Diodes and Lasers Diodes with Color Converters
09/25/2008US20080232419 Laser array chip, laser module, manufacturing method for manufacturing laser module, manufacturing method for manufacturing laser light source, laser light source, illumination device, monitor, and projector
09/25/2008US20080232417 Semiconductor light emitting device and fabrication method for semiconductor light emitting device
09/25/2008US20080232162 One time programming cell structure and method of fabricating the same
09/25/2008US20080232154 Resistance memory element and method of manufacturing the same, and semiconductor memory device
09/25/2008US20080232074 Circuit Card Assembly Including Individually Testable Layers
09/25/2008US20080232022 Method and Device for Electrostatic Fixing of Substrates With Polarizable Molecules
09/25/2008US20080232011 Apparatus and methods for integrated circuit with devices with body contact and devices with electrostatic discharge protection
09/25/2008US20080231991 Method of Manufacturing a Magneto-Optical Device
09/25/2008US20080231866 Wafer center finding with charge-coupled devices
09/25/2008US20080231856 Substrate Inspection Apparatus, Substrate Inspection Method and Semiconductor Device Manufacturing Method
09/25/2008US20080231782 Pixel structure and manufacturing method thereof
09/25/2008US20080231584 Active matrix type display device
09/25/2008US20080231354 Semiconductor Device
09/25/2008US20080231305 Contact carriers (tiles) for populating larger substrates with spring contacts
09/25/2008US20080231168 Display substrate, organic light emitting diode display device, and manufacturing method thereof
09/25/2008US20080230928 Module comprising a semiconductor chip
09/25/2008US20080230927 Fully tested wafers having bond pads undamaged by probing and applications thereof
09/25/2008US20080230926 Surface Treatments for Contact Pads Used in Semiconductor Chip Packagages and Methods of Providing Such Surface Treatments
09/25/2008US20080230923 Chip stack package and method of manufacturing the chip stack package
09/25/2008US20080230922 Semiconductor device and its manufacturing method
09/25/2008US20080230921 Semiconductor device and method for manufacturing the same
09/25/2008US20080230920 Wire-Bonded Semiconductor Component with Reinforced Inner Connection Metallization
09/25/2008US20080230916 Semiconductor integrated circuit device and fabrication process thereof
09/25/2008US20080230914 Semiconductor element, method of manufacturing semiconductor element, multi-layer printed circuit board, and method of manufacturing multi-layer printed circuit board
09/25/2008US20080230913 Stackable semiconductor device and fabrication method thereof
09/25/2008US20080230912 Wafer-level stack package and method of fabricating the same
09/25/2008US20080230911 Method of forming a silicide layer on a thinned silicon wafer, and related semiconducting structure
09/25/2008US20080230910 Integrated circuit and method for producing the same
09/25/2008US20080230906 Contact structure having dielectric spacer and method
09/25/2008US20080230905 Power Semiconductor Module, Method for Producing a Power Semiconductor Module, and Semiconductor Chip
09/25/2008US20080230904 Gallium Nitride-Based III-V Group Compound Semiconductor Device and Method of Manufacturing the Same
09/25/2008US20080230903 Semiconductor chip, semiconductor device and method for producing the same
09/25/2008US20080230902 Method of Forming Solder Bump on High Topography Plated Cu
09/25/2008US20080230901 Structure for controlled collapse chip connection with displaced captured pads
09/25/2008US20080230899 Semiconductor device and manufacturing method thereof
09/25/2008US20080230898 Semiconductor device and method for manufacturing thereof
09/25/2008US20080230897 Method of manufacturing electronic device, substrate and semiconductor device
09/25/2008US20080230896 Copper die bumps with electromigration cap and plated solder
09/25/2008US20080230895 Semiconductor package and the method for manufacturing the same
09/25/2008US20080230894 Semiconductors encased in covering containing carbon nanotubes; circulation a fluid over nanothbes
09/25/2008US20080230891 Chip and wafer integration process using vertical connections
09/25/2008US20080230887 Semiconductor package and the method of making the same
09/25/2008US20080230885 Chip hermetic package device and method for producing the same
09/25/2008US20080230883 Integrated circuit package system with molded strip protrusion
09/25/2008US20080230881 Integrated circuit package system with lead support
09/25/2008US20080230880 Leadframe Array with Riveted Heat Sinks
09/25/2008US20080230879 Methods and apparatus for flip-chip-on-lead semiconductor package
09/25/2008US20080230877 Semiconductor package having wire redistribution layer and method of fabricating the same
09/25/2008US20080230874 Semiconductor device and method of producing semiconductor device
09/25/2008US20080230873 Semiconductor device with capacitor and/or inductor and method of making
09/25/2008US20080230872 Bipolar transistor and method for manufacturing the same
09/25/2008US20080230871 Semiconductor display device and method of manufacturing the same
09/25/2008US20080230870 Input protection circuit preventing electrostatic discharge damage of semiconductor integrated circuit
09/25/2008US20080230869 Ultra-thin soi vertical bipolar transistors with an inversion collector on thin-buried oxide (box) for low substrate-bias operation and methods thereof
09/25/2008US20080230866 Rfid temperature sensing wafer, system and method
09/25/2008US20080230864 Image Sensor and Method for Manufacturing the Same
09/25/2008US20080230861 CMOS front end process compatible low stress light shield
09/25/2008US20080230853 Channel layer arranged on substrate; source electrode and drain electrode, overcoating with dielectric then barrier electrode
09/25/2008US20080230851 Metal oxide semiconductor (mos) type semiconductor device and manufacturing method thereof
09/25/2008US20080230850 Method of manufacturing a semiconductor device and semiconductor device
09/25/2008US20080230849 Device comprising doped nano-component and method of forming the device
09/25/2008US20080230847 Semiconductor device and manufacturing method of the same
09/25/2008US20080230846 Method of manufacturing metal silicide contacts
09/25/2008US20080230845 Semiconductor device and method of forming the same
09/25/2008US20080230843 Isolation Structure for MOS Transistor and Method for Forming the Same
09/25/2008US20080230842 Semiconductor Device Having High-K Gate Dielectric Layer and Method For Manufacturing the Same
09/25/2008US20080230841 Integrated circuit system employing stress memorization transfer
09/25/2008US20080230839 Method of producing a semiconductor structure
09/25/2008US20080230838 Semiconductor memory device and manufacturing process therefore
09/25/2008US20080230837 Radiation-hardened silicon-on-insulator cmos device, and method of making the same
09/25/2008US20080230835 Semiconductor device and manufacturing method thereof
09/25/2008US20080230833 Semiconductor component and method for producing a semiconductor component
09/25/2008US20080230832 Transistor and method for fabricating the same
09/25/2008US20080230831 Semiconductor device and manufacturing method thereof
09/25/2008US20080230830 Nonvolatile memory device and method of fabricating the same
09/25/2008US20080230827 Scalable flash/nv structures and devices with extended endurance
09/25/2008US20080230826 Construction of flash memory chips and circuits from ordered nanoparticles
09/25/2008US20080230824 Double Gate Non-Volatile Memory Device and Method of Manufacturing
09/25/2008US20080230823 Semiconductor device and manufacturing method therefor
09/25/2008US20080230822 Vertical trench memory cell with insulating ring
09/25/2008US20080230818 Non-volatile memory device
09/25/2008US20080230816 Semiconductor device and method of manufacturing the same
09/25/2008US20080230815 Mitigation of gate to contact capacitance in CMOS flow
09/25/2008US20080230814 Methods for fabricating a semiconductor device
09/25/2008US20080230813 Semiconductor device and manufacturing method therefor
09/25/2008US20080230809 Semiconductor device and method of fabricating the same
09/25/2008US20080230807 Semiconductor Device
09/25/2008US20080230806 HBT and field effect transistor integration
09/25/2008US20080230805 Semiconductor device and method of manufacturing semiconductor device
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