| Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974) |
|---|
| 09/25/2008 | US20080230804 Semiconductor device and fabrication method of same |
| 09/25/2008 | US20080230803 Integrated Contact Interface Layer |
| 09/25/2008 | US20080230802 Semiconductor Device Comprising a Heterojunction |
| 09/25/2008 | US20080230801 Trench type power semiconductor device and method for manufacturing same |
| 09/25/2008 | US20080230800 N-Type Group III Nitride Semiconductor Layered Structure |
| 09/25/2008 | US20080230798 Active matrix organic electroluminescent substrate and method of making the same |
| 09/25/2008 | US20080230789 Light emitting device, method of manufacturing the same and monolithic light emitting diode array |
| 09/25/2008 | US20080230787 Silicon carbide semiconductor device, and method of manufacturing the same |
| 09/25/2008 | US20080230783 Image Sensor and Method for Manufacturing the Same |
| 09/25/2008 | US20080230781 Method of forming an oxygen- or nitrogen-terminated silicon nanocrystalline structure and an oxygen- or nitrogen-terminated silicon nanocrystalline structure formed by the method |
| 09/25/2008 | US20080230780 Group III Nitride Semiconductor Multilayer Structure |
| 09/25/2008 | US20080230775 Organic light emitting display device and method for manufacturing the same |
| 09/25/2008 | US20080230770 Organic light-emitting display panel and method of manufacturing the same |
| 09/25/2008 | US20080230767 Semiconductor device and method of manufacturing the same |
| 09/25/2008 | US20080230764 Composite structure; charge carrier confining zone, barrier and electroconductive layer; uniformity |
| 09/25/2008 | US20080230763 Metallic Nanospheres Embedded in Nanowires Initiated on Nanostructures and Methods for Synthesis Thereof |
| 09/25/2008 | US20080230762 Phase change memory elements having a confined portion of phase change material on a recessed contact |
| 09/25/2008 | US20080230725 Crystallization apparatus, crystallization method, device, and light modulation element |
| 09/25/2008 | US20080230585 ceramic base and a metallic member bonded together through an Au solder; a barrier layer interposed between, comprising chromium (Cr) which protects against or suppresses the diffusion of a metal into the solder material; semiconductor manufacturing |
| 09/25/2008 | US20080230535 Susceptor |
| 09/25/2008 | US20080230519 Method and system for dry etching a metal nitride |
| 09/25/2008 | US20080230518 Gas flow diffuser |
| 09/25/2008 | US20080230515 Power module member manufactured by wet treatment, and wet treatment method and wet treatment equipment thereof |
| 09/25/2008 | US20080230393 Method and apparatus for producing conductive material |
| 09/25/2008 | US20080230391 Methods for Electrochemically Fabricating Structures Using Adhered Masks, Incorporating Dielectric Sheets, and/or Seed layers That Are Partially Removed Via Planarization |
| 09/25/2008 | US20080230390 Contact substrate with conformation masking pattern on substrate; multilayer; three-dimensional structure; cyclic process; electroplating |
| 09/25/2008 | US20080230183 Releasing method and releasing apparatus of work having adhesive tape |
| 09/25/2008 | US20080230181 Plasma processing apparatus and structure therein |
| 09/25/2008 | US20080230180 Processing Equipment for Object to be Processed |
| 09/25/2008 | US20080230154 Absorber layer for dsa processing |
| 09/25/2008 | US20080230115 Method for fracturing semiconductor substrate, method for fracturing solar cell, and the solar cell |
| 09/25/2008 | US20080230110 Thin film photodetector, method and system |
| 09/25/2008 | US20080230097 Methods for Processing Wafer Surfaces Using Thin, High Velocity Fluid Layer |
| 09/25/2008 | US20080230007 Method and apparatus for manufacturing active matrix device including top gate type tft |
| 09/25/2008 | US20080229827 Electronic part, method for fabricating electronic part, acceleration sensor, and method for fabricating acceleration sensor |
| 09/25/2008 | US20080229573 System For Fabricating Semiconductor Components With Conductive Interconnects |
| 09/25/2008 | US20080229560 Bare die tray clip |
| 09/25/2008 | DE19839603B4 Destatisierende thermoplastische Harzzusammensetzung und deren Verwendung Destaticizing thermoplastic resin composition and the use thereof |
| 09/25/2008 | DE112006003042T5 Klebstoffzusammensetzung und Klebstofffilm The adhesive composition and adhesive film |
| 09/25/2008 | DE112006002913T5 Speicherzelle auf der Basis eines negativen differentiellen Widerstandes mit versenktem Kanal Memory cell based on a negative differential resistance buried channel |
| 09/25/2008 | DE112004001030B4 FINFET mit Doppelsiliziumgateschicht für chemisch-mechanische Poliereinebnung FinFET with double gate silicon layer for chemical mechanical Poliereinebnung |
| 09/25/2008 | DE112004000057B4 Plasmabehandlungsapparat und Plasmabehandlungsverfahren Plasma processing apparatus and plasma processing method |
| 09/25/2008 | DE10354421B4 Verfahren zur Herstellung einer Gatekontaktstruktur eines Trench-Hochleistungstransistors und mit diesem Verfahren hergestellter Hochleistungstransistor A process for producing a structure of a gate contact trench and high power transistor manufactured with this method, high power transistor |
| 09/25/2008 | DE10349582B4 Halbleiterdiode sowie dafür geeignetes Herstellungsverfahren Semiconductor diode as well as for suitable manufacturing process |
| 09/25/2008 | DE10324100B4 Verfahren zur Herstellung eines robusten Halbleiterbauelements Process for the preparation of a robust semiconductor device |
| 09/25/2008 | DE10297679B4 Dotierverfahren für vollständig verarmte SOI-Strukturen Doping for fully depleted SOI structures |
| 09/25/2008 | DE10297642B4 Verfahren zum Steuern der Höhe der Chiphalterandnaht, um Chipscherungsbelastungen zu reduzieren A method for controlling the level of the chip holding edge seam to reduce Chipscherungsbelastungen |
| 09/25/2008 | DE10234250B4 Vorrichtung sowie Verfahren zur Überwachung der Kristallisation von Silizium An apparatus and method for monitoring the crystallization of silicon |
| 09/25/2008 | DE102008012834A1 Vorrichtung mit einem Bauelement und Verfahren zum Herstellen derselben A device with a device and method for manufacturing the same |
| 09/25/2008 | DE102008009476A1 Verfahren zur Bildung einer Metalloxidschichtstruktur und Herstellung eines Halbleiterbauelements A method of forming a Metalloxidschichtstruktur and manufacturing a semiconductor device |
| 09/25/2008 | DE102008000660A1 Siliziumkarbid-Halbleitervorrichtung und Verfahren zu ihrer Herstellung Silicon carbide semiconductor device and process for their preparation |
| 09/25/2008 | DE102007056628A1 Verfahren zum gleichzeitigen Schleifen mehrerer Halbleiterscheiben A process for simultaneously grinding a plurality of semiconductor wafers |
| 09/25/2008 | DE102007056627A1 Verfahren zum gleichzeitigen Schleifen mehrerer Halbleiterscheiben A process for simultaneously grinding a plurality of semiconductor wafers |
| 09/25/2008 | DE102007032386A1 Method for rinsing semiconductor wafer, involves matching minimum time of rinsing duration to reaching of threshold value of concentration of particles of predetermine of magnitude area |
| 09/25/2008 | DE102007026372A1 Verfahren zur Ausbildung einer Mikrostruktur in einer Halbleitervorrichtung A process for forming a fine pattern in a semiconductor device |
| 09/25/2008 | DE102007024041A1 Speicher, Anordnung von Kondensatorelementen und Verfahren zum Herstellen einer Anordnung Memory array of capacitor elements and methods for manufacturing an array |
| 09/25/2008 | DE102007020275A1 Speichervorrichtung, nicht-flüchtige Halbleiterspeichervorrichtung und Verfahren zum Ausbilden einer Speichervorrichtung Storage device, non-volatile semiconductor memory device and method of forming a memory device |
| 09/25/2008 | DE102007016288A1 Integrierter Schaltkreis und Verfahren zum Herstellen einer Kontaktanordnung und einer Verbindungsanordnung Integrated circuit and method for fabricating a contact assembly and a connector assembly |
| 09/25/2008 | DE102007014608A1 Porous semiconducting structure useful in an electronic component for field-effect transistor, has an electrical conductivity, an activation energy of the conductivity, a solid content, a pore size and a thickness of a specified range |
| 09/25/2008 | DE102007014198A1 Integriertes Bauteil Integrated component |
| 09/25/2008 | DE102007014038A1 Semiconductor component has semiconductor body with semiconductor area of conductor type and another semiconductor area of conductor type, and third semiconductor area of former conductor type is complementary for latter conductor type |
| 09/25/2008 | DE102007013848A1 Semiconductor component i.e. MOSFET, has floating doped regions electrically connected with field plates and formed complementary to drift distance, where field plates are coupled with field plates voltage limiting structure |
| 09/25/2008 | DE102007013338A1 Halbleiter-Bauelement und Vorrichtung zur elektrischen Kontaktierung von Halbleiter-Bauelementen Semiconductor device and apparatus for electrically contacting semiconductor devices |
| 09/25/2008 | DE102007013058A1 Method for simultaneous double-side grinding of semiconductor wafers, comprises moving the wafer freely into a recess of a circulating disk, and processing the wafer between two rotating circular working disk components |
| 09/25/2008 | DE102007012359A1 Epitaxial LED chip bond pad manufacturing method, involves subjecting surface of metal layer by surface treatment i.e. surface cleaning, to increase adhesive strength, and separating metal layer from surface of another layer |
| 09/25/2008 | DE102007012155A1 Formkörper und Nutzen mit Halbleiterchips, Gießform und Verfahren zur Herstellung des Formkörpers und des Nutzens Shaped body and benefits with semiconductor chips, mold and process for producing the shaped body and benefits |
| 09/25/2008 | DE102007010882A1 Solder connection for use between semiconductor chip and substrate, has soldering material layer arranged between power semiconductor chip and upper surface region of substrate, where layer exhibits repeatedly meltable soldering material |
| 09/25/2008 | DE102007010876A1 Module for semiconductors, has semiconductor chip which has partly filled recess at main surface, where electrically non-conducting spacer is applied on main surface |
| 09/25/2008 | DE102006059526B4 Halbleiterbauteil, Nutzen mit in Zeilen und Spalten angeordneten Halbleiterbauteilen und Verfahren zur Herstellung eines Halbleiterbauteils A semiconductor device, with the benefit arranged in rows and columns semiconductor devices and method of manufacturing a semiconductor device |
| 09/25/2008 | DE102006051496B4 Halbleiterbauelement mit einem porösen Materialschichtstapel mit kleinem ε mit reduzierter UV-Empfindlichkeit und Verfahren zu dessen Herstellung A semiconductor device having a porous material layer stack with a small ε with reduced UV sensitivity and process for its preparation |
| 09/25/2008 | DE102006045441B4 Verfahren zur Herstellung einer Halbleiterbauelementanordnung mit einer Trenchtransistorstruktur A method of manufacturing a semiconductor device assembly comprising a trench transistor structure |
| 09/25/2008 | DE102006032488B4 Verfahren zur Bearbeitung von Wafern A method for processing wafers |
| 09/25/2008 | DE102005049687B4 Leistungshalbleiterbauteil in Flachleitertechnik mit vertikalem Strompfad und Verfahren zur Herstellung Power semiconductor device in flat conductor technique with vertical current path and methods for preparing |
| 09/25/2008 | DE102005042754B4 Verfahren und Vorrichtung zur selektiven Plasmabehandlung von Substraten zur Vorbehandlung vor einem Beschichtungs- oder Bondprozess Method and apparatus for the selective plasma treatment of substrates for the pretreatment prior to coating or bonding process |
| 09/25/2008 | DE102005016511B4 Verfahren zum Herstellen einer Leiterstruktur auf einem Substrat A method for producing a conductor pattern on a substrate |
| 09/25/2008 | DE102005008321B4 Mittels Feldeffekt steuerbares Halbleiterspeicherelement mit verbessertem Einfangdielektrikum By means of field-effect-controllable semiconductor memory element with improved Einfangdielektrikum |
| 09/25/2008 | DE102004052580B4 Vorrichtung und Verfahren zum Zuführen von Vorstufengasen zu einer Implantationsanlage Apparatus and method for supplying precursor gases into a implanter |
| 09/25/2008 | DE102004039660B4 Halbleiterspeichervorrichtung und Verfahren zur Herstellung derselben A semiconductor memory device and method of manufacturing the same |
| 09/25/2008 | DE10160118B4 Halbleiterelement Semiconductor element |
| 09/25/2008 | DE10104265B4 Verfahren zum Herstellen einer Halbleiterschaltungsanordnung A method for fabricating a semiconductor circuit arrangement |
| 09/25/2008 | DE10023034B4 Transportvorrichtung für einen sphärischen Körper Transport device for a spherical body |
| 09/25/2008 | CA2684315A1 Method of making a solar grade silicon wafer |
| 09/24/2008 | EP1973174A2 Method for fracturing semiconductor substrate, method for fracturing solar cell, and the solar cell |
| 09/24/2008 | EP1973168A2 Method for manufacturing solar cell by fracturing along a dividing groove and the corresponding solar cell |
| 09/24/2008 | EP1973165A1 Silicon carbide bipolar semiconductor device |
| 09/24/2008 | EP1973164A2 Thin film transistor and organic light emitting device including thin film transistor |
| 09/24/2008 | EP1973163A2 High temperature performance capable gallium nitride transistor |
| 09/24/2008 | EP1973155A1 Method for fabricating a germanium on insulator (GeOI) type wafer |
| 09/24/2008 | EP1973154A1 Device for moving a carrier in a chamber, in particular in a vacuum chamber |
| 09/24/2008 | EP1973153A1 Sealed chamber for transport and storage of semiconductor substrates |
| 09/24/2008 | EP1973152A1 Substrate cleaning apparatus, method of substrate cleaning, substrate treating system and recording medium |
| 09/24/2008 | EP1973151A2 Soi wafer and manufacturing method thereof |
| 09/24/2008 | EP1973150A1 A (110) oriented silicon substrate and a bonded pair of substrates comprising said (110) oriented silicon substrate and corresponding methods of fabricating same |
| 09/24/2008 | EP1973149A1 Laser annealing method and laser annealing apparatus |
| 09/24/2008 | EP1973148A2 Halogen-free amorphous carbon mask etch having high selectivity to photoresist |
| 09/24/2008 | EP1973147A1 Reflective mask blanc for euv lithography |
| 09/24/2008 | EP1973146A2 Gas flow diffuser |
| 09/24/2008 | EP1973145A1 Apparatus and method for depositing protective layer |
| 09/24/2008 | EP1973139A2 Apparatus and method of temperature control during cleaving processes for manufacture of thick film materials |
| 09/24/2008 | EP1972998A1 Silicon-containing resist underlying layer film forming composition for formation of photocrosslinking cured resist underlying layer film |