Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
09/2008
09/30/2008US7428777 Method of making a heatsink device
09/25/2008WO2008116222A2 A modular cluster tool
09/25/2008WO2008116079A1 Powdered quantum dots
09/25/2008WO2008116035A1 Method of forming a recess in a semiconductor structure
09/25/2008WO2008116019A1 Improving the reliability of high-k gate dielectric layers
09/25/2008WO2008115983A1 Sealed lighting units
09/25/2008WO2008115967A1 Method of integrating mems structures and cmos structures using oxide fusion bonding
09/25/2008WO2008115956A1 Methods and apparatus for manufacturing semiconductor devices
09/25/2008WO2008115937A1 Doped wge to form dual metal gates
09/25/2008WO2008115744A1 Vertical electrical interconnect formed on support prior to die mount
09/25/2008WO2008115687A1 High power electrical connector for a laminated heater
09/25/2008WO2008115652A1 Method of forming a carbon nanotube-based contact to semiconductor
09/25/2008WO2008115600A1 Multi-material hard mask or prepatterned layer for use with multi-patterning photolithography
09/25/2008WO2008115542A1 Semiconductor device and method for forming silicide layers
09/25/2008WO2008115539A1 Method of making a solar grade silicon wafer
09/25/2008WO2008115325A1 Deposition system with electrically isolated pallet and anode assemblies
09/25/2008WO2008115266A2 Growth of metallic nanodots using specific precursors
09/25/2008WO2008115249A2 Making high jc superconducting films using polymer-nitrate solutions
09/25/2008WO2008115135A1 Semiconductor heterostructures and manufacturing thereof
09/25/2008WO2008114997A1 Apparatus of measuring pressure of chuck plate, correcting position of chuck plate and method thereof
09/25/2008WO2008114973A1 Probe card having planarization means
09/25/2008WO2008114958A1 Apparatus for plasma processing and method for plasma processing
09/25/2008WO2008114862A1 Plasma processing apparatus
09/25/2008WO2008114845A1 Mg-CONTAINING ZnO MIXED SINGLE CRYSTAL, LAMINATE THEREOF AND THEIR PRODUCTION METHODS
09/25/2008WO2008114838A1 METHOD FOR FORMING OHMIC ELECTRODE ON P-TYPE 4H-Sic SUBSTRATE
09/25/2008WO2008114835A1 Film-forming composition, silica film and method for forming the same
09/25/2008WO2008114806A1 Semiconductor device and method for manufacturing the same
09/25/2008WO2008114805A1 Chemical-mechanical polishing pad, and chemical-mechanical polishing method
09/25/2008WO2008114799A1 Plasma treating apparatus, and plasma treating method
09/25/2008WO2008114797A1 Positive type photosensitive polyimide precursor composition
09/25/2008WO2008114772A1 Nitride semiconductor substrate
09/25/2008WO2008114753A1 Substrate placing table, substrate processing apparatus and method for machining surface of substrate placing table
09/25/2008WO2008114719A1 Radical generating apparatus and zno thin film
09/25/2008WO2008114718A1 Magnetron sputtering apparatus
09/25/2008WO2008114716A1 Sram device
09/25/2008WO2008114705A1 Organic insulating material, varnish for resin film using the same, resin film and semiconductor device
09/25/2008WO2008114644A1 Resist pattern formation method, and resin composition capable of insolubilizing resist pattern
09/25/2008WO2008114616A1 Cleaning composition and process for producing semiconductor device
09/25/2008WO2008114609A1 Semiconductor device and method for manufacturing the same
09/25/2008WO2008114599A1 Active matrix substrate
09/25/2008WO2008114598A1 Active matrix substrate
09/25/2008WO2008114564A1 Thin film transistor and method for manufacturing thin film transistor
09/25/2008WO2008114563A1 Aqueous dispersion for chemical mechanical polishing and method of chemical mechanical polishing of semiconductor device
09/25/2008WO2008114520A1 Chemical mechanical polishing pad and chemical mechanical polishing method
09/25/2008WO2008114466A1 Silicon of prismatic shape and process for producing the same
09/25/2008WO2008114465A1 Method of forming solder bumps and solder bump-forming assembly
09/25/2008WO2008114434A1 Mount substrate, process for producing the same, semiconductor device and process for producing the same
09/25/2008WO2008114430A1 Stacked package element, method for forming terminal of stacked package element, stacked package, and method for forming stacked package
09/25/2008WO2008114423A1 Semiconductor device and process for producing the same
09/25/2008WO2008114422A1 Beam drawing device
09/25/2008WO2008114418A1 Semiconductor device and its manufacturing method
09/25/2008WO2008114414A1 Semiconductor integrated circuit
09/25/2008WO2008114413A1 Process for producing semiconductor device
09/25/2008WO2008114412A1 Semiconductor device and method for fabricating the same
09/25/2008WO2008114411A1 Material for formation of conductive anti-reflection film, method for formation of conductive anti-reflection film, method for formation of resist pattern, semiconductor device, and magnetic head
09/25/2008WO2008114397A1 Design method and design device of semiconductor integrated circuit
09/25/2008WO2008114394A1 Method for designing semiconductor device and layout data verification program
09/25/2008WO2008114392A1 Semiconductor device and method for fabricating the same
09/25/2008WO2008114366A1 Electronic component container
09/25/2008WO2008114363A1 Apparatus for producing semiconductor device and process for producing semiconductor device
09/25/2008WO2008114354A1 Clock skew measuring device, clock skew adjuster, and integrated circuit
09/25/2008WO2008114342A1 Power switch circuit and semiconductor integrated circuit device
09/25/2008WO2008114341A1 Semiconductor device and process for manufacturing the same
09/25/2008WO2008114337A1 Vacuum bonding method and vacuum bonding device
09/25/2008WO2008114336A1 Semiconductor element
09/25/2008WO2008114333A1 Container transfer apparatus
09/25/2008WO2008114317A1 Semiconductor memory
09/25/2008WO2008114309A1 Silicon dielectric treating agent for use after etching, process for producing semiconductor device, and semiconductor device
09/25/2008WO2008114252A2 Microneedle structures and corresponding production methods employing a backside wet etch
09/25/2008WO2008114108A1 A (110) oriented silicon substrate and a bonded pair of substrates comprising said (110) oriented silicon substrate
09/25/2008WO2008114107A2 Method of fabricating a hybrid substrate
09/25/2008WO2008114099A1 Patterned thin soi
09/25/2008WO2008114094A1 Thin profile packaging with exposed die attach adhesive
09/25/2008WO2008113994A1 Electrical connection of components
09/25/2008WO2008088994A3 Method and system for improving domain stability in a ferroelectric media
09/25/2008WO2008086871A3 Method for applying markings to substrate surfaces by means of a transfer method
09/25/2008WO2008083469A8 Light emitting devices with a zinc oxide thin film structure
09/25/2008WO2008073529A3 Integrated semiconductor and transition-metal oxide nanostructures and methods for preparing same
09/25/2008WO2008057454A8 Growth and manufacture of reduced dislocation density and free-standing aluminum nitride films by hydride vapor phase epitaxy
09/25/2008WO2008014136A3 Octagon transfer chamber
09/25/2008WO2008001142A3 Transistor array with shared body contact and method of manufacturing
09/25/2008WO2007136832A3 Method for expelling gas positioned between a substrate and a mold
09/25/2008WO2007131094A3 Method and apparatus for chemical mechanical polishing of large size wafer with capability of polishing individual die
09/25/2008WO2007115105A3 Method for making an improved thin film solar cell interconnect using etch and deposition processes
09/25/2008WO2007106814A3 Semiconductor device fabricated using a carbon-containing film as a contact etch stop layer
09/25/2008WO2007082227A3 Multiple port memory having a plurality of parallel connected trench capacitors in a cell
09/25/2008WO2007051142A3 Metal cuboid semiconductor device and method
09/25/2008WO2007046853A3 Systems for discretized processing of substrate regions
09/25/2008WO2007038514A3 Apparatus and method for substrate edge etching
09/25/2008WO2006138628A8 Method for activating nitride surfaces for amine-reactive chemistry
09/25/2008US20080235652 Lithography method for forming a circuit pattern
09/25/2008US20080235064 Method and apparatus for performing assessments
09/25/2008US20080234163 solvent for removing, dissolving, rinsing or peeling polysilazane films coated on an edge or back of semiconductor substrates
09/25/2008US20080233844 Retainer ring and polishing machine
09/25/2008US20080233842 Dresser and apparatus for chemical mechanical polishing and method of dressing polishing pad
09/25/2008US20080233836 Polishing composition and polishing method
09/25/2008US20080233766 Ashing method and apparatus therefor
09/25/2008US20080233765 Method for enhancing adhesion between layers
09/25/2008US20080233764 Formation of Gate Insulation Film
09/25/2008US20080233763 Method of achieving uniform length of carbon nanotubes (cnts) and method of manufacturing field emission device (fed) using such cnts