Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
12/2008
12/30/2008US7470553 Built-in design edit structures
12/30/2008US7470552 Method for production of MRAM elements
12/30/2008US7470551 Spin transistor and manufacturing method thereof
12/30/2008US7470473 a laser comprising a semiconductor nanostrusture crystal layer, including intermetallics, metal sulfides, nitrides or phosphides distributed in a metal oxide matrix, disposed on a grating
12/30/2008US7470470 Mixing different chemical precursors together in a chamber during a single pulse step in atomic layer deposition (ALD) to form a mono-layer having multiple chemical compounds on the surface; e.g. dielectric hafnium silicon nitride from hafnium dialkyl amides, tetrakis(dialkylamino)silane and ammonia
12/30/2008US7470454 Non-thermal process for forming porous low dielectric constant films
12/30/2008US7470414 High purity phosphoric acid and process of producing the same
12/30/2008US7470374 uses ion beam etching as a dry etching technique for a continuous recording layer, which can suppress misalignment of a processed shape of a divided recording element and avoid magnetic degradation, good magnetic characteristics
12/30/2008US7470344 Chemical dispensing system for semiconductor wafer processing
12/30/2008US7470329 Method and system for nanoscale plasma processing of objects
12/30/2008US7470297 Cerium-based abrasive and production process thereof
12/30/2008US7470295 Polishing slurry, method of producing same, and method of polishing substrate
12/30/2008US7470171 Surface polishing method and apparatus thereof
12/30/2008US7470170 Polishing pad and method for manufacture of semiconductor device using the same
12/30/2008US7470169 Method of polishing semiconductor wafers by using double-sided polisher
12/30/2008US7470142 Wafer bonding method
12/30/2008US7470098 Detecting apparatus and detecting method
12/30/2008US7470069 Optoelectronic MCM package
12/30/2008US7469883 Cleaning method and solution for cleaning a wafer in a single wafer process
12/30/2008US7469812 Wire bonding apparatus
12/30/2008US7469654 Plasma processing device
12/30/2008CA2436750C Film deposition method and film deposition apparatus
12/25/2008US20080320434 Photomask management method and photomask wash limit generating method
12/25/2008US20080319559 Apparatus and method for transferring two or more wafers whereby the positions of the wafers can be measured
12/25/2008US20080319298 CMOS Compatible Microneedle Structures
12/25/2008US20080318503 Substrate holding mechanism, substrate polishing apparatus and substrate polishing method
12/25/2008US20080318499 Substrate holding apparatus, polishing apparatus, and polishing method
12/25/2008US20080318492 Substrate holding apparatus, polishing apparatus, and polishing method
12/25/2008US20080318443 Plasma enhanced cyclic deposition method of metal silicon nitride film
12/25/2008US20080318442 Semiconductor device manufacturing method and substrate processing apparatus
12/25/2008US20080318441 Process sequence for doped silicon fill of deep trenches
12/25/2008US20080318440 Porous organosilicate layers, and vapor deposition systems and methods for preparing same
12/25/2008US20080318439 Method of manufacturing semiconductor device
12/25/2008US20080318438 Method for manufacturing sic semiconductor device
12/25/2008US20080318437 Method for manufacturing semiconductor device utilizing low dielectric layer filling gaps between metal lines
12/25/2008US20080318436 Antireflective Coating Material
12/25/2008US20080318435 Composition for etching a metal hard mask material in semiconductor processing
12/25/2008US20080318434 Systems and methods for oscillating exposure of a semiconductor workpiece to multiple chemistries
12/25/2008US20080318433 Plasma confinement rings assemblies having reduced polymer deposition characteristics
12/25/2008US20080318432 Reactor with heated and textured electrodes and surfaces
12/25/2008US20080318431 Shower Plate and Plasma Treatment Apparatus Using Shower Plate
12/25/2008US20080318430 Method for manufacturing semiconductor device having porous low dielectric constant layer formed for insulation between metal lines
12/25/2008US20080318429 Fabrication method of semiconductor integrated circuit device
12/25/2008US20080318428 Method for Achieving Uniform Chemical Mechanical Polishing In Integrated Circuit Manufacturing
12/25/2008US20080318427 Chemical mechanical polishing aqueous dispersion preparation set, method of preparing chemical mechanical polishing aqueous dispersion, chemical mechanical polishing aqueous dispersion, and chemical mechanical polishing method
12/25/2008US20080318426 Wafer recycling method
12/25/2008US20080318425 Semiconductor device production method
12/25/2008US20080318424 Photoresist residue remover composition and semiconductor circuit element production process employing the same
12/25/2008US20080318423 Process for producing metal oxide films at low temperatures
12/25/2008US20080318422 Method of manufacturing semiconductor device
12/25/2008US20080318421 Methods of forming films of a semiconductor device
12/25/2008US20080318420 Two step chemical mechanical polish
12/25/2008US20080318419 Charge dissipation of cavities
12/25/2008US20080318418 Process for Forming Continuous Copper Thin Films Via Vapor Deposition
12/25/2008US20080318417 Method of forming ruthenium film for metal wiring structure
12/25/2008US20080318416 Method of improving interconnection between aluminum and copper in semiconductor metal line process
12/25/2008US20080318415 Interconnect structures with encasing cap and methods of making thereof
12/25/2008US20080318414 Method of manufacturing semiconductor device
12/25/2008US20080318413 Method for making an interconnect structure and interconnect component recovery process
12/25/2008US20080318412 Method of manufacturing a semiconductor device
12/25/2008US20080318411 Method of manufacturing semiconductor device
12/25/2008US20080318410 Method of forming metal electrode of system in package
12/25/2008US20080318409 Method for manufacturing a semiconductor device and method for etching the same
12/25/2008US20080318408 Method of manufacturing semiconductor device
12/25/2008US20080318407 Method for Forming Storage Electrode of Semiconductor Memory Device
12/25/2008US20080318406 Split gate type nonvolatile memory device and method of fabricating the same
12/25/2008US20080318405 Method of fabricating gate structure
12/25/2008US20080318404 Semiconductor device and method for manufacturing the same
12/25/2008US20080318403 Method for fabricating semiconductor transistor
12/25/2008US20080318402 Semiconductor device having a recess channel and method for fabricating the same
12/25/2008US20080318401 Power semiconductor device for suppressing substrate recirculation current and method of fabricating power semiconductor device
12/25/2008US20080318400 Method for manufacturing SIC semiconductor device
12/25/2008US20080318399 Plasma doping method
12/25/2008US20080318398 Method for manufacturing crystalline semiconductor film and semiconductor device
12/25/2008US20080318397 Junction Diode with Reduced Reverse Current
12/25/2008US20080318396 Grooving Bumped Wafer Pre-Underfill System
12/25/2008US20080318395 Methods and systems for imaging and cutting semiconductor wafers and other semiconductor workpieces
12/25/2008US20080318394 Semiconductor substrate, method for manufacturing semiconductor substrate, semiconductor device, and electronic device
12/25/2008US20080318393 Method for Manufacturing Semiconductor Device
12/25/2008US20080318392 Shallow trench isolation structure and method for forming the same
12/25/2008US20080318391 Method of manufacturing semiconductor device
12/25/2008US20080318390 Method for fabricating semiconductor device and semiconductor device
12/25/2008US20080318389 Method of forming alignment key of semiconductor device
12/25/2008US20080318388 Method for fabricating mos transistor with recess channel
12/25/2008US20080318387 Activation of CMOS Source/Drain Extensions by Ultra-High Temperature Anneals
12/25/2008US20080318386 Metal oxide semiconductor field effect transistor and method of fabricating the same
12/25/2008US20080318385 Tunneling field effect transistor using angled implants for forming asymmetric source/drain regions
12/25/2008US20080318384 Method of forming quantum wire gate device
12/25/2008US20080318383 Method of manufacturing semiconductor device
12/25/2008US20080318382 Methods for fabricating tunneling oxide layer and flash memory device
12/25/2008US20080318381 Methods of forming high density semiconductor devices using recursive spacer technique
12/25/2008US20080318380 Dual-gate device and method
12/25/2008US20080318379 Method for fabricating non-volatile storage with individually controllable shield plates between storage elements
12/25/2008US20080318378 MIM Capacitors with Improved Reliability
12/25/2008US20080318377 Method of forming self-aligned gates and transistors
12/25/2008US20080318376 Semiconductor Device Manufactured Using a Method to Improve Gate Doping While Maintaining Good Gate Profile
12/25/2008US20080318375 Method of Fabricating a Duel-Gate Fet
12/25/2008US20080318374 Metal Gated Ultra Short MOSFET Devices
12/25/2008US20080318373 Method of fabricating self-aligned bipolar transistor having tapered collector
12/25/2008US20080318372 Manufacturing method of high-linearity and high-power cmos structure
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