Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
12/2008
12/30/2008US7470979 Electronic component and semiconductor device, method of making the same and method of mounting the same, circuit board, and electronic instrument
12/30/2008US7470977 Modular board device, high frequency module, and method of manufacturing same
12/30/2008US7470973 Semiconductor device and semiconductor integrated circuit device
12/30/2008US7470970 Prepared by making use of orientation (plane) dependence of the oxygen doping to GaN; non-C-plane growth enables the growing GaN crystal to accept oxygen effectively; for producing light emitting diodes, laser diodes or other electronic devices of groups 3 and 5 nitride semiconductors
12/30/2008US7470969 Semiconductor device and fabrication method thereof
12/30/2008US7470963 Magnetoresistive element and magnetic memory
12/30/2008US7470954 Fabrication method for arranging ultra-fine particles
12/30/2008US7470953 Insulated gate type semiconductor device and manufacturing method thereof
12/30/2008US7470944 Solid-state image sensor
12/30/2008US7470941 High power-low noise microwave GaN heterojunction field effect transistor
12/30/2008US7470938 Nitride semiconductor light emitting device
12/30/2008US7470932 Liquid crystal display panel and fabricating method thereof
12/30/2008US7470931 Thin film transistor and flat panel display using the same
12/30/2008US7470919 Substrate support assembly with thermal isolating plate
12/30/2008US7470918 Method and apparatus for processing a micro sample
12/30/2008US7470754 Phenolic resins; polysiloxanes; improved solder heat resistance productivity; lightweight
12/30/2008US7470638 Systems and methods for manipulating liquid films on semiconductor substrates
12/30/2008US7470637 Film formation apparatus and method of using the same
12/30/2008US7470636 Semiconductor interlayer dielectric material and a semiconductor device using the same
12/30/2008US7470635 Method of depositing a silicon dioxide-comprising layer in the fabrication of integrated circuitry, methods of forming trench isolation in the fabrication of integrated circuitry, methods of depositing silicon dioxide-comprising layers in the fabrication of integrated circuitry, and methods of forming bit line over capacitor arrays of memory cells
12/30/2008US7470634 Formed by condensation polymerization; solvent extraction; screen printing; porogens; heat resistance; mechanical properties
12/30/2008US7470633 Method of forming a carbon polymer film using plasma CVD
12/30/2008US7470632 Method of depositing a silicon dioxide comprising layer doped with at least one of P, B and Ge
12/30/2008US7470631 Methods for fabricating residue-free contact openings
12/30/2008US7470630 Approach to reduce parasitic capacitance from dummy fill
12/30/2008US7470629 Structure and method to fabricate finfet devices
12/30/2008US7470628 Etching dielectrics using fluorohydrocarbon gas mixture; integrated circuits will free of defects due to photoresist mask misalignment, performed at low power; etching of semiconductor contact holes through insulating oxide layers
12/30/2008US7470627 Wafer area pressure control for plasma confinement
12/30/2008US7470626 Method of characterizing a chamber based upon concurrent behavior of selected plasma parameters as a function of source power, bias power and chamber pressure
12/30/2008US7470625 Method of plasma etching a substrate
12/30/2008US7470624 Integrated assist features for epitaxial growth bulk/SOI hybrid tiles with compensation
12/30/2008US7470623 Method of forming a platinum pattern
12/30/2008US7470622 Fabrication and use of polished silicon micro-mirrors
12/30/2008US7470621 Method for manufacturing semiconductor device
12/30/2008US7470620 Microcircuit fabrication and interconnection
12/30/2008US7470619 Interconnect with high aspect ratio plugged vias
12/30/2008US7470618 Semiconductor device including gate electrode for applying tensile stress to silicon substrate, and method of manufacturing the same
12/30/2008US7470617 Treating a liner layer to reduce surface oxides
12/30/2008US7470616 Damascene wiring fabrication methods incorporating dielectric cap etch process with hard mask retention
12/30/2008US7470615 Semiconductor structure with self-aligned device contacts
12/30/2008US7470614 Methods for fabricating semiconductor devices and contacts to semiconductor devices
12/30/2008US7470613 Dual damascene multi-level metallization
12/30/2008US7470612 Method of forming metal wiring layer of semiconductor device
12/30/2008US7470611 In situ deposition of a low K dielectric layer, barrier layer, etch stop, and anti-reflective coating for damascene application
12/30/2008US7470610 Method of fabricating organic electroluminescent devices
12/30/2008US7470609 Semiconductor device and method for manufacturing the same
12/30/2008US7470608 Semiconductor light emitting device and fabrication method thereof
12/30/2008US7470607 Transparent oxide semiconductor thin film transistor
12/30/2008US7470606 Masking methods
12/30/2008US7470605 Method for fabrication of a MOS transistor
12/30/2008US7470604 Method for manufacturing display device
12/30/2008US7470603 Methods of fabricating semiconductor devices having laser-formed single crystalline active structures
12/30/2008US7470602 Crystalline film and its manufacture method using laser
12/30/2008US7470601 Semiconductor device with semiconductor chip and adhesive film and method for producing the same
12/30/2008US7470600 Method and device for controlled cleaving process
12/30/2008US7470599 Dual-side epitaxy processes for production of nitride semiconductor structures
12/30/2008US7470598 Semiconductor layer structure and method of making the same
12/30/2008US7470597 Method of fabricating a multilayered dielectric diffusion barrier layer
12/30/2008US7470596 Capacitors having a horizontally folded dielectric layer and methods for manufacturing the same
12/30/2008US7470595 Oxidizing a metal layer for a dielectric having a platinum electrode
12/30/2008US7470594 System and method for controlling the formation of an interfacial oxide layer in a polysilicon emitter transistor
12/30/2008US7470593 Method for manufacturing a cell transistor of a semiconductor memory device
12/30/2008US7470592 Method of manufacturing a SONOS device
12/30/2008US7470591 Method of forming a gate stack containing a gate dielectric layer having reduced metal content
12/30/2008US7470590 Methods of forming semiconductor constructions
12/30/2008US7470589 Semiconductor device
12/30/2008US7470588 Transistors including laterally extended active regions and methods of fabricating the same
12/30/2008US7470587 Flash memory device and method of manufacturing the same
12/30/2008US7470586 Memory cell having bar-shaped storage node contact plugs and methods of fabricating same
12/30/2008US7470585 Integrated circuit and fabrication process
12/30/2008US7470584 TEOS deposition method
12/30/2008US7470583 Method of improved high K dielectric-polysilicon interface for CMOS devices
12/30/2008US7470582 Method of manufacturing semiconductor device having impurity region under isolation region
12/30/2008US7470581 Electromagnetic waveguide
12/30/2008US7470580 Fabrication method of a semiconductor device
12/30/2008US7470579 Method of manufacturing a thin film transistor
12/30/2008US7470578 Method of making a finFET having suppressed parasitic device characteristics
12/30/2008US7470577 Dual work function CMOS devices utilizing carbide based electrodes
12/30/2008US7470576 Methods of forming field effect transistor gate lines
12/30/2008US7470575 Process for fabricating semiconductor device
12/30/2008US7470574 OFET structures with both n- and p-type channels
12/30/2008US7470573 Method of making CMOS devices on strained silicon on glass
12/30/2008US7470572 Thin film transistor liquid crystal display and manufacturing method thereof
12/30/2008US7470571 Thin film transistor array substrate and method of producing the same
12/30/2008US7470570 Process for fabrication of FinFETs
12/30/2008US7470569 OLED display manufacturing method with uniformity correction
12/30/2008US7470568 Method of manufacturing a semiconductor device
12/30/2008US7470567 Semiconductor device and method of manufacturing the same
12/30/2008US7470566 Wafer dividing method
12/30/2008US7470565 Method of wafer level packaging and cutting
12/30/2008US7470564 Flip-chip system and method of making same
12/30/2008US7470563 Microelectronic device packages and methods for controlling the disposition of non-conductive materials in such packages
12/30/2008US7470562 Methods of forming field effect transistors using disposable aluminum oxide spacers
12/30/2008US7470560 Image sensor having a charge storage region provided within an implant region
12/30/2008US7470559 Semiconductor component comprising a buried mirror
12/30/2008US7470558 Method for manufacturing solid-state imaging device, and solid-state imaging device
12/30/2008US7470557 Self-aligned coating on released MEMS
12/30/2008US7470556 Process for creating tilted microlens
12/30/2008US7470555 Semiconductor laser device, and method of manufacturing the same
12/30/2008US7470554 Forming method of stacking structure and manufacturing method of electron source and image display apparatus using such method