| Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974) |
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| 12/24/2008 | WO2008109341A3 Optimized power supply for an electronic system |
| 12/24/2008 | WO2008106329A3 Methods and systems for certifying provenance of alcoholic beverages |
| 12/24/2008 | WO2008087686A3 Semiconductor substrate suitable for the realisation of electronic and/ or optoelectronic devices and relative manufacturing process |
| 12/24/2008 | WO2008061131A3 A method of fabricating a densified nanoparticle thin film with a set of occluded pores |
| 12/24/2008 | WO2008057392A3 Methods of fabricating semiconductor devices including implanted regions for providing low-resistance contact to buried layers and related devices |
| 12/24/2008 | WO2008021501A3 Apparatus and method for ultra-shallow implantation in a semiconductor device |
| 12/24/2008 | WO2008011306A3 Substrate support with adjustable lift and rotation mount |
| 12/24/2008 | WO2007142690A3 Apparatus and process for plasma-enhanced atomic layer deposition |
| 12/24/2008 | WO2007140037A3 Method of forming a semiconductor device having an interlayer and structure thereof |
| 12/24/2008 | WO2007120354A3 Thin-film capacitor with a field modification layer and methods for forming the same |
| 12/24/2008 | EP2007180A1 Circuit board, electronic circuit device, and display |
| 12/24/2008 | EP2006922A1 Nitride semiconductor light emitting element and method for fabricating the same |
| 12/24/2008 | EP2006915A2 Organic thin film transistor device and method for manufacturing same |
| 12/24/2008 | EP2006908A2 Electronic device and method of manufacturing the same |
| 12/24/2008 | EP2006905A2 Semiconductor apparatus and its manufacturing method |
| 12/24/2008 | EP2006904A2 Organic light emitting diode display device and method of fabricating the same |
| 12/24/2008 | EP2006903A2 Method of fabricating polycrystalline silicon, TFT fabricated using the same, method of fabricating the TFT, and organic light emitting diode display device including the TFT |
| 12/24/2008 | EP2006902A2 Method of producing an electric connection based on individually sheathed nanotubes |
| 12/24/2008 | EP2006901A2 Method of producing an electric connection based on carbon nanotubes |
| 12/24/2008 | EP2006900A1 Deep trench isolation for power semiconductors |
| 12/24/2008 | EP2006899A2 Stage apparatus, exposure apparatus, stage control method, exposure method and device manufacturing method |
| 12/24/2008 | EP2006897A1 Method of resin encapsulation molding for electronic part and resin encapsulation molding apparatus for electronic part |
| 12/24/2008 | EP2006896A1 Resin sealing/molding apparatus |
| 12/24/2008 | EP2006895A1 Electronic component module |
| 12/24/2008 | EP2006894A2 Semiconductor device and process for producing the same |
| 12/24/2008 | EP2006893A1 Processing apparatus and processing method |
| 12/24/2008 | EP2006891A1 Aqueous dispersion for chemical mechanical polishing, chemical mechanical polishing method, and kit for preparing aqueous dispersion for chemical mechanical polishing |
| 12/24/2008 | EP2006890A2 Aqueous dispersion for chemical mechanical polishing, chemical mechanical polishing method, kit for chemical mechanical polishing, and kit for preparing aqueous dispersion for chemical mechanical polishing |
| 12/24/2008 | EP2006888A2 Method and apparatus for growing plasma atomic layer |
| 12/24/2008 | EP2006887A2 III-V Nitride semiconductor layer-bonded substrate and semiconductor device |
| 12/24/2008 | EP2006885A1 Diffraction optical element, and aligner equipped with that element |
| 12/24/2008 | EP2006884A2 Mobile device, exposure device, exposure method, micro-motion body, and device manufacturing method |
| 12/24/2008 | EP2006883A2 Device for doping, coating or oxidizing a semiconductor material under a low pressure |
| 12/24/2008 | EP2006824A2 Electro-optic device, and tft substrate for current control and method for manufacturing the same |
| 12/24/2008 | EP2006741A2 Maintenance system, substrate processing apparatus, remote operation unit and communication method |
| 12/24/2008 | EP2006414A2 Atomic layer growing apparatus |
| 12/24/2008 | EP2005808A1 Method and device for placing electronic components, especially semiconductor chips, on a substrate |
| 12/24/2008 | EP2005477A2 Semiconductor fabrication process using etch stop layer to optimize formation of source/drain stressor |
| 12/24/2008 | EP2005470A2 Lead frame based, over-molded semiconductor package with integrated through hole technology (tht) heat spreader pin(s) and associated method of manufacturing |
| 12/24/2008 | EP2005469A2 Carrierless chip package for integrated circuit devices, and methods of making same |
| 12/24/2008 | EP2005468A1 Improving control of localized air gap formation in an interconnect stack |
| 12/24/2008 | EP2005467A1 Methods for making a starting substrate wafer for semiconductor engineering having wafer through connections |
| 12/24/2008 | EP2005466A1 Method for making a structure comprising at least one thin layer in an amorphous material obtained by epitaxy on a supporting substrate and structure obtained according to said method |
| 12/24/2008 | EP2005465A1 Method of producing multilayer structures having controlled properties |
| 12/24/2008 | EP2005370A2 Transfer tape strap process |
| 12/24/2008 | EP2005254A2 Manufacturing devices using a donee layer cleaved from a crystalline donor |
| 12/24/2008 | EP2005129A1 Method and device for no-contact temperature measurement |
| 12/24/2008 | EP2004872A1 Novel pore-forming precursors composition and porous dielectric layers obtained there from |
| 12/24/2008 | EP2004090A1 Method for treatment of material having nanoscale pores |
| 12/24/2008 | EP1803159A4 Mos-gated transistor with reduced miller capacitance |
| 12/24/2008 | EP1794786A4 Compressive sige <110> growth and structure of mosfet devices |
| 12/24/2008 | EP1774542A4 Method for bilayer resist plasma etch |
| 12/24/2008 | EP1665389A4 Method of filling structures for forming via-first dual damascene interconnects |
| 12/24/2008 | EP1652866B1 Acrylic polymers and radiation-sensitive resin compositions |
| 12/24/2008 | EP1644960B1 Device and method for wet treating disc-like substrates |
| 12/24/2008 | EP1556866B1 Flash memory cell arrays having dual control gates per memory cell charge storage element |
| 12/24/2008 | EP1540716A4 Replication and transfer of microstructures and nanostructures |
| 12/24/2008 | EP1532290B1 Systems and methods for forming zirconium and/or hafnium-containing layers |
| 12/24/2008 | EP1523763A4 Molecular layer deposition of thin films with mixed components |
| 12/24/2008 | EP1446263B1 Method for polishing a substrate surface |
| 12/24/2008 | EP1364405A4 High voltage semiconductor device |
| 12/24/2008 | EP1258035A4 Process for wafer level treatment to reduce stiction and passivate micromachined surfaces and compounds used therefor |
| 12/24/2008 | EP1192293B1 CVD OF INTEGRATED Ta AND TaNx FILMS FROM TANTALUM HALIDE PRECURSORS |
| 12/24/2008 | EP1117854B1 Method and apparatus for forming polycrystalline and amorphous silicon films |
| 12/24/2008 | EP1112550A4 An automated wafer defect inspection system and a process of performing such inspection |
| 12/24/2008 | DE20321702U1 Vorrichtung zum Texturieren von Oberflächen von Silizium-Scheiben Apparatus for texturing surfaces of silicon wafers |
| 12/24/2008 | DE202008013163U1 Substrat Carrier aus CFC (Carbonfiber) für Siliziumwafer Substrate carrier from CFC (Carbon Fiber) for silicon wafers |
| 12/24/2008 | DE19581809B4 MOS-Zelle, Mehrfachzellentransistor und IC-Chip MOS cell, multicell transistor and IC chip |
| 12/24/2008 | DE112006003742T5 Halbleitervorrichtung und Verfahren zur Herstellung dergleichen Like semiconductor device and process for producing |
| 12/24/2008 | DE112004002633B4 Verfahren zur Herstellung eines Steg-Feldeffekttransistors A process for the preparation of a fin field-effect transistor |
| 12/24/2008 | DE102008029122A1 Integrierte Schaltung mit Mehrschichtelektrode Integrated circuit with multilayer electrode |
| 12/24/2008 | DE102008028801A1 Integrierte Schaltung mit vertikaler Diode Integrated circuit with vertical diode |
| 12/24/2008 | DE102008027106A1 Verfahren zur Herstellung einer SIC-Halbleitervorrichtung A method for manufacturing a SiC semiconductor device |
| 12/24/2008 | DE102008027097A1 Vorrichtung und Verfahren zum Erfassen eines Harzlecks Apparatus and method for detecting a resin leaks |
| 12/24/2008 | DE102008026526A1 Verfahren zum Steuern einer Filmaufbringung unter Verwendung einer Atomschichtaufbringung A method for controlling a film deposition using an atomic layer deposition |
| 12/24/2008 | DE102008024802A1 CMOS-Bildsensor-Chip-Packung in Chipgröße mit Chip aufnehmendem Durchgangsloch und Verfahren derselben CMOS image sensor chip chip scale package with chip aufnehmendem through hole and method thereof |
| 12/24/2008 | DE102008013180A1 Struktur einer Halbleiterbausteinpackung und deren Verfahren Structure of a semiconductor device package and its method |
| 12/24/2008 | DE102008001534A1 Transistor mit reduzierter Ladungsträgermobilität und assoziierte Verfahren Transistor with reduced charge carrier mobility and associated method |
| 12/24/2008 | DE102007039754A1 Verfahren zur Herstellung von Substraten A process for the production of substrates |
| 12/24/2008 | DE102007031428A1 Electronic semiconductor-component encapsulation method, involves manufacturing part of frame by selective contactless application of components of coating materials on substrate in print head and by annealing of coating materials |
| 12/24/2008 | DE102007030058B3 Technik zur Herstellung eines dielektrischen Zwischenschichtmaterials mit erhöhter Zuverlässigkeit über einer Struktur, die dichtliegende Leitungen aufweist Having technique for producing an interlayer dielectric material with increased reliability over a structure, the sealing lines lying |
| 12/24/2008 | DE102007029780A1 Method for filling recess in semiconductor structure, involves isolating silicon from gaseous atmosphere with silane in one step, and more silicon is isolated later in another step |
| 12/24/2008 | DE102007028439A1 Separating flat-parallel silicon wafers from cuboid crystalline or polycrystalline silicon ingot using wire saw for photo-voltaic applications, comprises moving wire around rolls, and attaching the ingot to reception of the wire saw |
| 12/24/2008 | DE102007027160A1 Herstellungsverfahren zur Bildung eines Transistors mit versenktem Kanal, Verfahren zur Bildung einer entsprechenden integrierten Halbleiterspeichervorrichtung und entsprechende selbstjustierte Maskenanordnung Preparation method of forming a buried channel transistor, method of forming a corresponding integrated semiconductor memory device and corresponding self-aligned mask assembly |
| 12/24/2008 | DE102007026745A1 Semiconductor element comprises semiconductor body with drift section structure, where trench structure that has trench walls and trench body, is filled with vertically aligned semiconductor material |
| 12/24/2008 | DE102005053398B4 Leistungshalbleitermodul The power semiconductor module |
| 12/24/2008 | DE102005046404B4 Verfahren zur Minderung von Streuungen in der Durchbiegung von gewalzten Bodenplatten und Leistungshalbleitermodul mit einer nach diesem Verfahren hergestellten Bodenplatte A method for reducing variations in the deflection of the rolled plates, and bottom power semiconductor module with a base plate prepared by this method |
| 12/24/2008 | DE102005012244B4 Verfahren zur Reinigung von Gegenständen mittels Ultraschall A method for cleaning objects by means of ultrasound |
| 12/24/2008 | DE102004030552B4 Schicht-Anordnung, Feldeffekttransistor und Verfahren zum Herstellen einer Schicht-Anordnung Layer arrangement, the field-effect transistor and method for fabricating a layer arrangement, |
| 12/24/2008 | DE102004029520B4 Transistor-Anordnung mit Rauscherfassung Transistor arrangement with noise detection |
| 12/24/2008 | DE102004004556B4 Verfahren zur Herstellung einer Halbleiterscheibe A process for producing a semiconductor wafer |
| 12/24/2008 | CN201171088Y Connecting parts, earthing structure, heater and apparatus containing the connecting parts |
| 12/24/2008 | CN201171054Y Dust-cleaning brush box for silicon chip surface deposition reflectance film |
| 12/24/2008 | CN201171044Y Apparatus for adsorbing base plate |
| 12/24/2008 | CN201171043Y Centering unit |
| 12/24/2008 | CN201171042Y Centering system |
| 12/24/2008 | CN201171041Y Device for treating substrate |
| 12/24/2008 | CN201168928Y Carrier head for substrate chemical-mechanical polishing apparatus and flexible film thereof |
| 12/24/2008 | CN101331812A Method of manufacturing printed wiring board |
| 12/24/2008 | CN101331811A Composition for removing residue from wiring board and cleaning method |