Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
12/2008
12/31/2008CN101335250A Wiring construction between low temperature cold platform and room temperature outer housing and method
12/31/2008CN101335247A Semiconductor device and manufacture method thereof
12/31/2008CN101335246A Method of manufacturing flash memory device
12/31/2008CN101335245A Method of fabricating flash memory device
12/31/2008CN101335244A Method for fabricating semiconductor device
12/31/2008CN101335243A Method for fabricating semiconductor device with vertical channel
12/31/2008CN101335242A Method for fabricating semiconductor device
12/31/2008CN101335241A Method for fabricating semiconductor device with vertical channel transistor
12/31/2008CN101335240A Semiconductor device and method of fabricating the same
12/31/2008CN101335239A Image sensor and method for fabricating the same
12/31/2008CN101335238A Method for manufacturing image sensor
12/31/2008CN101335237A Method for manufacturing vertical CMOS image sensor
12/31/2008CN101335236A BICMOS circuit buried layer epitaxial method by cylinder epitaxial furnace
12/31/2008CN101335235A Method for dicing substrate
12/31/2008CN101335234A Method of improving interconnection between aluminum and copper in semiconductor metal line process
12/31/2008CN101335233A Semiconductor device and method for fabricating the same
12/31/2008CN101335232A Cmp method of semiconductor device
12/31/2008CN101335231A Method for fabricating semiconductor device
12/31/2008CN101335230A Method of fabricating flash memory device
12/31/2008CN101335229A Shallow groove isolation construction and forming method thereof
12/31/2008CN101335228A Seamless shallow groove isolation manufacturing method
12/31/2008CN101335227A Polyceramic e-chuck
12/31/2008CN101335226A Surface roughness recognizing and classifying method for LED chip
12/31/2008CN101335225A Metal pad formation method and metal pad structure using the same
12/31/2008CN101335224A Stress relieving layer for flip chip packaging
12/31/2008CN101335223A LED array module packaging method
12/31/2008CN101335222A Electronic component mounting device and method of manufacturing electronic device
12/31/2008CN101335221A Slotted metal plate type novel semi-conductor package method
12/31/2008CN101335220A 金属平板式半导体封装方法 Metal plate type semiconductor packaging method
12/31/2008CN101335219A Slotted metal plate type semi-conductor package method
12/31/2008CN101335218A Metal plate type novel semiconductor packaging method
12/31/2008CN101335217A Semiconductor package and manufacturing method thereof
12/31/2008CN101335216A Heat radiating type package construction and manufacturing method thereof
12/31/2008CN101335215A Semiconductor package and manufacturing method thereof
12/31/2008CN101335214A Semiconductor packing substrate for forming presoldering tin material and its preparation method
12/31/2008CN101335213A Method of manufacturing radiating plate and semiconductor apparatus using the same
12/31/2008CN101335212A Semiconductor device and manufacturing method thereof
12/31/2008CN101335211A Lateral DMOS device and method for fabricating the same
12/31/2008CN101335210A Method of fabricating semiconductor devices
12/31/2008CN101335209A Flash memory device and methods for fabricating the same
12/31/2008CN101335208A Method of fabricating non-volatile memory device having charge trapping layer
12/31/2008CN101335207A Semiconductor device and method for fabricating the same
12/31/2008CN101335206A Method for producing a copper layer on a substrate in a flat panel display manufacturing process
12/31/2008CN101335205A Method of producing iii-nitride substrate
12/31/2008CN101335204A Surface processing method of p type gallium nitride
12/31/2008CN101335203A Layered structure and its manufacturing method
12/31/2008CN101335202A Method for manufacturing display apparatus
12/31/2008CN101335201A Manufacturing method for n type SiC semiconductor device ohmic contact
12/31/2008CN101335200A AIN film preparing method
12/31/2008CN101335199A Manufacturing process of input/output device
12/31/2008CN101335198A Method for forming fine pattern of semiconductor device
12/31/2008CN101335197A Method for manufacturing metal-insulator-metal capacitor
12/31/2008CN101335196A Tape bonder
12/31/2008CN101335195A Semiconductor wafer with id mark, equipment for and method of manufacturing semiconductor device form them
12/31/2008CN101335194A Method for producing filmlike semiconductor materials and/or electronic elements by primary forming and/or coating
12/31/2008CN101335193A Hybrid etch chamber with decoupled plasma controls
12/31/2008CN101335192A Substrate processing apparatus and shower head
12/31/2008CN101335191A Manufacturing method for semiconductor integrated device
12/31/2008CN101335190A Methods of patterning self-assembly nano-structure and forming porous dielectric
12/31/2008CN101335189A Method for forming aligning key of semiconductor device
12/31/2008CN101335188A Method of manufacturing an soi substrate and method of manufacturing a semiconductor device
12/31/2008CN101335187A Substrate treating apparatus
12/31/2008CN101335186A Method and apparatus for controlling the spatial temperature distribution across the surface of a workpiece support
12/31/2008CN101335185A Method for forming pattern in semiconductor device
12/31/2008CN101335184A Method for forming fine pattern in semiconductor device
12/31/2008CN101335183A Temperature controlled loadlock chamber
12/31/2008CN101335182A Method for forming fine pattern in semiconductor device
12/31/2008CN101335181A Method for manufacturing a semiconductor device using a spacer as an etch mask
12/31/2008CN101335176A Local ion infusion device and method
12/31/2008CN101334854A Electronic label chip encapsulation method
12/31/2008CN101334853A Electronic label encapsulation method
12/31/2008CN101334802A Method for verifying pattern of semiconductor device
12/31/2008CN101334665A Cluster management system, semiconductor manufacturing device and information processing method
12/31/2008CN101334548A 液晶显示装置 The liquid crystal display device
12/31/2008CN101334436A Test system
12/31/2008CN101334414A Defect checking machine platform matching method
12/31/2008CN101333686A Method for preparing metallic nano-zinc of polyspinal deformity on zinc oxide substrate
12/31/2008CN101333666A Plasma generating method, cleaning method, substrate processing method
12/31/2008CN101333648A Atomic layer deposition device and Atomic layer deposition method
12/31/2008CN101333646A Method for preparing ZnO nano-rod array under non-catalyst and non-carbon condition
12/31/2008CN101333421A Chemical mechanical polishing slurry composition and polishing method
12/31/2008CN101333420A Chemical mechanical polishing slurry composition and polishing method
12/31/2008CN101333419A Abrasive-free chemical mechanical polishing solution of integrated circuit copper
12/31/2008CN101333418A Cmp polishing compound and method for polishing substrate
12/31/2008CN101333417A Polishing liquid and polishing method using the same
12/31/2008CN101332580A Polishing apparatus and polishing method
12/31/2008CN101332477A Manufacturing method of semiconductor silicon aluminum bonding lines
12/31/2008CN101332327A 一种微型空心硅针及其制备方法 A miniature silicon hollow needle and its preparation method
12/31/2008CN100448327C System and method for lamp split zone control
12/31/2008CN100448046C Micromachined electromechanical device
12/31/2008CN100448043C Light emitting devices and method for fabricating the same
12/31/2008CN100448042C Nitride-based semiconductor substrate and method of making the same
12/31/2008CN100448039C Nitride-based semiconductor device
12/31/2008CN100448031C Bottom gate thin film transistor, flat panel display having the same and method of fabricating the same
12/31/2008CN100448030C Semiconductor device and method of fabricating the same
12/31/2008CN100448029C Thin film transistor and method of fabricating the same
12/31/2008CN100448028C A MOS resistor and its manufacture method
12/31/2008CN100448027C An asymmetric Schottky barrier MOS transistor and its manufacture method
12/31/2008CN100448026C Semiconductor structure and forming method thereof
12/31/2008CN100448025C Semiconductor device having reduced gate charge and reduced on resistance and method