Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
12/2008
12/24/2008CN101331617A Gallium nitride compound semiconductor light-emitting device
12/24/2008CN101331612A Integrated high voltage diode and manufacturing method thereof
12/24/2008CN101331610A Semiconductor device
12/24/2008CN101331603A Integration of planar and tri-gate devices on the same substrate
12/24/2008CN101331602A Device for storing substrates
12/24/2008CN101331601A Chip pickup apparatus, chip pickup method, chip peeling apparatus and chip peeling method
12/24/2008CN101331600A Semiconductor package having polymer coated copper wire and method for manufacturing the same
12/24/2008CN101331599A Field effect transistor
12/24/2008CN101331598A Source and drain formation in silicon on insulator device
12/24/2008CN101331597A Memory cell having stressed layers
12/24/2008CN101331596A Gas introduction device, method of manufacturing the same, and processing device
12/24/2008CN101331595A Microetching composition and method of using the same
12/24/2008CN101331594A Processing device, processing method, and plasma source
12/24/2008CN101331593A Aqueous dispersion for chemical mechanical polishing, chemical mechanical polishing method, and kit for preparing aqueous dispersion for chemical mechanical polishing
12/24/2008CN101331592A Laser irradiation apparatus, laser irradiation method and manufacturing method of semiconductor device
12/24/2008CN101331591A Alxgayin1-x-yn crystal substrate, semiconductor device, and method for manufacturing the same
12/24/2008CN101331590A Methods for oriented growth of nanowires on patterned substrates
12/24/2008CN101331589A Technique for preparing precursor films and compound layers for thin film solar cell fabrication and apparatus corresponding thereto
12/24/2008CN101331588A Coating apparatus and coating method
12/24/2008CN101331587A Reciprocating aperture mask system and method
12/24/2008CN101331586A 半导体器件 Semiconductor devices
12/24/2008CN101331585A Method for manufacturing bonded substrate
12/24/2008CN101331584A Device and method for treating the surfaces of substrates
12/24/2008CN101331583A SOI active layer with different surface orientation
12/24/2008CN101331437A Reference voltage generating circuit and power supply device using the same
12/24/2008CN101331157A Fluorine-containing polymer, negative photosensitive composition and partition wall
12/24/2008CN101331092A Notch stop pulsing process for plasma processing system
12/24/2008CN101331074A Vertical conveyance device
12/24/2008CN101330801A Method for forming pattern, method for manufacturing electro-optical device, and method for manufacturing electronic device
12/24/2008CN101330130A Fabrication of self-aligned via holes in polymer thin films
12/24/2008CN101330109A Semiconductor component with buffer layer
12/24/2008CN101330107A Time-after-time programmable memory and manufacturing method thereof
12/24/2008CN101330106A Thin-film transistor substrate and thin-film transistor for display panel as well as preparation method thereof
12/24/2008CN101330105A Strain-compensated field effect transistor and associated method of forming the transistor
12/24/2008CN101330104A Semiconductor device and method for fabricating thereof
12/24/2008CN101330102A Thin film transistor substrate and display device
12/24/2008CN101330101A Semiconductor device and manufacturing method thereof
12/24/2008CN101330100A Semiconductor substrate and its method for manufacturing
12/24/2008CN101330099A Fabricating a set of semiconducting nanowires, and electric device comprising a set of nanowires
12/24/2008CN101330095A Organic light emitting display and method of manufacturing the same
12/24/2008CN101330094A Organic light emitting diode display device and method of fabricating the same
12/24/2008CN101330090A Solid-state imaging device and method for manufacturing the same
12/24/2008CN101330088A Integrated circuit package body and preparation method thereof
12/24/2008CN101330085A Semiconductor memory devices and methods of forming the same
12/24/2008CN101330081A LED array module and packaging method thereof
12/24/2008CN101330080A High on-stage voltage right-handed LED integrated chip and manufacturing method thereof
12/24/2008CN101330079A Semiconductor subassemblies with interconnects and methods for manufacturing the same
12/24/2008CN101330078A High on-state voltage LED integrated chip with electrostatic protection and manufacturing method thereof
12/24/2008CN101330077A Stacked semiconductor package and method for manufacturing the same
12/24/2008CN101330074A Protection circuit for semiconductor device and semiconductor device including the same
12/24/2008CN101330073A Semiconductor device and method of manufacturing the same
12/24/2008CN101330072A Semiconductor device including metal interconnection and manufacturing method thereof
12/24/2008CN101330071A Mounting substrate and manufacturing method thereof
12/24/2008CN101330069A Flip chip package and method for manufacturing the same
12/24/2008CN101330068A Molded reconfigured wafer, stack package using the same, and method for manufacturing the stack package
12/24/2008CN101330067A Self-aligning wafer or chip structure and self-aligning stacking structure and manufacturing method thereof
12/24/2008CN101330066A Wafer structure for reducing occupation crystal particle volume and fine adjustment method thereof
12/24/2008CN101330065A Method for preparing convex point, low metallic layer of convex point and production method thereof
12/24/2008CN101330064A Semiconductor package and a method for manufacturing the same
12/24/2008CN101330063A Active element array structure and manufacturing method thereof
12/24/2008CN101330062A Method for preparing thin-film transistor array substrate
12/24/2008CN101330061A Method for preparing pixel structure
12/24/2008CN101330060A Method for preparing pixel structure
12/24/2008CN101330059A Method for preparing pixel structure
12/24/2008CN101330058A Waveguide optical detector and method for integrating monolithic of hetero-junction bipolar transistor
12/24/2008CN101330057A Electric programmable device with embedded EEPROM and preparation method thereof
12/24/2008CN101330056A Method and apparatus for forming self-aligning common source electrode in a memory structure
12/24/2008CN101330055A Method of manufacturing semiconductor device and semiconductor device
12/24/2008CN101330054A Method for forming passivation layer of CMOS device
12/24/2008CN101330053A Method for forming stress layer of complementary metal oxide semiconductor device
12/24/2008CN101330052A Method for forming CMOS device stress film
12/24/2008CN101330051A Method for obtaining LCOS device using argentum and generated structure thereof
12/24/2008CN101330050A Compensating metal oxide semiconductor image sensor and manufacturing method thereof
12/24/2008CN101330049A Self-aligning shallow groove isolation structure, memory unit and method for forming the same
12/24/2008CN101330048A Light dope ion injection method
12/24/2008CN101330047A Semiconductor component, display apparatus, optoelectronic device and method for manufacturing the same
12/24/2008CN101330046A Integrated circuit having a fin structure
12/24/2008CN101330045A Manufacturing method of semiconductor device
12/24/2008CN101330044A Method of cleaning surface of semiconductor substrate, method of manufacturing thin film, method of manufacturing semiconductor device, and semiconductor device
12/24/2008CN101330043A Method for manufacturing semiconductor device utilizing low dielectric layer filling gaps between metal lines
12/24/2008CN101330042A Conductive plug and preparation method thereof
12/24/2008CN101330041A Interconnecting hole of metal front medium layer and method for forming the same
12/24/2008CN101330040A Interconnection layer top layer wiring layer of semiconductor device and method for forming the same
12/24/2008CN101330039A Method for eliminating load effect using through-hole plug
12/24/2008CN101330038A Method of manufacturing a semiconductor device
12/24/2008CN101330037A Method for preparing isolation of shallow channel
12/24/2008CN101330036A Isolation structure of shallow plough groove and manufacturing method thereof
12/24/2008CN101330035A Isolation structure of shallow plough groove and manufacturing method thereof
12/24/2008CN101330034A Supporting device, apparatus for transporting substrate and method thereof
12/24/2008CN101330033A Chuck base having cooling path for cooling wafer
12/24/2008CN101330032A Plasma processing apparatus and transition chamber thereof
12/24/2008CN101330031A Substrate transfering apparatus
12/24/2008CN101330030A Method for removing abnormal point of detection data
12/24/2008CN101330029A Method for detecting ultra-shallow junction resistance and film resistance
12/24/2008CN101330028A Electronic device manufacturing method and electronic device
12/24/2008CN101330027A Electronic device manufacturing method and electronic device
12/24/2008CN101330026A Electronic device and method of manufacturing the same
12/24/2008CN101330025A Method for fabricating semiconductor encapsulation and semiconductor chip for encapsulation
12/24/2008CN101330024A Resin sealing apparatus, movable member and resin sealing method
12/24/2008CN101330023A Thin film transistor manufacturing method, thin film transistor and display device using the same