Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
12/2008
12/25/2008US20080315191 Organic Thin Film Transistor Array and Method of Manufacturing the Same
12/25/2008US20080315190 Organic Thin Film Transistor and Method for Surface Modification of Gate Insulating Layer of Organic Thin Film Transistor
12/25/2008US20080315189 Organic light emitting diode display device and method of fabricating the same
12/25/2008US20080315183 Semiconductor device with carbon nanotube channel and manufacturing method thereof
12/25/2008US20080315181 Nanotube schottky diodes for high-frequency applications
12/25/2008US20080315177 Light emission using quantum dot emitters in a photonic crystal
12/25/2008US20080315174 Variable resistance non-volatile memory cells and methods of fabricating same
12/25/2008US20080315173 Integrated circuit having multilayer electrode
12/25/2008US20080315172 Integrated circuit including vertical diode
12/25/2008US20080315171 Integrated circuit including vertical diode
12/25/2008US20080315141 Slit Valve Door
12/25/2008US20080315129 Ion planting while growing a III-nitride layer
12/25/2008US20080315095 Electron beam apparatus, a device manufacturing method using the same apparatus, a pattern evaluation method, a device manufacturing method using the same method, and a resist pattern or processed wafer evaluation method
12/25/2008US20080314871 High resolution plasma etch
12/25/2008US20080314832 Method of filtering
12/25/2008US20080314738 Electrolytic Device Based on a Solution-Processed Electrolyte
12/25/2008US20080314621 Parallel chip embedded printed circuit board and manufacturing method thereof
12/25/2008US20080314523 Gas supply mechanism and substrate processing apparatus
12/25/2008US20080314522 Apparatus and method to confine plasma and reduce flow resistance in a plasma reactor
12/25/2008US20080314521 Device with self aligned gaps for capacitance reduction
12/25/2008US20080314520 Method and apparatus for manufacturing semiconductor device, and storage medium
12/25/2008US20080314439 Array Of Monolithically Integrated Thin Film Photovoltaic Cells And Associated Methods
12/25/2008US20080314424 Method and apparatus for wafer cleaning
12/25/2008US20080314408 Plasma etching apparatus and chamber cleaning method using the same
12/25/2008US20080314320 Chamber Mount for High Temperature Application of AIN Heaters
12/25/2008US20080314288 Mixture For Doping Semiconductors
12/25/2008US20080313895 Manufacturing Method of Electronic Component
12/24/2008WO2008157822A1 Under bump metallization structure having a seed layer for electroless nickel deposition
12/24/2008WO2008157722A1 Wafer level surface passivation of stackable integrated circuit chips
12/24/2008WO2008157666A1 Sub-micron laser direct write
12/24/2008WO2008157612A1 Codeposition of copper nanoparticles in through silicon via filling
12/24/2008WO2008157605A1 Susceptor for improving throughput and reducing wafer damage
12/24/2008WO2008157510A1 Planar nonpolar m-plane group iii nitride films grown on miscut substrates
12/24/2008WO2008157338A1 Copper-free semiconductor device interface and methods of fabrication and use thereof
12/24/2008WO2008157315A2 High voltage esd protection featuring pnp bipolar junction transistor
12/24/2008WO2008157130A1 Combinatorial processing including stirring
12/24/2008WO2008157108A2 Metal plugged substrates with no adhesive between metal and polyimide
12/24/2008WO2008157068A2 Oxygen sacvd to form sacrificial oxide liners in substrate gaps
12/24/2008WO2008157038A1 Semiconductor devices and electronic systems comprising floating gate transistors and methods of forming the same
12/24/2008WO2008157018A1 Minimization of mask undercut on deep silicon etch
12/24/2008WO2008157001A1 Semiconductor assemblies, stacked semiconductor devices, and methods of manufacturing semiconductor assemblies and stacked semiconductor devices
12/24/2008WO2008156994A1 Methods and systems for imaging and cutting semiconductor wafers and other semiconductor workpieces
12/24/2008WO2008156963A1 Systems and methods for oscillating exposure of a semiconductor workpiece to multiple chemistries
12/24/2008WO2008156958A2 Electrode assembly and plasma processing chamber utilizing thermally conductive gasket and o-rings
12/24/2008WO2008156756A1 Highly scalable thin film transistor
12/24/2008WO2008156754A1 Junction diode with reduced reverse current
12/24/2008WO2008156744A1 Methods and apparatus for reducing the consumption of reagents in electronic device manufacturing processes
12/24/2008WO2008156694A1 Polycrystalline thin film bipolar transistors and methods of making the same
12/24/2008WO2008156674A1 Improved power switching transistors
12/24/2008WO2008156631A2 Reactive flow deposition and synthesis of inorganic foils
12/24/2008WO2008156624A1 Method to form low-defect polycrystalline semiconductor material for use in a transistor
12/24/2008WO2008156565A1 Semiconductor die with backside passive device integration
12/24/2008WO2008156542A1 Methods of and apparatus for protecting a region of process exclusion adjacent to a region of process performance in a process chamber
12/24/2008WO2008156529A1 System, method and apparatus for maintaining separation of liquids in a controlled meniscus
12/24/2008WO2008156516A2 Methods of fabricating silicon carbide power devices by at least partially removing an n-type silicon carbide substrate, and silicon carbide power devices so fabricated
12/24/2008WO2008156367A1 Method of loading a substrate on a substrate table, device manufacturing method, computer program, data carrier and apparatus
12/24/2008WO2008156282A2 Etching method for next generation semiconductor process
12/24/2008WO2008156215A1 Mos semiconductor memory device
12/24/2008WO2008156190A1 Process for producing semiconductor device
12/24/2008WO2008156182A1 Semiconductor device and method for manufacturing the same
12/24/2008WO2008156170A1 Soldering apparatus
12/24/2008WO2008156162A1 Wafer inspecting probe member and probe card
12/24/2008WO2008156152A1 Transfer method and transfer apparatus
12/24/2008WO2008156140A1 Semiconductor device
12/24/2008WO2008156100A1 Circuit board and semiconductor device
12/24/2008WO2008156076A1 Pn diode, electric circuit device and power conversion device
12/24/2008WO2008156071A1 Semiconductor device
12/24/2008WO2008156070A1 Semiconductor device
12/24/2008WO2008156058A1 Method for joining silicon base materials, liquid droplet delivery head, liquid droplet delivery apparatus, and electronic device
12/24/2008WO2008156056A1 Method for joining silicon base materials, liquid droplet delivery head, liquid droplet delivery apparatus, and electronic device
12/24/2008WO2008156054A1 Polishing composition and method for manufacturing semiconductor integrated circuit device
12/24/2008WO2008156040A1 Method of manufacturing semiconductor device
12/24/2008WO2008156029A1 Process for producing semiconductor device, insulating film for semiconductor device, and apparatus for producing the insulating film
12/24/2008WO2008156005A1 Semiconductor failure analyzer, semiconductor failure analysis method and semiconductor failure analysis program
12/24/2008WO2008156002A1 Polishing sheet and method for manufacturing the same
12/24/2008WO2008155996A1 Tunnel magnetoresistive thin film and magnetic multilayer formation apparatus
12/24/2008WO2008155995A1 Tunnel magnetoresistive thin film and magnetic multilayer film formation apparatus
12/24/2008WO2008155987A1 Polishing composition, method for polishing the surface of semiconductor integrated circuit, and method for production of copper interconnect for semiconductor integrated circuit
12/24/2008WO2008155984A1 Substrate processing method and substrate processing apparatus
12/24/2008WO2008155958A1 Semiconductor light-emitting device and method for manufacturing semiconductor light-emitting device
12/24/2008WO2008155951A2 Synthetic quartz glass body, process for producing the same, optical element, and optical apparatus
12/24/2008WO2008155932A1 Substrate carrying method
12/24/2008WO2008155928A1 Photocurable composition and process for producing molded object having fine pattern in surface
12/24/2008WO2008155876A1 Soi wafer manufacturing method
12/24/2008WO2008155860A1 Die coater and process for producing substrate structure for plasma display panel
12/24/2008WO2008155831A1 Timing analyzer, timing analysis program, and timing analysis method
12/24/2008WO2008155438A1 Microspheres of silicon and photonic sponges, method for production and uses thereof in the manufacture of photonic devices
12/24/2008WO2008155379A2 Field effect transistor with alternating electrical contacts
12/24/2008WO2008155233A1 Method of producing a via in a reconstituted substrate
12/24/2008WO2008155231A1 Device including integrated components imbedded in cavities of a reception semi-conductor plate and corresponding method
12/24/2008WO2008155208A1 Fin field effect transistor devices with self-aligned source and drain regions
12/24/2008WO2008154764A1 Gripper device having a detection device for determining position information
12/24/2008WO2008136855A3 Metal oxide nanocrystal composition and methods
12/24/2008WO2008134426A3 Leadframe configuration to enable strip testing of sot-23 packages and the like
12/24/2008WO2008133752A9 Nanoscale oxide coatings
12/24/2008WO2008130465A3 Nanodevices for spintronics methods of using same
12/24/2008WO2008127452A3 Glue layer for hydrofluorocarbon etch
12/24/2008WO2008127412A3 Radiation hardened lateral mosfet structure
12/24/2008WO2008118225A3 Tungsten interconnect super structure for semiconductor power devices
12/24/2008WO2008109576A3 Systems and methods for efficient slurry application for chemical mechanical polishing