Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
12/2008
12/25/2008US20080318371 Semiconductor device and method of forming the same
12/25/2008US20080318370 Semiconductor Integrated Circuit Switch Matrix
12/25/2008US20080318369 Soi device with charging protection and methods of making same
12/25/2008US20080318368 Method of manufacturing ZnO-based this film transistor
12/25/2008US20080318367 Method of manufacturing semiconductor device
12/25/2008US20080318366 Method for producing a support for the growth of localised elongated nanostructures
12/25/2008US20080318365 Formation of alpha particle shields in chip packaging
12/25/2008US20080318364 Process applying die attach film to singulated die
12/25/2008US20080318363 Stack circuit member and method
12/25/2008US20080318362 Manufacturing Method of Semiconductor Integrated Circuit Device
12/25/2008US20080318361 Method for manufacturing semiconductor package
12/25/2008US20080318360 Device and method for fabricating double-sided soi wafer scale package with optical through via connections
12/25/2008US20080318359 Method of manufacturing silicon carbide semiconductor substrate
12/25/2008US20080318356 Semiconductor apparatus and method for manufacturing the same
12/25/2008US20080318354 Method of fabricating thin film transistor and method of fabricating liquid crystal display
12/25/2008US20080318353 Microelectronic imagers with optical devices having integral reference features and methods for manufacturing such microelectronic imagers
12/25/2008US20080318352 Method of bonding mems integrated circuits
12/25/2008US20080318351 Method of setting recipes of a defect test
12/25/2008US20080318350 Apparatus for improving incoming and outgoing wafer inspection productivity in a wafer reclaim factory
12/25/2008US20080318349 Wafer level hermetic bond using metal alloy
12/25/2008US20080318348 Method of constructing a stacked-die semiconductor structure
12/25/2008US20080318347 Manufacturing method of semiconductor device
12/25/2008US20080318346 Manufacturing method for semiconductor integrated device
12/25/2008US20080318345 Plasma ion implantation process control using reflectometry
12/25/2008US20080318344 INDICATION OF THE END-POINT REACTION BETWEEN XeF2 AND MOLYBDENUM
12/25/2008US20080318343 Wafer reclaim method based on wafer type
12/25/2008US20080318166 Method of manufacturing semiconductor device
12/25/2008US20080318049 Single-Walled Carbon Nanotube and Aligned Single-Walled Carbon Nanotube Bulk Structure, and Their Production Process, Production Apparatus and Application Use
12/25/2008US20080318030 Laser transfer articles and method of making
12/25/2008US20080318003 Nanostructures and Method of Making the Same
12/25/2008US20080317966 Thermally sprayed gastight protective layer for metal substrates
12/25/2008US20080317954 Pulsed deposition process for tungsten nucleation
12/25/2008US20080317953 Mesoporous materials and methods
12/25/2008US20080317768 Bioconjugated nanoparticles
12/25/2008US20080317581 Vacuum Processing Apparatus
12/25/2008US20080317565 Segregating Wafer Carrier Types In Semiconductor Storage Devices
12/25/2008US20080317422 Optical integrated device and manufacturing method thereof
12/25/2008US20080316831 Nonvolatile semiconductor device, system including the same, and associated methods
12/25/2008US20080316828 Memory in logic cell
12/25/2008US20080316800 Semiconductor memory device
12/25/2008US20080316796 Method of making high forward current diodes for reverse write 3D cell
12/25/2008US20080316795 Method of making nonvolatile memory device containing carbon or nitrogen doped diode
12/25/2008US20080316793 Integrated circuit including contact contacting bottom and sidewall of electrode
12/25/2008US20080316790 Semiconductor device and method of manufacturing the same and semiconductor manufacturing device
12/25/2008US20080316726 Multi-layer substrate and manufacture method thereof
12/25/2008US20080316714 Integrated structures and fabrication methods thereof implementing a cell phone or other electronic system
12/25/2008US20080316711 Vlsi hot-spot minimization using nanotubes
12/25/2008US20080316607 Image sensor and method of manufacturing the same
12/25/2008US20080316577 Mems device with an angular vertical comb actuator
12/25/2008US20080316505 Determining the Position of a Semiconductor Substrate on a Rotation Device
12/25/2008US20080316504 Method and system for machine vision-based feature detection and mark verification in a workpiece or wafer marking system
12/25/2008US20080316449 Exposure Device, Exposure Method and Method of Manufacturing Semiconductor Device
12/25/2008US20080316386 Thin Film Transistor, Thin Film Transistor Substrate, and Methods for Manufacturing the Same
12/25/2008US20080316384 Display substrate, method for manufacturing the same and display apparatus having the same
12/25/2008US20080316152 Transistor circuit, display panel and electronic apparatus
12/25/2008US20080315978 Method and apparatus for non-conductively interconnecting integrated circuits
12/25/2008US20080315759 Pixel, organic light emitting display and associated methods
12/25/2008US20080315746 Method of Manufacturing Fine Structure, Fine Structure, Display Unit, Method of Manufacturing Recoding Device, and Recoding Device
12/25/2008US20080315745 Electronic device containing carbon nanotubes and method for manufacturing the same
12/25/2008US20080315440 Method of Manufacturing a Plurality of Semiconductor Devices and Carrier Substrate
12/25/2008US20080315438 Semiconductor device including a stress buffer
12/25/2008US20080315436 Semiconductor wafer that supports multiple packaging techniques
12/25/2008US20080315435 Methods for stacking wire-bonded integrated circuit dice on flip-chip bonded integrated circuit dice
12/25/2008US20080315434 Wafer level surface passivation of stackable integrated circuit chips
12/25/2008US20080315433 Self-aligned wafer or chip structure, self-aligned stacked structure and methods for fabircating the same
12/25/2008US20080315432 Electrical Shielding in Stacked Dies by Using Conductive Die Dttach Adhesive
12/25/2008US20080315431 Mounting substrate and manufacturing method thereof
12/25/2008US20080315430 Nanowire vias
12/25/2008US20080315429 Method for improving the selectivity of a cvd process
12/25/2008US20080315428 Thin Film Transistor and Display Device, and Method for Manufacturing Thereof
12/25/2008US20080315426 METAL CAP WITH ULTRA-LOW k DIELECTRIC MATERIAL FOR CIRCUIT INTERCONNECT APPLICATIONS
12/25/2008US20080315425 Semiconductor Devices and Methods for Fabricating the Same
12/25/2008US20080315424 Structure and manufactruing method of chip scale package
12/25/2008US20080315422 Methods and apparatuses for three dimensional integrated circuits
12/25/2008US20080315420 Metal pad formation method and metal pad structure using the same
12/25/2008US20080315418 Methods of post-contact back end of line through-hole via integration
12/25/2008US20080315414 Electronic device manufacturing method and electronic device
12/25/2008US20080315413 Electronic device manufacturing method and electronic device
12/25/2008US20080315412 Package Structure with Flat Bumps for Integrate Circuit or Discrete Device and Method of Manufacture the Same
12/25/2008US20080315411 Integrated circuit package system employing device stacking
12/25/2008US20080315407 Three-dimensional circuitry formed on integrated circuit device using two-dimensional fabrication
12/25/2008US20080315406 Integrated circuit package system with cavity substrate
12/25/2008US20080315405 Heat spreader in a flip chip package
12/25/2008US20080315404 Integrated thermal structures and fabrication methods thereof facilitating implementing a cell phone or other electronic system
12/25/2008US20080315401 Power Semiconductor Module And Method of Manufacturing the Power Semiconductor Module
12/25/2008US20080315400 Microelectromechanical systems design feature
12/25/2008US20080315399 Semiconductor Device Having Through Contacts Through a Plastic Housing Composition and Method for the Production Thereof
12/25/2008US20080315396 Mold compound circuit structure for enhanced electrical and thermal performance
12/25/2008US20080315395 Stacked semiconductor package and method for manufacturing the same
12/25/2008US20080315394 Semiconductor package and a method for manufacturing the same
12/25/2008US20080315393 Rf transistor packages with internal stability network and methods of forming rf transistor packages with internal stability networks
12/25/2008US20080315392 Rf power transistor packages with internal harmonic frequency reduction and methods of forming rf power transistor packages with internal harmonic frequency reduction
12/25/2008US20080315391 Integrated structures and methods of fabrication thereof with fan-out metallization on a chips-first chip layer
12/25/2008US20080315389 Bumpless Flip-Chip Assembly With a Complaint Interposer Contractor
12/25/2008US20080315387 Semiconductor Package-on-Package System Including Integrated Passive Components
12/25/2008US20080315385 Array molded package-on-package having redistribution lines
12/25/2008US20080315384 Apparatuses and methods for forming electronic assemblies
12/25/2008US20080315381 Lead frame, semiconductor device using same and manufacturing method thereof
12/25/2008US20080315380 Integrated circuit package system having perimeter paddle
12/25/2008US20080315377 Packaged electronic modules and fabrication methods thereof implementing a cell phone or other electronic system
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