Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
06/2014
06/11/2014CN103855168A Substrate for display device and method of fabricating the same
06/11/2014CN103855166A Semiconductor memory devices and methods of fabricating the same
06/11/2014CN103855165A Semiconductor memory device and method of manufacturing the same
06/11/2014CN103855164A Semiconductor device, manufacturing method and operating method of semiconductor device
06/11/2014CN103855163A Two-bit SONOS flash memory and manufacturing method thereof
06/11/2014CN103855162A Stacked gate type SONOS flash memory and manufacturing method thereof
06/11/2014CN103855161A SONOS flash memory and manufacturing method thereof
06/11/2014CN103855160A Novel OTP device structure and manufacturing method thereof
06/11/2014CN103855159A ROM semiconductor device and manufacturing method thereof
06/11/2014CN103855158A Semiconductor device including a redistribution layer and metallic pillars coupled thereto
06/11/2014CN103855157A MIM-capacitor and method of manufacturing same
06/11/2014CN103855156A Diode structure compatible with FinFET process
06/11/2014CN103855155A Tri-mode integrated insulated gate bipolar transistor and forming method thereof
06/11/2014CN103855154A IGBT device integrated with MOSFET and manufacturing method
06/11/2014CN103855152A Two-way double-pole junction transistor used for high-voltage electrostatic discharge protection
06/11/2014CN103855151A Semiconductor element, manufacturing method of semiconductor element and operation method of semiconductor element
06/11/2014CN103855150A On-chip decoupling capacitor, integrated chip, and method of manufacturing same
06/11/2014CN103855140A Partial SOI on power device for breakdown voltage improvement
06/11/2014CN103855138A Semiconductor package and method for manufacturing the same
06/11/2014CN103855134A Apparatus including a semiconductor device coupled to a decoupling device
06/11/2014CN103855130A Array substrate, manufacturing method of array substrate and display device
06/11/2014CN103855129A Semiconductor device and method for manufacturing same
06/11/2014CN103855127A Programmable polycrystalline silicon diode fuse wire device structure and manufacturing method
06/11/2014CN103855126A Semiconductor Devices and Methods of Manufacture Thereof
06/11/2014CN103855124A Semiconductor device and method for manufacturing the same
06/11/2014CN103855122A Packaged vertical power device comprising compressive stress and manufacturing method thereof
06/11/2014CN103855121A Packaged semiconductor device with tensile stress and manufacturing method thereof
06/11/2014CN103855120A Multichip package and fabrication method thereof
06/11/2014CN103855119A Semiconductor module, semiconductor device and manufacturing method of semiconductor module
06/11/2014CN103855118A Bump-equipped electronic component and method for manufacturing bump-equipped electronic component
06/11/2014CN103855117A Semiconductor device including a redistribution layer and metallic pillars coupled thereof
06/11/2014CN103855116A Electronic component, electronic apparatus including the same, and manufacturing method of the electronic apparatus
06/11/2014CN103855115A Substrate pad structure
06/11/2014CN103855114A Methods and apparatus for package with interposers
06/11/2014CN103855112A DIE HAVING THROUGH-SUBSTRATE VIAS WITH DEFORMATION PROTECTED TIPS and method for manufacturing same.
06/11/2014CN103855109A Chip Module, Insulation Material and Method for Fabricating Chip Module
06/11/2014CN103855108A Copper-based composite heat conduction material and manufacturing method thereof
06/11/2014CN103855105A Environmental sensitive electronic device package and manufacturing method thereof
06/11/2014CN103855104A Moisture-tight semiconductor module and method for producing moisture-tight semiconductor module
06/11/2014CN103855103A Semiconductor device and manufacturing method thereof
06/11/2014CN103855102A Semiconductor Packages, Systems, and Methods of Formation Thereof
06/11/2014CN103855100A Seal Ring Structure with Metal-Insulator-Metal Capacitor
06/11/2014CN103855099A Substrate structure with component arrangement area and manufacturing technology thereof
06/11/2014CN103855098A Method for forming storage unit of flash memory
06/11/2014CN103855097A Contact Plugs in SRAM Cells and Method of Forming the Same
06/11/2014CN103855096A Forming method of CMOS transistor
06/11/2014CN103855095A Method for manufacturing semiconductor device
06/11/2014CN103855094A Semiconductor device and manufacturing method thereof
06/11/2014CN103855093A Semiconductor device and manufacturing method thereof
06/11/2014CN103855092A Method for manufacturing semiconductor device
06/11/2014CN103855091A Semiconductor structure and method of manufacturing same
06/11/2014CN103855090A Semiconductor structure and forming method thereof
06/11/2014CN103855089A Reverse conduction type insulated gate bipolar transistor and manufacturing method thereof
06/11/2014CN103855088A WAFER SEPARATION method and integrated circuit wafer
06/11/2014CN103855087A Array substrate, manufacturing method of array substrate and display device
06/11/2014CN103855086A Method for manufacturing electrowetting display device
06/11/2014CN103855085A Thin film device, method of manufacturing the same, and method of manufacturing display
06/11/2014CN103855084A Method of manufacturing organic light emitting display apparatus
06/11/2014CN103855083A Microfluidics delivery systems
06/11/2014CN103855082A Wet activation of ruthenium containing liner/barrier
06/11/2014CN103855081A Integrated circuit and fabricating method thereof
06/11/2014CN103855080A Methods for fabricating integrated circuits having low resistance device contacts
06/11/2014CN103855079A Buried word line structure and method of forming the same
06/11/2014CN103855078A Metal interconnection technological method
06/11/2014CN103855077A Semiconductor structure with contact plugs and forming method thereof
06/11/2014CN103855076A Electrically programmable fuse structure and manufacturing method thereof
06/11/2014CN103855075A Method for collecting etching conditions
06/11/2014CN103855074A Method for manufacturing semiconductor device
06/11/2014CN103855073A Preparation method of shallow-groove isolation structure
06/11/2014CN103855072A Isoplanar field oxidation isolation structure and forming method thereof
06/11/2014CN103855071A Method for manufacturing semiconductor device
06/11/2014CN103855070A Method for flattening shallow trench isolation of ultra-low-density active region
06/11/2014CN103855069A Adsorption device
06/11/2014CN103855068A Manufacturing method for surface bumps of electrostatic adsorption plate in dry etching device
06/11/2014CN103855067A Image sensing chip packaging method
06/11/2014CN103855066A Image induction chip packaging method for protecting chip
06/11/2014CN103855065A Workpiece locating system, loading system and plasma processing device
06/11/2014CN103855064A Moving and sending mechanism
06/11/2014CN103855063A Battery piece transferring trolley
06/11/2014CN103855062A Novel silicon wafer bearing device applied to wafer silicon dioxide back sealing membrane growth process, and growth method
06/11/2014CN103855061A Special material system
06/11/2014CN103855060A Apparatus and method for locating a plurality of placement positions on a carrier object
06/11/2014CN103855059A Cleaning apparatus
06/11/2014CN103855058A Apparatus and method for manufacturing electronic component
06/11/2014CN103855057A Tray lifting device, preheating apparatus and method for cooling high-temperature tray
06/11/2014CN103855056A Suction nozzle anti-oxidation device of fully automatic transistor die bonder
06/11/2014CN103855055A Rail anti-oxidation device of fully automatic transistor die bonder
06/11/2014CN103855054A Process chamber
06/11/2014CN103855053A Motion system for simultaneous surface mounting of multiple BGAs
06/11/2014CN103855052A PCB fixed structure of BGA rework table
06/11/2014CN103855051A Control system for simultaneous surface mounting of multiple BGAs
06/11/2014CN103855050A Wafer yield monitoring method
06/11/2014CN103855049A Intelligent probe card stylus pressure control system and method
06/11/2014CN103855048A Vacuum chamber measurement using residual gas analyzer
06/11/2014CN103855047A Physical analysis structure and method of deep-groove products
06/11/2014CN103855046A Structure for monitoring etching back depth and monitoring method
06/11/2014CN103855045A Adjustment method for parameters of chips on wafer
06/11/2014CN103855044A Method for adding redundant graphics
06/11/2014CN103855043A Semiconductor packaging flip chip bonding method
06/11/2014CN103855042A Device and method for providing electrical connection
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