| Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974) |
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| 06/10/2009 | CN101454871A Manufacturing method of laminated wafer |
| 06/10/2009 | CN101454870A Variable overlap of dummy shapes for improved rapid thermal anneal uniformity |
| 06/10/2009 | CN101452961A Thin film transistor, display device, and method for manufacturing the same |
| 06/10/2009 | CN101452931A Integrated circuit device |
| 06/10/2009 | CN101452899A Nitride semiconductor device and method of manufacturing the same |
| 06/10/2009 | CN101452894A Gaas semiconductor substrate , group III-v compound semiconductor device and method of manufacturing the same |
| 06/10/2009 | CN101452893A Display device and manufacturing method of the same |
| 06/10/2009 | CN101452892A Method of making a finfet device structure having dual metal and high-k gates |
| 06/10/2009 | CN101452891A Method for manufacturing resistance variant memory crossover array |
| 06/10/2009 | CN101452890A Semiconductor device and method of fabricating the same |
| 06/10/2009 | CN101452889A Manufacturing method for non-volatile memory |
| 06/10/2009 | CN101452888A Method for forming tunnel oxidation layer window in EEPROM |
| 06/10/2009 | CN101452887A Capacitor layer manufacturing method in DRAM |
| 06/10/2009 | CN101452886A Semiconductor device and method for forming the same |
| 06/10/2009 | CN101452885A Method and structure for forming multiple self-aligned gate stacks for logic devices |
| 06/10/2009 | CN101452884A Multi device and method of manufacturing the same |
| 06/10/2009 | CN101452883A Semiconductor device and its making method and liquid spraying apparatus |
| 06/10/2009 | CN101452882A Method for manufacturing semiconductor element |
| 06/10/2009 | CN101452881A Methods for adjusting critical dimension uniformity in an etch process |
| 06/10/2009 | CN101452880A Method of forming interlayer dielectric for semiconductor device |
| 06/10/2009 | CN101452879A Cleaning method after opening etching |
| 06/10/2009 | CN101452878A Method for forming blocking layer of semiconductor device |
| 06/10/2009 | CN101452877A Through-hole preparation process |
| 06/10/2009 | CN101452876A Manufacturing process for metal interconnecting construction |
| 06/10/2009 | CN101452875A Method of forming isolation layer in semiconductor device |
| 06/10/2009 | CN101452874A Chemical mechanical grinding process for shallow trench isolation structure |
| 06/10/2009 | CN101452873A Shallow trench isolation process |
| 06/10/2009 | CN101452872A High-voltage region shallow trench top angle rounding method |
| 06/10/2009 | CN101452871A Manufacturing method for STI isolation structure |
| 06/10/2009 | CN101452870A Electrostatic chuck and apparatus having the same |
| 06/10/2009 | CN101452869A Epitaxial film thickness test method |
| 06/10/2009 | CN101452868A Wafer auxiliary lighting detection device and wafer detection method |
| 06/10/2009 | CN101452867A Process for automatically detecting silicon chip edge |
| 06/10/2009 | CN101452866A Method for titanium lacking detection |
| 06/10/2009 | CN101452865A Dispensing solder for mounting semiconductor chips |
| 06/10/2009 | CN101452864A LED sub-adhesion substrate packaging method and packaging construction thereof |
| 06/10/2009 | CN101452863A Manufacturing method for using compliant layer in grain reconfigured encapsulation construction |
| 06/10/2009 | CN101452862A Stack encapsulation method with grains reconfigured and stack construction thereof |
| 06/10/2009 | CN101452861A Multi-chip stacking structure and preparation thereof |
| 06/10/2009 | CN101452860A Multi-chip stacking structure and preparation thereof |
| 06/10/2009 | CN101452859A Method of fabricating high voltage device |
| 06/10/2009 | CN101452858A Method of producing thin film transistor and method of exposure using attenuated type mask |
| 06/10/2009 | CN101452857A Trench dmos transistor structure having a low resistance path to a drain contact located on an upper surface |
| 06/10/2009 | CN101452856A Non-volatile memory unit, NAND non-volatile memory and manufacturing method thereof |
| 06/10/2009 | CN101452855A Construction and production process for thin-film transistor of image display system |
| 06/10/2009 | CN101452854A Method for producing MOS device |
| 06/10/2009 | CN101452853A MOS transistor forming method |
| 06/10/2009 | CN101452852A Dual bit charge trapping device manufacturing process |
| 06/10/2009 | CN101452851A Manufacturing method for ESD gate grounding NMOS transistor |
| 06/10/2009 | CN101452850A Production method for high voltage transistor |
| 06/10/2009 | CN101452849A Production method for high voltage transistor |
| 06/10/2009 | CN101452848A MOS transistor production method and structure |
| 06/10/2009 | CN101452847A Manufacturing method for ESD gate grounding NMOS transistor |
| 06/10/2009 | CN101452846A Thick aluminum film forming process |
| 06/10/2009 | CN101452845A Wet method corrosion process for silicon nitride film |
| 06/10/2009 | CN101452844A Method for preparing high dielectric coefficient grid medium of embedded silicon nanocrystalline |
| 06/10/2009 | CN101452843A Process for preparing p type gallium arsenide ohmic contact |
| 06/10/2009 | CN101452842A Production method for metal electrode capable of reducing leakage current of device |
| 06/10/2009 | CN101452841A Selective grid, non-volatile semi-conductor memory device and manufacturing method thereof |
| 06/10/2009 | CN101452840A Metal gate forming method in semiconductor device |
| 06/10/2009 | CN101452839A Production method for high voltage transistor |
| 06/10/2009 | CN101452838A Process for silicon nano crystal preparation by electron-beam evaporation mode |
| 06/10/2009 | CN101452837A Semiconductor element and its manufacture |
| 06/10/2009 | CN101452836A Method for reducing substrate current in semiconductor device |
| 06/10/2009 | CN101452835A Method for preparing semiconductor conductive film by doping hydrogen on the surface of diamond |
| 06/10/2009 | CN101452834A Method of manufacturing GaN substrate, method of manufacturing epitaxialwafer, method of manufacturing semiconductor device and epitaxialwafer |
| 06/10/2009 | CN101452833A Split device front metal producing method |
| 06/10/2009 | CN101452832A Method of forming a germanium silicide layer, semiconductor device including the germanium silicide layer, and method of manufacturing the semiconductor device |
| 06/10/2009 | CN101452831A First wafer controlling method in wafer production |
| 06/10/2009 | CN101452830A Capacitor manufacturing method capable of improving electrical behavior |
| 06/10/2009 | CN101452829A Preparing method for semiconductor device special structure |
| 06/10/2009 | CN101452828A Method of dividing wafer |
| 06/10/2009 | CN101452827A Treatment apparatus, treatment method, and storage medium |
| 06/10/2009 | CN101452826A Chemical treatment to reduce machining-induced sub-surface damage in semiconductor processing components comprising silicon carbide |
| 06/10/2009 | CN101452825A Process for manufacturing semiconductor device |
| 06/10/2009 | CN101452824A Wet-chemistry semiconductor-chip treatment method |
| 06/10/2009 | CN101452823A Ozonated water mixture supply apparatus and method, and substrate treating facility with the apparatus |
| 06/10/2009 | CN101452822A Wafer cleaning apparatus and correcting method of the same |
| 06/10/2009 | CN101452821A Plasma treatment apparatus and shield ring thereof |
| 06/10/2009 | CN101452820A Semiconductor cleaning equipment using green carbon monoxide super fluid |
| 06/10/2009 | CN101452819A Method for preparing alignment mark used for ion injection |
| 06/10/2009 | CN101452818A Measuring method capable of enhancing sintering temperature measurement accuracy for electrode sintering platform |
| 06/10/2009 | CN101452817A Method for monitoring obliteration of wafer support platform and corresponding system |
| 06/10/2009 | CN101452816A Ion injection monitoring method |
| 06/10/2009 | CN101452815A Novel method for IGBT ultrathin wafer back process |
| 06/10/2009 | CN101452814A Method for enhancing self-aligning contact hole breakdown voltage and polysilicon gate construction |
| 06/10/2009 | CN101452813A Method for establishing non-wafer measuring system |
| 06/10/2009 | CN101451963A Method and system for defect detection |
| 06/10/2009 | CN101451265A Gaas single crystal substrate and epitaxial wafer using the same |
| 06/10/2009 | CN101451054A Adhesive bonding sheet, semiconductor device using same, and method for manufacturing such semiconductor device |
| 06/10/2009 | CN101451053A Adhesive bonding sheet, semiconductor device using same, and method for manufacturing such semiconductor device |
| 06/10/2009 | CN101450457A Polishing apparatus and polishing method |
| 06/10/2009 | CN100499364C Piezoelectric vibration device |
| 06/10/2009 | CN100499186C P-n heterojunction structure of zinc oxide-based nanorod and semiconductor thin film, preparation thereof, and nano-device comprising same |
| 06/10/2009 | CN100499177C Solar cell module connector and method of producing solar cell module panel |
| 06/10/2009 | CN100499175C Semiconductor device and method for manufacturing the same |
| 06/10/2009 | CN100499169C Structure of thin-film transistor and method of manufacturing same |
| 06/10/2009 | CN100499168C Semiconductor device |
| 06/10/2009 | CN100499164C Trench semiconductor device and method of manufacturing it |
| 06/10/2009 | CN100499159C IGBT cathode design with improved safe operating area capability |