Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
07/2009
07/30/2009US20090191695 Method of manufacturing nitride semiconductor substrate
07/30/2009US20090191694 Manufacturing method of semiconductor substrate
07/30/2009US20090191693 Wafer processing method
07/30/2009US20090191692 Wafer processing method
07/30/2009US20090191691 Method for singulating semiconductor devices
07/30/2009US20090191690 Increasing Die Strength by Etching During or After Dicing
07/30/2009US20090191689 Method of Arranging Dies in a Wafer for Easy Inkless Partial Wafer Process
07/30/2009US20090191688 Shallow Trench Isolation Process Using Two Liners
07/30/2009US20090191687 Method of filling a trench and method of forming an isolating layer structure using the same
07/30/2009US20090191686 Method for Preparing Doped Polysilicon Conductor and Method for Preparing Trench Capacitor Structure Using the Same
07/30/2009US20090191685 Method for forming capacitor in dynamic random access memory
07/30/2009US20090191684 Novel Approach to Reduce the Contact Resistance
07/30/2009US20090191683 Method of forming transistor having channel region at sidewall of channel portion hole
07/30/2009US20090191682 Fabrication method of semiconductor device
07/30/2009US20090191681 Nor-type flash memory device with twin bit cell structure and method of fabricating the same
07/30/2009US20090191680 Dual-gate memory device with channel crystallization for multiple levels per cell (mlc)
07/30/2009US20090191679 Local stress engineering for cmos devices
07/30/2009US20090191678 Method of Forming a Shielded Gate Field Effect Transistor
07/30/2009US20090191677 Memory array with surrounding gate access transistors and capacitors with global and staggered local bit lines
07/30/2009US20090191676 Flash memory having a high-permittivity tunnel dielectric
07/30/2009US20090191675 Method for Forming CMOS Transistors Having FUSI Gate Electrodes and Targeted Work Functions
07/30/2009US20090191674 AIGaN/GaN HIGH ELECTRON MOBILITY TRANSISTOR DEVICES
07/30/2009US20090191673 Method of manufacturing thin film transistor
07/30/2009US20090191672 Method for production of thin-film semiconductor device
07/30/2009US20090191671 Semiconductor substrate, semiconductor device, and manufacturing methods for them
07/30/2009US20090191670 Silicon thin film transistors, systems, and methods of making same
07/30/2009US20090191669 Method of encapsulating an electronic component
07/30/2009US20090191668 Method for manufacturing ic tag inlet
07/30/2009US20090191667 semiconductor device and a manufacturing method of the same
07/30/2009US20090191665 Electronic Device and Method of Manufacturing Same
07/30/2009US20090191664 Apparatus for Improved Power Distribution in Wirebond Semiconductor Packages
07/30/2009US20090191663 Method for producing a photovoltaic module
07/30/2009US20090191662 Image sensor applied with device isolation technique for reducing dark signals and fabrication method thereof
07/30/2009US20090191661 Placing a mems part on an application platform using a guide mask
07/30/2009US20090191660 Method for manufacturing a sensor device
07/30/2009US20090191659 Single-crystal nitride-based semiconductor substrate and method of manufacturing high-quality nitride-based light emitting device by using the same
07/30/2009US20090191658 Semiconductor light emitting device with lateral current injection in the light emitting region
07/30/2009US20090191657 All-silicon raman amplifiers and lasers based on micro ring resonators
07/30/2009US20090191656 Liquid crystal display device and method of manufacturing the same
07/30/2009US20090191655 Method of etching amorphous silicon layer and method of manufacturing liquid crystal display using the same
07/30/2009US20090191654 Method of manufacturing color filter substrate and method of manufacturing thin film transistor substrate
07/30/2009US20090191653 Transflective liquid crystal display device and method of fabricating the same
07/30/2009US20090191652 Pixel structure and method for manufacturing the same
07/30/2009US20090191651 Positioning apparatus, exposure apparatus, and method of manufacturing device
07/30/2009US20090191489 Pattern generator
07/30/2009US20090191473 Photomask manufacturing method, photomask manufacturing system, and device manufacturing method
07/30/2009US20090191332 Method for manufacturing magnetic recording medium and connecting device used in manufacturing magnetic recording medium
07/30/2009US20090191043 Wafer Carrying Apparatus
07/30/2009US20090191042 Semiconductor device manufacturing apparatus and wafer loading/unloading method thereof
07/30/2009US20090191030 Apparatus and methods for transporting and processing substrates
07/30/2009US20090191029 System for handling semiconductor dies
07/30/2009US20090190413 Self-repair integrated circuit and repair method
07/30/2009US20090190394 Capacitorless dram on bulk silicon
07/30/2009US20090190388 Resistive memory and methods for forming same
07/30/2009US20090190371 Monolithic illumination device
07/30/2009US20090190287 Solid electrolytic capacitor and manufacturing method thereof
07/30/2009US20090190118 Exposure apparatus inspection mask, and method of inspecting exposure apparatus using exposure apparatus inspection mask
07/30/2009US20090190115 Method for exposing a substrate and lithographic projection apparatus
07/30/2009US20090190114 Resist pattern forming method, semiconductor apparatus using said method, and exposure apparatus thereof
07/30/2009US20090190113 Projection exposure apparatus, projection exposure method, and method for producing device
07/30/2009US20090190056 Electro-optical device and method for driving the same
07/30/2009US20090190054 Display Substrate, Method Of Manufacturing The Same And Liquid Crystal Display Panel Having The Display Substrate
07/30/2009US20090189745 Semiconductor device, method of manufacturing thereof, signal transmission/reception method using such semiconductor device, and tester apparatus
07/30/2009US20090189682 Method and apparatus for mode selection for high voltage integrated circuits
07/30/2009US20090189299 Method of forming a probe pad layout/design, and related device
07/30/2009US20090189298 Bonding pad structure and debug method thereof
07/30/2009US20090189296 Flip chip quad flat non-leaded package structure and manufacturing method thereof and chip package structure
07/30/2009US20090189295 Stack chip package structure and manufacturing method thereof
07/30/2009US20090189294 Large area integration of quartz resonators with electronics
07/30/2009US20090189292 Integrated Circuit, Semiconductor Module and Method for Manufacturing a Semiconductor Module
07/30/2009US20090189291 Multi-chip module
07/30/2009US20090189290 Clustered stacked vias for reliable electronic substrates
07/30/2009US20090189288 Angled flying lead wire bonding process
07/30/2009US20090189287 Noble metal cap for interconnect structures
07/30/2009US20090189286 Fine pitch solder bump structure with built-in stress buffer
07/30/2009US20090189283 Aluminum metal line of a semiconductor device and method of fabricating the same
07/30/2009US20090189280 Method of Forming a Non Volatile Memory Device
07/30/2009US20090189279 Methods and systems for packaging integrated circuits
07/30/2009US20090189273 Multiphase synchronous buck converter
07/30/2009US20090189272 Wafer Level Chip Scale Packages Including Redistribution Substrates and Methods of Fabricating the Same
07/30/2009US20090189270 Manufacturing process and structure for embedded semiconductor device
07/30/2009US20090189266 Semiconductor package with stacked dice for a buck converter
07/30/2009US20090189265 Method and apparatus for making semiconductor devices including a foil
07/30/2009US20090189264 Semiconductor device and manufacturing method of the same
07/30/2009US20090189262 Multiphase synchronous buck converter
07/30/2009US20090189261 Ultra-Thin Semiconductor Package
07/30/2009US20090189260 Semiconductor device
07/30/2009US20090189259 Electronic device and method of manufacturing
07/30/2009US20090189258 Method of integrated circuit fabrication
07/30/2009US20090189257 Mesa type semiconductor device and manufacturing method thereof
07/30/2009US20090189256 Manufacturing process of semiconductor device and semiconductor device
07/30/2009US20090189255 Wafer having heat dissipation structure and method of fabricating the same
07/30/2009US20090189254 Circuit connection structure, method for producing the same and semiconductor substrate for circuit connection structure
07/30/2009US20090189253 Method of producing a nitride semiconductor device and nitride semiconductor device
07/30/2009US20090189252 III-V MOSFET Fabrication and Device
07/30/2009US20090189249 Semiconductor device and manufacturing method thereof
07/30/2009US20090189246 Method of forming trench isolation structures and semiconductor device produced thereby
07/30/2009US20090189243 Semiconductor device with trench isolation structure and method for fabricating the same
07/30/2009US20090189242 Method for non-selective shallow trench isolation reactive ion etch for patterning hybrid-oriented devices compatible with high-performance highly-integrated logic devices
07/30/2009US20090189240 Semiconductor device with at least one field plate