Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
07/2009
07/30/2009US20090189238 Packaged microelectronic imagers and methods of packaging microelectronic imagers
07/30/2009US20090189236 Solid-state imaging device and method for manufacturing the same
07/30/2009US20090189230 Method and system for packaging mems devices with incorporated getter
07/30/2009US20090189229 Semiconductor devices and methods of fabricating the same
07/30/2009US20090189228 Semiconductor transistor with p type re-grown channel layer
07/30/2009US20090189227 Structures of sram bit cells
07/30/2009US20090189225 Semiconductor device and its fabrication method
07/30/2009US20090189224 Semiconductor device and fabrication process thereof
07/30/2009US20090189223 Complementary Metal Gate Dense Interconnect and Method of Manufacturing
07/30/2009US20090189219 Semiconductor device and manufacturing method of the same
07/30/2009US20090189218 Structure and Method for Forming Power Devices with High Aspect Ratio Contact Openings
07/30/2009US20090189216 Semiconductor component including a drift zone and a drift control zone
07/30/2009US20090189215 Nonvolatile flash memory device and method for producing the same
07/30/2009US20090189214 Semiconductor device and fabrication method for the same
07/30/2009US20090189213 Nonvolatile semiconductor memory device and method of fabricating the same
07/30/2009US20090189212 Electronic device having a doped region with a group 13 atom
07/30/2009US20090189211 Non-Volatile Memory Arrays Having Dual Control Gate Cell Structures And A Thick Control Gate Dielectric And Methods Of Forming
07/30/2009US20090189209 Semiconductor memory device
07/30/2009US20090189205 Semiconductor device and method for manufacturing the same
07/30/2009US20090189204 Silicon thin film transistors, systems, and methods of making same
07/30/2009US20090189203 Semiconductor device and method of manufacturing the same
07/30/2009US20090189202 Electronic device including a gate electrode having portions with different conductivity types and a process of forming the same
07/30/2009US20090189201 Inward dielectric spacers for replacement gate integration scheme
07/30/2009US20090189200 Semiconductor device and fabrication method of the semiconductor device
07/30/2009US20090189199 Semiconductor device and manufacturing method thereof
07/30/2009US20090189198 Structures of sram bit cells
07/30/2009US20090189196 Programmable nanotube interconnect
07/30/2009US20090189195 Radio Frequency (RF) Circuit Placement in Semiconductor Devices
07/30/2009US20090189194 Electrostatic Discharge (ESD) Protection Circuit Placement in Semiconductor Devices
07/30/2009US20090189192 DEPOSITION OF GROUP III-NITRIDES ON Ge
07/30/2009US20090189190 High Electron Mobility Transistor, Field-Effect Transistor, Epitaxial Substrate, Method of Manufacturing Epitaxial Substrate, and Method of Manufacturing Group III Nitride Transistor
07/30/2009US20090189189 Semiconductor device and manufacturing method thereof
07/30/2009US20090189188 Semiconductor device and fabrication method of the semiconductor device
07/30/2009US20090189187 Active area shaping for Ill-nitride device and process for its manufacture
07/30/2009US20090189185 Epitaxial growth of relaxed silicon germanium layers
07/30/2009US20090189182 Integrated RF ESD Protection for High Frequency Circuits
07/30/2009US20090189179 Method for manufacturing light emitting diode package
07/30/2009US20090189178 Leadframe having a heat sink supporting part, fabricating method of a light emitting diode package using the same, and light emitting diode package fabricated by the method
07/30/2009US20090189177 Light emitting diode package and manufacturing method thereof
07/30/2009US20090189173 Semiconductor device and method of manufacturing thereof
07/30/2009US20090189164 Uniform large-grained and grain boundary location manipulated polycrystalline thin film semiconductors formed using sequential lateral solidification and devices formed thereon
07/30/2009US20090189160 Thin film transistor, method of fabricating the same, and organic light emitting diode display device having the tft
07/30/2009US20090189159 Gettering layer on substrate
07/30/2009US20090189156 Semiconductor device and manufacturing method thereof
07/30/2009US20090189155 Semiconductor device and manufacturing method thereof
07/30/2009US20090189151 Method for separating a non-emission region from a light emission region within an organic light emitting diode (oled)
07/30/2009US20090189148 Transistor element, display device and these manufacturing methods
07/30/2009US20090189147 Organic transistor comprising a self-aligning gate electrode, and method for the production thereof
07/30/2009US20090189145 Photodetectors, Photovoltaic Devices And Methods Of Making The Same
07/30/2009US20090189144 Device For Absorbing Or Emitting Light And Methods Of Making The Same
07/30/2009US20090189138 Fill-in etching free pore device
07/30/2009US20090189136 Semiconductor device and a manufacturing method of the semiconductor device
07/30/2009US20090189075 Inspection method and inspection system using charged particle beam
07/30/2009US20090188874 Wafer boat
07/30/2009US20090188627 Gas modulation to control edge exclusion in a bevel edge etching plasma chamber
07/30/2009US20090188625 Etching chamber having flow equalizer and lower liner
07/30/2009US20090188624 Method and apparatus for enhancing flow uniformity in a process chamber
07/30/2009US20090188534 Apparatus And Method For Cleaning Glass Substrates Using A Cool Hydrogen Flame
07/30/2009US20090188526 Process of cleaning a semiconductor manufacturing system and method of manufacturing a semiconductor device
07/30/2009US20090188431 Substrate processing apparatus and method for manufacturing a semiconductor device
07/30/2009US20090188103 Methods and apparatus for moving a substrate carrier
07/30/2009DE19860704B4 Verfahren zur Überprüfung zumindest eines Teils eines Halbleiterwafers mit einem Rasterelektronenmikroskop Method for checking at least a portion of a semiconductor wafer with a scanning electron microscope
07/30/2009DE19743737B4 Verfahren zur Bildung einer Drahtbondelektrode auf einer Dickschichtleiterplatte A method for forming a wire bonding electrode on a thick layer printed circuit board
07/30/2009DE112007002404T5 Verfahren zum Festhalten eines Siliciumwafers, Einspannvorrichtung zur Wärmebehandlung und wärmebehandelter Wafer Method for holding a silicon wafer chuck for heat treatment and heat-treated wafers
07/30/2009DE112007002340T5 Bearbeitungssystem, Bearbeitungsverfahren und Aufzeichnungsmedium Processing system, processing method and recording medium
07/30/2009DE112007002309T5 Substratähnlicher Teilchensensor Similar substrate particle
07/30/2009DE112007002306T5 Verspannter Feldeffekttransistor und Verfahren zu dessen Herstellung Strained field effect transistor and method of producing the
07/30/2009DE112007002215T5 Dielektrische Abstandshalter für Metallverbindungen und Verfahren zu ihrer Herstellung Dielectric spacers for metal compounds and processes for their preparation
07/30/2009DE112007001951T5 Vorrichtung und Verfahren zur Herstellung eines rauscharmen Sperrschicht-Feldeffekttransistors Apparatus and method for producing a low noise junction field effect transistor
07/30/2009DE112007001521T5 Organometallische Verbindungen Organometallic compounds
07/30/2009DE10392870B4 Semiconductor production comprises forming gate insulating film on semiconductor region, forming gate electrode on insulating film and forming electrode in semiconductor region
07/30/2009DE10345377B4 Halbleitermodul und Verfahren zur Herstellung eines Halbleitermoduls Semiconductor module and method for manufacturing a semiconductor module
07/30/2009DE10327515B4 Verfahren zum Herstellen eines substratbasierten IC-Packages A method for producing a substrate-based IC packages
07/30/2009DE102009006580A1 Verfahren zur Herstellung integrierter Schaltungen A process for the manufacture of integrated circuits
07/30/2009DE102009006152A1 Elektronikbauelement und Verfahren zur Herstellung des Elektronikbauelements An electronics device and method for manufacturing the electronic component
07/30/2009DE102009004392A1 Datenerzeugungsverfahren für Halbleitervorrichtung und Elektronenstrahlbelichtungssystem Data forming method for the semiconductor device and electron beam exposure system
07/30/2009DE102008063741A1 Bildsensor und Verfahren zu dessen Herstellung Image sensor and method for its production
07/30/2009DE102008061165A1 Verfahren und Vorrichtung zum Herstellen von Halbleiterbauelementen mit einer Folie Method and apparatus for producing semiconductor devices with a foil
07/30/2009DE102008059885A1 Integrierte Schaltung mit im Wesentlichen durch das Substrat verlaufenden Isolationsbereichen An integrated circuit comprising substantially extending through the substrate isolation regions
07/30/2009DE102008053645A1 Verfahren zum Herstellen von mehreren Halbleiter-Bauelementen A method of producing a plurality of semiconductor devices
07/30/2009DE102008028299B3 System support for e.g. micro-electro-mechanical system component, has flexible support with upper side, and conductor paths guided to connecting contacts on upper side of components, which is turned away from flexible support
07/30/2009DE102008006927A1 Correction device for correcting geometric error of position sensor unit of positioning system of e.g. measuring system, has unit, where device emits modified measuring signal with information and correction value is determined for unit
07/30/2009DE102008005518A1 Integrated circuit for use with floating body transistor, has two source or drain regions and floating body region, arranged between two source or drain regions, and back gate electrode is provided
07/30/2009DE102008004927A1 Integrierte Schaltung mit Leiterbahnen und Kontaktstrukturen sowie Verfahren zur Herstellung einer derartigen integrierten Schaltung An integrated circuit including conductor tracks and contact structures and methods for producing such an integrated circuit
07/30/2009DE102007004867B4 Verfahren zum Erhöhen der Zuverlässigkeit von kupferbasierten Metallisierungsstrukturen in einem Mikrostrukturbauelement durch Anwenden von Aluminiumnitrid A method for increasing the reliability of copper-based metallization in a microstructure device by applying aluminum nitride
07/30/2009DE102005028837B4 Feldeffekttransistor und Verfahren zur Herstellung eines Feldeffekttransistors Field effect transistor and method of manufacturing a field effect transistor
07/30/2009DE102005019574B4 Kontaktierungsanordnung für ein Halbleiterbauelement Contacting arrangement for a semiconductor component
07/30/2009DE102005014722B4 Verfahren zur Herstellung einer Halbleitervorrichtung A process for producing a semiconductor device
07/30/2009DE102005002410B4 Antireflektives Beschichtungspolymer, dessen Präparationsverfahren und obere antireflektierende Beschichtungszusammensetzung mit demselben Anti-reflective coating polymer whose preparation methods, and top anti-reflective coating composition having the same
07/30/2009DE102004063264B4 Verfahren zum Ausbilden elektrischer Verbindungen in einer Halbleiterstruktur A method of forming electrical interconnections in a semiconductor structure
07/30/2009DE102004063149B4 Verfahren zur Herstellung eines Halbleiter-Bauelements A process for producing a semiconductor device
07/30/2009DE102004041410B4 Verfahren zum Anfertigen einer Analyseprobe, Verfahren zum Analysieren von Substanzen auf der Oberfläche von Halbleitersubstraten und Gerät zum Anfertigen einer Analyseprobe A method for preparing a sample for analysis, method for analyzing substances on the surface of semiconductor substrates and device for preparing a sample for analysis
07/30/2009DE102004040465B4 Gehäuseanordnung für elektronische Bauelemente und Verfahren zum Verpacken elektronischer Bauelemente Housing assembly for electronic devices and methods for packaging electronic components
07/30/2009DE102004033357B4 Schaltung und Verfahren zur Temperatursensierung Circuit and method for Temperatursensierung
07/30/2009DE10121188B4 Verfahren zum Entfernen eines restliches Metall enthaltenden Polymermaterials und von ionenimplantiertem Photoresistmaterial in einem stromabwärtigen atmosphärischen Plasmabearbeitungssystem A method of removing a residual metal-containing polymeric material and of ion implanted photoresist material in a downstream atmospheric plasma processing system
07/30/2009CA2709718A1 Large area nanopatterning method and apparatus
07/29/2009EP2083458A1 Organic mesomeric compounds as dotands
07/29/2009EP2083448A1 Silicon carbide semiconductor device and process for producing the same
07/29/2009EP2083441A1 Semiconductor device and method for fabricating the same
07/29/2009EP2083440A2 Thin film transistor and method of fabricating a thin film transistor