Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
08/2009
08/19/2009CN100530638C Organic light emitting device and manufacturing method thereof
08/19/2009CN100530637C Stacked structures and methods of forming stacked structures
08/19/2009CN100530636C Three-dimensional multiple chips packaging module and preparation method
08/19/2009CN100530635C Stacking method and stacked structure for attaching memory components to associated device
08/19/2009CN100530634C Method and structure for wafer-to-wafer alignments
08/19/2009CN100530633C Methods for fabrication of fuse structure
08/19/2009CN100530630C Semiconductor device
08/19/2009CN100530626C Tape carrier for TAB and method of manufacturing the same
08/19/2009CN100530622C Semiconductor chip or device of vertical structure, and manufacturing method
08/19/2009CN100530619C Signal transmission structure
08/19/2009CN100530618C Processing device on which processing elements having same function are embedded in one chip
08/19/2009CN100530613C 半导体器件及其制造方法 Semiconductor device and manufacturing method thereof
08/19/2009CN100530612C Semiconductor device and manufacturing method thereof
08/19/2009CN100530611C Wireless chip and manufacturing method of the same
08/19/2009CN100530609C Semiconductor device and manufacturing method of the same
08/19/2009CN100530608C Direct build-up layer on encapsulated die package having moisture barrier structure
08/19/2009CN100530607C Method of producing ZnO based transparent film transistor array
08/19/2009CN100530606C Thin-film transistor array substrates and manufacturing method therefor
08/19/2009CN100530605C Picture element structure and its manufacturing method
08/19/2009CN100530604C Method of manufacturing semiconductor
08/19/2009CN100530603C Method of fabricating flash memory device
08/19/2009CN100530602C Production method of non-volatile storage device selection grid
08/19/2009CN100530601C Method for forming storage component, semiconductor component and forming method thereof
08/19/2009CN100530600C Method of simultaneous formation of charge storage and bitline to wordline isolation layer
08/19/2009CN100530599C Metal-insulator-metal capacitor manufactured using etchback
08/19/2009CN100530598C Semiconductor structure forming method
08/19/2009CN100530597C Process for forming silicide with two thickness in source drain zone
08/19/2009CN100530596C Semiconductor device with micro-lens and method of making the same
08/19/2009CN100530595C Memory device including resistance change layer as storage node and method(s) for making the same
08/19/2009CN100530594C Switch methodology for mask-programmable logic devices
08/19/2009CN100530593C Method for cutting crystal wafer
08/19/2009CN100530592C Method for fabricating storage node contact in semiconductor device
08/19/2009CN100530591C Method of forming an interconnect structure
08/19/2009CN100530590C Memory structure manufacturing method
08/19/2009CN100530589C High performance strained cmos devices
08/19/2009CN100530588C Method for improving microscope natural deviation in crystal circle aligning
08/19/2009CN100530587C Control method for detector and control program
08/19/2009CN100530586C Chip plainness assessment method, apparatus therefor and application thereof
08/19/2009CN100530585C Method for mounting a semiconductor chip onto a substrate
08/19/2009CN100530584C Method for step-down transition of a solder head in the injection molding soldering process
08/19/2009CN100530583C Wiring machine platform and wiring method
08/19/2009CN100530582C Semiconductor device and method for making the same
08/19/2009CN100530581C Method for manufacturing semiconductor module using interconnection structure
08/19/2009CN100530580C Repairing method for bad paster in mobile phone camera mould set
08/19/2009CN100530579C Method for manufacture of transparent devices having light emitting diodes (LED)
08/19/2009CN100530578C Production of long-lead, low-arc and high-density golden-wire ball welding
08/19/2009CN100530577C Semiconductor device and manufacturing method therefor
08/19/2009CN100530576C Semiconductor device and its manufacturing method
08/19/2009CN100530575C Laminating system, IC sheet, scroll of IC sheet, and method for manufacturing IC chip
08/19/2009CN100530574C Semiconductor module and its manufacturing method
08/19/2009CN100530573C Photoelectric sensor and detector terminal module therefor
08/19/2009CN100530572C Method of chip grade packaging
08/19/2009CN100530571C Methods for fabricating interconnect structures having low K dielectric properties
08/19/2009CN100530570C Indicator element and manufacturing method therefor
08/19/2009CN100530569C Semiconductor device and a method for manufacturing the same
08/19/2009CN100530568C Surface geometry for a MOS-gated device
08/19/2009CN100530567C Method for making semiconductor side wall fin
08/19/2009CN100530566C Dual doped polysilicon and silicon germanium etch
08/19/2009CN100530565C Semiconductor device and method for manufacturing same
08/19/2009CN100530564C Ultraviolet assisted pore sealing of porous low k dielectric films
08/19/2009CN100530563C Process capable of improving film uniformity before chemical mechanical grinding
08/19/2009CN100530562C Atomic layer deposited dielectric layers
08/19/2009CN100530561C Transparent amorphous carbon structure in semiconductor devices
08/19/2009CN100530560C Process for producing low-K dielectric films
08/19/2009CN100530559C Method for forming semiconductor structure
08/19/2009CN100530558C Etching method capable of enhancing homogeneity of grid flutes on a same wafer
08/19/2009CN100530557C Etching method of single wafer
08/19/2009CN100530556C Nitride-based compound semiconductor, method of cleaning a compound semiconductor, method of producing the same, and substrate
08/19/2009CN100530555C Wafer thinning method
08/19/2009CN100530554C HDP-CVD multistep gapfill process
08/19/2009CN100530553C Method of manufacturing wiring substrate
08/19/2009CN100530552C Functional device and method for forming oxide material
08/19/2009CN100530551C Thin-film transistor production method and its grid preparation method
08/19/2009CN100530550C Electrode and forming method thereof
08/19/2009CN100530549C Laser lighting device, lighting method and method for manufacturing semiconductor device
08/19/2009CN100530548C Systems and methods for implant dosage control, and wafer implantation method by using ion beam
08/19/2009CN100530547C Method for forming pattern, thin film transistor, display device, method for manufacturing thereof, and television apparatus
08/19/2009CN100530546C Self-cleaning catalyst chemical vapor deposition device and cleaning method therefor
08/19/2009CN100530545C Method for forming organic light-emitting layer
08/19/2009CN100530544C Method for preparing high power element in wide band gap material
08/19/2009CN100530543C 外延生长方法 Epitaxial growth
08/19/2009CN100530542C Method of manufacturing a semiconductor device
08/19/2009CN100530541C Stabilized photoresist structure for etching process
08/19/2009CN100530540C Exposure apparatus, exposure method, and device production method
08/19/2009CN100530539C Exposure apparatus control method, exposure method and apparatus using the control method, and device manufacturing method
08/19/2009CN100530538C Post plasma clean process for a hardmask
08/19/2009CN100530537C Semiconductor treating device
08/19/2009CN100530536C System for decharging a wafer, electrostatic adsorbing device and integrated circuit manufacture method
08/19/2009CN100530535C Substrate treatment method and substrate treatment apparatus
08/19/2009CN100530534C Apparatus and method for treating substrate, and injection head used in the apparatus
08/19/2009CN100530533C Method and apparatus for cleaning substrates
08/19/2009CN100530532C Plasma processing apparatus and plasma processing method
08/19/2009CN100530531C A method of fabricating a composite substrate
08/19/2009CN100530530C Plasma processing apparatus and plasma processing method
08/19/2009CN100530529C Double offset frequency plasma body reactor with electrostatic chuck voltage feedback control
08/19/2009CN100530528C Method for RTA constant temperature measurement and its used measurement and control wafer
08/19/2009CN100530527C Stickup method of support plate
08/19/2009CN100530526C Rectangular substrate dividing apparatus
08/19/2009CN100530525C Base plate processing device
08/19/2009CN100530524C Laser irradiation method and method for manufacturing semiconductor device using the same
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