Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
08/2009
08/13/2009US20090203184 Self-Aligned Epitaxially Grown Bipolar Transistor
08/13/2009US20090203183 Method for integrating SIGE NPN and Vertical PNP Devices
08/13/2009US20090203182 Method of manufacturing transistor having metal silicide and method of manufacturing a semiconductor device using the same
08/13/2009US20090203181 Semiconductor device manufacturing method, wiring and semiconductor device
08/13/2009US20090203180 Mos transistor having protruded-shape channel and method of fabricating the same
08/13/2009US20090203179 Semiconductor device and manufacturing method thereof
08/13/2009US20090203178 Memory device and method of manufacturing the same
08/13/2009US20090203177 Thin-film semiconductor device and method for manufacturing the same
08/13/2009US20090203176 Manufacturing method of semiconductor device
08/13/2009US20090203175 Method of manufacturing a semiconductor device
08/13/2009US20090203174 Method for manufacturing semiconductor device
08/13/2009US20090203173 Mold cleaning sheet and manufacturing method of a semiconductor device using the same
08/13/2009US20090203172 Enhanced Die-Up Ball Grid Array and Method for Making the Same
08/13/2009US20090203171 Semiconductor device fabricating method
08/13/2009US20090203170 Flip chip mounting method, flip chip mounting apparatus and flip chip mounting body
08/13/2009US20090203169 Flip chip mounting body and method for mounting such flip chip mounting body and bump forming method
08/13/2009US20090203168 Manufacturing Method for a Secure-Digital (SD) Flash Card with Slanted Asymmetric Circuit Board
08/13/2009US20090203167 Method for Manufacturing Bonded Substrate
08/13/2009US20090203166 Zinc Oxide Materials and Methods for Their Preparation
08/13/2009US20090203163 Method for making a transducer
08/13/2009US20090203162 Optical element, method for manufacturing optical element and semiconductor laser device using the optical element
08/13/2009US20090203161 Semiconductor laser diode with a ridge structure buried by a current blocking layer made of un-doped semiconductor grown at a low temperature and method for producing the same
08/13/2009US20090203160 System for displaying images including thin film transistor device and method for fabricating the same
08/13/2009US20090203158 Method for fabricating a photonic crystal or photonic bandgap vertical-cavity surface-emitting laser
08/13/2009US20090203157 Display apparatus
08/13/2009US20090203156 Methods for accurately measuring the thickness of an epitaxial layer on a silicon wafer
08/13/2009US20090202926 Exposure mask and pattern forming method therefor
08/13/2009US20090202925 Photomask defect correction method, photomask manufacturing method, phase shift mask manufacturing method, photomask, phase shift mask, photomask set, and pattern transfer method
08/13/2009US20090202924 Method of evaluating a photo mask and method of manufacturing a semiconductor device
08/13/2009US20090202923 Photomask manufacturing method, photomask manufacturing apparatus and photomask
08/13/2009US20090202783 Treatment of Items
08/13/2009US20090202738 Process for making capacitors by direct heating of electrodes
08/13/2009US20090202336 Methods and apparatus for an efficient handshake between material handling and material processing devices for safe material transfer
08/13/2009US20090202333 Electronic component pickup method, electronic component mounting method and electronic component mounting apparatus
08/13/2009US20090202324 Wafer transfer device and wafer transfer method
08/13/2009US20090202323 Alignment device and method to align plates for electronic circuits
08/13/2009US20090202136 Polarization analyzing system, exposure method, and method for manufacturing semiconductor device
08/13/2009US20090202089 Microphone with Reduced Parasitic Capacitance
08/13/2009US20090201958 Lateral optically pumped surface-emitting semiconductor laser on a heat sink
08/13/2009US20090201743 Multiwalled carbon nanotube memory device
08/13/2009US20090201720 Multibit magnetic random access memory device
08/13/2009US20090201719 Method and System for Semiconductor Memory
08/13/2009US20090201716 Memory Element with Positive Temperature Coefficient Layer
08/13/2009US20090201715 Carbon Diode Array for Resistivity Changing Memories
08/13/2009US20090201662 Light emitting device and method of manufacturing the same
08/13/2009US20090201656 Semiconductor package, and method of manufacturing semiconductor package
08/13/2009US20090201643 Integrated micro-channels for 3d through silicon architectures
08/13/2009US20090201626 Gap capacitors for monitoring stress in solder balls in flip chip technology
08/13/2009US20090201622 Detachable electrostatic chuck for supporting a substrate in a process chamber
08/13/2009US20090201505 Tunable Alignment Geometry
08/13/2009US20090201476 Lithographic projection apparatus and device manufacturing method
08/13/2009US20090201454 Liquid crystal display device and fabrication method thereof
08/13/2009US20090201343 Liquid ejection head and manufacturing method of liquid ejection head
08/13/2009US20090201325 Method For The Printing Of Homogeneous Electronic Material With A Multi-Ejector Print Head
08/13/2009US20090201269 Semiconductor device
08/13/2009US20090201228 Photo sensor and flat panel display device using thereof
08/13/2009US20090201043 Crack Sensors for Semiconductor Devices
08/13/2009US20090200933 Triarylamine compounds, compositions and uses therefor
08/13/2009US20090200912 Methods for Growing Carbon Nanotubes on Single Crystal Substrates
08/13/2009US20090200704 Compression molding method for electronic component and compression molding apparatus employed therefor
08/13/2009US20090200685 Electronic packaging method and apparatus
08/13/2009US20090200684 Flip chip package with shelf and method of manufactguring there of
08/13/2009US20090200683 Interconnect structures with partially self aligned vias and methods to produce same
08/13/2009US20090200682 Via in via circuit board structure
08/13/2009US20090200679 Semiconductor apparatus and method for manufacturing the same
08/13/2009US20090200678 Device comprising multi-layered thin film having excellent adhesive strength and method for fabricating the same
08/13/2009US20090200675 Passivated Copper Chip Pads
08/13/2009US20090200674 Structure and method of forming transitional contacts between wide and thin beol wirings
08/13/2009US20090200672 Method for manufacturing semiconductor device
08/13/2009US20090200670 Semiconductor device and method for manufacturing the same
08/13/2009US20090200668 Interconnect structure with high leakage resistance
08/13/2009US20090200666 Semiconductor integrated circuit device
08/13/2009US20090200665 Semiconductor device and method of manufacturing the same
08/13/2009US20090200664 Manufacturing method of semiconductor apparatus and semiconductor apparatus
08/13/2009US20090200663 Polymer and solder pillars for connecting chip and carrier
08/13/2009US20090200662 Semiconductor package and method of making the same
08/13/2009US20090200660 Heatplates for heatsink attachment for semiconductor chips
08/13/2009US20090200659 Chip Package with Channel Stiffener Frame
08/13/2009US20090200657 3d smart power module
08/13/2009US20090200656 Semiconductor device and manufacturing method thereof
08/13/2009US20090200652 Method for stacking chips in a multi-chip package
08/13/2009US20090200650 Integrated circuit package and a method of making
08/13/2009US20090200649 Semiconductor device and manufacturing method of the same
08/13/2009US20090200648 Embedded die system and method
08/13/2009US20090200647 Shielded integrated circuit pad structure
08/13/2009US20090200646 One-Dimensional Arrays of Block Copolymer Cylinders and Applications Thereof
08/13/2009US20090200644 Semiconductor device and method for manufacturing semiconductor device
08/13/2009US20090200643 Semiconductor and method for producing the same
08/13/2009US20090200641 Semiconductor device and method of manufacturing the same
08/13/2009US20090200640 Variable resistive element, and its manufacturing method
08/13/2009US20090200638 Mim capacitor integration
08/13/2009US20090200637 Methods and devices for a high-k stacked capacitor
08/13/2009US20090200636 Sub-lithographic dimensioned air gap formation and related structure
08/13/2009US20090200635 Integrated Circuit Having Electrical Isolation Regions, Mask Technology and Method of Manufacturing Same
08/13/2009US20090200634 Multi-angle rotation for ion implantation of trenches in superjunction devices
08/13/2009US20090200633 Semiconductor structures with dual isolation structures, methods for forming same and systems including same
08/13/2009US20090200630 Solid-state image pickup device and method for manufacturing the same
08/13/2009US20090200629 Semiconductor device and manufacturing method therefor
08/13/2009US20090200628 Reduced imager crosstalk and pixel noise using extended buried contacts
08/13/2009US20090200625 Backside illuminated image sensor having deep light reflective trenches
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