Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
08/2009
08/13/2009WO2009099232A1 Semiconductor manufacturing method
08/13/2009WO2009099227A1 Laminated structure, method of manufacturing a laminated structure, electronic element, electronic element array, image displaying medium, and image displaying device
08/13/2009WO2009099191A1 Film for semiconductor, method for manufacturing semiconductor device and semiconductor device
08/13/2009WO2009099190A1 Washing apparatus, washing method, and ozone water producing device used in the apparatus and method
08/13/2009WO2009099186A1 Plasma processing apparatus and plasma processing method
08/13/2009WO2009099145A1 Semiconductor chip and packaging method of semiconductor chip
08/13/2009WO2009099142A1 Surface inspecting apparatus and surface inspecting method
08/13/2009WO2009099138A1 Method for cleaning semiconductor wafer and device for cleaning semiconductor wafer
08/13/2009WO2009099122A1 Semiconductor inspecting device, and semiconductor inspecting method
08/13/2009WO2009099107A1 Robot hand for substrate transportation
08/13/2009WO2009099083A1 Acrylamide polymers, acrylamide compounds, chemically amplified photosensitive resin compositions and pattern formation method
08/13/2009WO2009099042A1 Method of transferring adhesive film
08/13/2009WO2009099021A1 Stage apparatus, exposure apparatus, exposure method, and device fabrication method
08/13/2009WO2009099012A1 Semiconductor device and method for manufacturing the same
08/13/2009WO2009098996A1 Thin film device, fabrication method for same, and electronic component
08/13/2009WO2009098979A1 Iii nitride semiconductor epitaxial substrate and method for manufacturing the same
08/13/2009WO2009098969A1 Liquid processing device and liquid processing method
08/13/2009WO2009098951A1 Aqueous dispersion for chemical mechanical polishing, kit for preparing the dispersion, method for preparing aqueous dispersion for chemical mechanical polishing using the kit, and chemical mechanical polishing method for semiconductor device
08/13/2009WO2009098924A1 Aqueous dispersion for chemical mechanical polishing and chemical mechanical polishing method
08/13/2009WO2009098917A1 Polishing pad manufacturing method
08/13/2009WO2009098891A1 Position measuring system and position measuring method, mobile body device, mobile body driving method, exposure device and exposure method, pattern forming device, and device manufacturing method
08/13/2009WO2009098831A1 Method for manufacturing electronic component device
08/13/2009WO2009098815A1 Liquid material carburetor, and filming device using the carburetor
08/13/2009WO2009098796A1 Magnetic memory element, method for driving same, and nonvolatile storage
08/13/2009WO2009098778A1 Semiconductor manufactiring method
08/13/2009WO2009098746A1 Semiconductor device and method for manufacturing the same
08/13/2009WO2009098745A1 Semiconductor device and method for manufacturing the same
08/13/2009WO2009098738A1 Semiconductor device and method for resetting the same
08/13/2009WO2009098650A1 Automatic handling buffer for bare stocker
08/13/2009WO2009098636A1 Light emitting sheet
08/13/2009WO2009098554A1 Process vacuum for semiconductor manufacturing wet chemical processes
08/13/2009WO2009098548A1 Intermediate product for a multichannel fet and process for obtaining an intermediate product
08/13/2009WO2009098398A1 Method of growing, on a dielectric material, nanowires made of semiconductor materials connecting two electrodes
08/13/2009WO2009098151A1 Interconnect structure and method for cu/ultra low k integration
08/13/2009WO2009098120A1 Interconnect structure with high leakage resistance
08/13/2009WO2009098042A1 Device for cleaning flat substrates
08/13/2009WO2009097937A1 Process for polishing a silicon surface by means of a cerium oxide-containing dispersion
08/13/2009WO2009097737A1 A chemical mechanical polishing liquid
08/13/2009WO2009097722A1 Semiconductor epitaxial thin film package with vertical structure and the fabricating method thereof
08/13/2009WO2009097643A1 Fabrication of atomic scale devices
08/13/2009WO2009079114A3 Thermal mechanical flip chip die bonding
08/13/2009WO2009076076A3 Insulated gate e-mode transistors
08/13/2009WO2009071159A3 Thermode device
08/13/2009WO2009067140A3 Fin-jfet
08/13/2009WO2009034461A3 Semiconductor device and wire bonding method
08/13/2009WO2009033837A3 Method of fabricating ultra-deep vias and three-dimensional integrated circuits using ultra-deep vias
08/13/2009WO2009016134A9 Production of isolation trenches with different sidewall dopings
08/13/2009WO2009011956A3 Hybrid magnetoelectronic transistor
08/13/2009US20090204342 Methods and apparatus for wafer area pressure control in an adjustable gap plasma chamber
08/13/2009US20090204252 Substrate processing method and apparatus, method for manufacturing semiconductor device and storage medium
08/13/2009US20090203839 Carbosilane polymer compositions for anti-reflective coatings
08/13/2009US20090203300 Carrier for holding an object to be polished
08/13/2009US20090203297 Semiconductor Wafer, Apparatus and Process For Producing The Semiconductor Wafer
08/13/2009US20090203231 Crystallization apparatus, crystallization method, phase modulation element, device and display apparatus
08/13/2009US20090203230 Mask for crystallizing a semiconductor layer and method of crystallizing a semiconductor layer using the same
08/13/2009US20090203229 Substrate Processing Apparatus and Semiconductor Device Manufacturing Method
08/13/2009US20090203228 Plasma cvd method, method for forming silicon nitride film, method for manufacturing semiconductor device and plasma cvd method
08/13/2009US20090203227 Film Formation method and apparatus for forming silicon-containing insulating film
08/13/2009US20090203226 Neutral beam-assisted atomic layer chemical vapor deposition apparatus and method of processing substrate using the same
08/13/2009US20090203225 SiCOH FILM PREPARATION USING PRECURSORS WITH BUILT-IN POROGEN FUNCTIONALITY
08/13/2009US20090203224 Si Device Making Method By Using A Novel Material For Packing and Unpacking Process
08/13/2009US20090203223 Substrate mounting table for plasma processing apparatus, plasma processing apparatus and insulating film forming method
08/13/2009US20090203222 Method of forming dielectric films, new precursors and their use in semiconductor manufacturing
08/13/2009US20090203221 Apparatus and method for incorporating composition into substrate using neutral beams
08/13/2009US20090203220 Method for Reducing an Unevenness of a Surface and Method for Making a Semiconductor Device
08/13/2009US20090203219 Plasma etching method, plasma etching apparatus and computer-readable storage medium
08/13/2009US20090203218 Plasma etching method and computer-readable storage medium
08/13/2009US20090203217 Novel self-aligned etch method for patterning small critical dimensions
08/13/2009US20090203216 Photolithographic systems and methods for producing sub-diffraction-limited features
08/13/2009US20090203215 Metal polishing slurry and chemical mechanical polishing method
08/13/2009US20090203214 Semiconductor device, and semiconductor device obtained by such a method
08/13/2009US20090203213 Slurry composition for chemical-mechanical polishing and method of chemical-mechanical polishing with the same
08/13/2009US20090203212 Surface Grinding Method and Manufacturing Method for Semiconductor Wafer
08/13/2009US20090203211 Multi-chamber system having compact installation set-up for an etching facility for semiconductor device manufacturing
08/13/2009US20090203210 Manufacturing method of semiconductor device
08/13/2009US20090203209 Semiconductor device and method of manufacturing the same
08/13/2009US20090203208 Copper alloy for wiring, semiconductor device, method for forming wiring, and method for manufacturing semiconductor device
08/13/2009US20090203207 Method for manufacturing semiconductor device
08/13/2009US20090203206 Fabrication of semiconductor devices using anti-reflective coatings
08/13/2009US20090203205 Method for producing a floating gate with an alternation of lines of first and second materials
08/13/2009US20090203204 Methods of manufacturing semiconductor device having recess channel array transistor
08/13/2009US20090203203 Method for the fabrication of a transistor gate that includes the breakdown of a precursor material into at least one metallic material, using at least one
08/13/2009US20090203202 Strained Gate Electrodes in Semiconductor Devices
08/13/2009US20090203201 Method for fabricating a semiconductor device
08/13/2009US20090203200 Gate patterning scheme with self aligned independent gate etch
08/13/2009US20090203199 Ion beam irradiating apparatus, and method of producing semiconductor device
08/13/2009US20090203198 Semiconductor manufacturing apparatus and semiconductor manufacturing method using the same
08/13/2009US20090203197 Novel method for conformal plasma immersed ion implantation assisted by atomic layer deposition
08/13/2009US20090203196 Fabrication of metallic hollow nanoparticles
08/13/2009US20090203195 Hybrid nanocomposite semiconductor material, and method of producing inorganic semiconductor therefor
08/13/2009US20090203194 Transparent conductive film deposition apparatus, film deposition apparatus for continuous formation of multilayered transparent conductive film, and method of forming the film
08/13/2009US20090203193 Laser processing method
08/13/2009US20090203192 Crack Stop Trenches
08/13/2009US20090203191 Method for manufacturing soi substrate
08/13/2009US20090203190 Method of forming a mask stack pattern and method of manufacturing a flash memory device including an active area having rounded corners
08/13/2009US20090203189 Methods of manufacturing trench isolation structures using selective plasma ion immersion implantation and deposition (piiid)
08/13/2009US20090203188 Methods of manufacturing semiconductor devices
08/13/2009US20090203187 Method of Manufacturing SOI Substrate
08/13/2009US20090203186 Semiconductor device and method of fabricating the same
08/13/2009US20090203185 Method for fabricating device structures having a variation in electrical conductivity