Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
09/2009
09/22/2009US7592208 Method for manufacturing semiconductor substrate and method for manufacturing semiconductor apparatus and photomask
09/22/2009US7592207 Light-emitting device and method for manufacturing the same
09/22/2009US7592206 Fuse region and method of fabricating the same
09/22/2009US7592205 Over-passivation process of forming polymer layer over IC chip
09/22/2009US7592204 Package design of small diameter sensor
09/22/2009US7592203 Method of manufacturing an electronic protection device
09/22/2009US7592202 Embedding device in substrate cavity
09/22/2009US7592201 Adjustments of masks by re-flow
09/22/2009US7592200 Solid-state imaging device and method of manufacturing the same
09/22/2009US7592199 Method for forming pinned photodiode resistant to electrical leakage
09/22/2009US7592198 Method for making a photovoltaic cell based on thin-film silicon
09/22/2009US7592197 Image sensor chip package fabrication method
09/22/2009US7592196 Method for fabricating a CMOS image sensor
09/22/2009US7592195 Method for producing a sensor or actuator arrangement, and corresponding sensor or actuator arrangement
09/22/2009US7592194 Radiation-emitting and/or -receiving semiconductor component and method for the patterned application of a contact to a semiconductor body
09/22/2009US7592193 Light emitting device
09/22/2009US7592192 White light emitting diode (white LED) and method of manufacturing white LED
09/22/2009US7592191 Field emission backplate
09/22/2009US7592190 Method of evaluating characteristics of and forming of an insulating film for a semiconductor device
09/22/2009US7592189 MRAM and method of manufacturing the same
09/22/2009US7592130 Illumination improves imaging for hybrid pattern with a sufficient depth of focus by having a mask with a contact hole pattern including a hybrid pattern and using an illumination light that has plural poles and projecting an image of the mask onto a plate through projection optics
09/22/2009US7592127 Resist pattern thickening material, resist pattern and process for forming the same, and semiconductor device and process for manufacturing the same
09/22/2009US7592123 Excellent resolution and line edge roughness characteristics; resin has a hydroxyl group bonded to a carbon atom at a polymer terminal, and the carbon atom in the alpha -position to the hydroxy group has at least one electron attractive group
09/22/2009US7592122 Used in patterning of semiconductor integrated circuit by lithography; a low-molecular compound and a high-molecular compound for constituting photoresist composition, excellent in transparency in fine patterning with light source having a wavelength of 300 nm or less, especially a F2 excimer laser
09/22/2009US7592108 preparing a photomask for near-field exposure, having a light blocking film; position detection; producing a fine metal pattern having a small positional deviation with respect to the Si pattern on the insulating film; high yield
09/22/2009US7592104 excellent in flatness after having been chucked by a mask stage of an exposure system; at least three of four corner portions of the flatness measurement area have a shape that rises toward the outer peripheral side; position accuracy
09/22/2009US7592035 Method of coating microelectronic substrates
09/22/2009US7591959 plurality of selectivities exhibits a first etch selectivity at a first temperature and a second etch selectivity at a second temperature; etchant include phosphoric acid, fluoboric acid, or sulfuric acid to remove dielectric materials, such as Si3N4, SiO2 at different temperarture
09/22/2009US7591957 Method for atmospheric pressure reactive atom plasma processing for surface modification
09/22/2009US7591922 Substrate processing apparatus and substrate processing method
09/22/2009US7591921 heat decaying polymer containing a polyoxyalkylene resin as the principal ingredient formed by crosslinking a crosslinkable group containing hydrolyzing silyl group, an epoxy group, an acid anhydride group, a carboxyl group, a hydroxyl group; a decomposition promoter (SnO2 )
09/22/2009US7591913 Thermoelectric properties by high temperature annealing
09/22/2009US7591908 Vapor deposition apparatus and vapor deposition method
09/22/2009US7591907 Apparatus for hybrid chemical processing
09/22/2009US7591863 Laminating system, IC sheet, roll of IC sheet, and method for manufacturing IC chip
09/22/2009US7591713 Polishing pad, method for processing polishing pad, and method for producing substrate using it
09/22/2009US7591702 Methods of manufacturing semiconductor light emitting devices including patternable films comprising phosphor
09/22/2009US7591659 Method and structure for second spacer formation for strained silicon MOS transistors
09/22/2009US7591625 Carrying mechanism, a carrying device and a vacuum processing apparatus
09/22/2009US7591624 Reticle storage pod (RSP) transport system utilizing FOUP adapter plate
09/22/2009US7591293 Device for bonding a metal on a surface of a substrate
09/22/2009US7591270 Reducing defects in the manufacture of semiconductor devices by contacting with acetylenic diol derivatives, amines, hydroxyamine modified polyethers, esters, quaternaryammonium compounds as surfactant, aqueous (water)and nonaqueous (ethanol, methanol, tetrahydrofuran etc) solvents
09/22/2009US7591232 Internal coil with segmented shield and inductively-coupled plasma source and processing system therewith
09/22/2009US7591151 Renewability and shortened renewing time, preventing elements in a substrate thereof from diffusing into the surface of diamond-like carbon (DLC), heat resistance of the molding die and adhesion between the DLC layer and substrate
09/22/2009US7591071 Manufacturing Method of Semiconductive Element and Ink Jet Head Substrate
09/22/2009US7591069 Methods of bonding solder balls to bond pads on a substrate, and bonding frames
09/22/2009CA2458060C Programmable gate array having interconnecting logic to support embedded fixed logic circuitry
09/22/2009CA2455319C Active-matrix substrate and electromagnetic wave detector
09/17/2009WO2009114798A2 Wafer container with tubular environmental control components
09/17/2009WO2009114791A1 Effluent impedance based endpoint detection
09/17/2009WO2009114780A1 End effector
09/17/2009WO2009114680A2 Cross-coupled transistor layouts in restricted gate level layout architecture
09/17/2009WO2009114675A2 Memory array with a pair of memory-cell strings to a single conductive pillar
09/17/2009WO2009114617A1 Methods for oxidation of a semiconductor device
09/17/2009WO2009114569A2 Cooled cleaving implant
09/17/2009WO2009114426A1 Apparatus and methods of nanopatterning and applications of same
09/17/2009WO2009114375A2 Transparent material processing with an ultrashort pulse laser
09/17/2009WO2009114362A1 Thin film metal oxynitride semiconductors
09/17/2009WO2009114262A2 Electrical control of plasma uniformity using external circuit
09/17/2009WO2009114244A2 Line width roughness improvement with noble gas plasma
09/17/2009WO2009114229A1 Selective planarization method and devices fabricated on planarized structures
09/17/2009WO2009114189A2 Method of forming a photovoltaic cell module
09/17/2009WO2009114187A1 Integrated circuit having long and short channel metal gate devices and method of manufacture
09/17/2009WO2009114184A2 Physical vapor deposition method with a source of isotropic ion velocity distribution at the wafer surface
09/17/2009WO2009114177A2 Phase change memory cell with constriction structure
09/17/2009WO2009114175A2 Cam lock electrode clamp
09/17/2009WO2009114164A1 Low chlorine epoxy resin formulations
09/17/2009WO2009114120A2 Control of bevel etch film profile using plasma exclusion zone rings larger than the wafer diameter
09/17/2009WO2009114108A2 Integrated method and system for manufacturing monolithic panels of crystalline solar cells
09/17/2009WO2009114043A1 Solar wafer cleaning systems, apparatus and methods
09/17/2009WO2009114026A1 Method of forming a passivated densified nanoparticle thin film on a substrate
09/17/2009WO2009113874A2 Method for texturing silicon surfaces and wafers thereof
09/17/2009WO2009113831A2 Multi-functional tape for semiconductor package and a method for manufacturing semiconductor device using the same
09/17/2009WO2009113781A2 Production method for a non-reflective multi-layer thin film having a photocatalyst function, and a multi-layer thin film produced thereby
09/17/2009WO2009113749A1 Wafer testing system comprising chiller
09/17/2009WO2009113735A1 Resist composition and pattern forming method using the same
09/17/2009WO2009113682A1 Gas-dissolved water supply system
09/17/2009WO2009113680A1 Flat antenna member and a plasma processing device provided with same
09/17/2009WO2009113659A1 Semiconductor light-emitting device and method for manufacturing the same
09/17/2009WO2009113651A1 Compound semiconductor light-emitting element and illumination device using the same, and method for manufacturing compound semiconductor light-emitting element
09/17/2009WO2009113615A1 Photosensitive resin composition, photosensitive resin hardened film, and method for forming light-shielding image
09/17/2009WO2009113612A1 Semiconductor device
09/17/2009WO2009113582A1 Semiconductor apparatus and method of manufacturing the same
09/17/2009WO2009113568A1 Image forming method and hardened material formed using the same
09/17/2009WO2009113549A1 Composition for forming underlayer film for image formation
09/17/2009WO2009113544A1 Fluorescent film, film-forming method therefor, multilayer dielectric film, optical element, optical system, imaging unit, instrument for measuring optical characteristics, method of measuring optical characteristics, exposure apparatus, exposure method, and device manufacturing method
09/17/2009WO2009113508A1 Novel salt having fluorine-containing carbanion structure, derivative thereof, photoacid generator, resist material using the photoacid generator, and pattern forming method
09/17/2009WO2009113497A1 Method for producing group iii nitride semiconductor layer, method for manufacturing group iii nitride semiconductor light-emitting device, group iii nitride semiconductor light-emitting device, and lamp
09/17/2009WO2009113490A1 Radiation-sensitive resin composition
09/17/2009WO2009113481A1 Plasma treatment apparatus, and method for controlling substrate attraction force in plasma treatment apparatus
09/17/2009WO2009113472A1 Graphene or graphite thin film, manufacturing method thereof, thin film structure and electronic device
09/17/2009WO2009113459A1 Photosensitive polyorganosiloxane composition
09/17/2009WO2009113458A1 Group iii nitride semiconductor device and method for manufacturing the same, group iii nitride semiconductor light-emitting device and method for manufacturing the same, and lamp
09/17/2009WO2009113455A1 Apparatus and method for manufacturing compound semiconductor single crystal
09/17/2009WO2009113451A1 Loading table structure and processing device
09/17/2009WO2009113442A1 Microwave introducing mechanism, microwave plasma source and microwave plasma processing apparatus
09/17/2009WO2009113427A1 Semiconductor device, semiconductor device manufacturing method and display device
09/17/2009WO2009113402A1 Method and apparatus for etching silicon-containing films
09/17/2009WO2009113400A1 Raw material supplying device
09/17/2009WO2009113399A1 Polishing pad