| Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974) |
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| 09/24/2009 | US20090239356 Device manufacturing method |
| 09/24/2009 | US20090239355 Method of manufacturing semiconductor device |
| 09/24/2009 | US20090239354 Method for manufacturing soi substrate |
| 09/24/2009 | US20090239353 Methods For Forming Multi-layer Three-Dimensional Structures |
| 09/24/2009 | US20090239352 Method for producing silicon oxide film, control program thereof, recording medium and plasma processing apparatus |
| 09/24/2009 | US20090239351 Method For Fabricating Capacitor Structures Using The First Contact Metal |
| 09/24/2009 | US20090239350 High performance tapered varactor |
| 09/24/2009 | US20090239349 Nonvolatile memory devices and methods of forming the same |
| 09/24/2009 | US20090239348 Semiconductor device and method of manufacturing the same |
| 09/24/2009 | US20090239347 Method of forming mos device |
| 09/24/2009 | US20090239346 Semiconductor device with finfet and method of fabricating the same |
| 09/24/2009 | US20090239345 Methods of Fabricating Nonvolatile Semiconductor Memory Devices |
| 09/24/2009 | US20090239344 Methods of Forming Field Effect Transistors Having Silicided Source/Drain Contacts with Low Contact Resistance |
| 09/24/2009 | US20090239343 Methods Of Forming Lines Of Capacitorless One Transistor DRAM Cells, Methods Of Patterning Substrates, And Methods Of Forming Two Conductive Lines |
| 09/24/2009 | US20090239342 Thin Film Transistor Substrate of Horizontal Electric Field Type Liquid Crystal Display Device and Fabricating Method Thereof |
| 09/24/2009 | US20090239341 Ic packaging process |
| 09/24/2009 | US20090239340 Methods for a multiple die integrated circuit package |
| 09/24/2009 | US20090239339 Method of stacking dies for die stack package |
| 09/24/2009 | US20090239338 Method of Forming an Interconnect on a Semiconductor Substrate |
| 09/24/2009 | US20090239337 Microelectronic devices, stacked microelectronic devices, and methods for manufacturing microelectronic devices |
| 09/24/2009 | US20090239336 Semiconductor packages and methods of fabricating the same |
| 09/24/2009 | US20090239335 Semiconductor Device and Manufacturing Method Thereof |
| 09/24/2009 | US20090239334 Electrode formed in aperture defined by a copolymer mask |
| 09/24/2009 | US20090239332 Bifacial Cell With Extruded Gridline Metallization |
| 09/24/2009 | US20090239330 Methods for forming composite nanoparticle-metal metallization contacts on a substrate |
| 09/24/2009 | US20090239329 Method for manufacturing package structure of optical device |
| 09/24/2009 | US20090239328 Photo-detector for detecting image signal of infrared laser radar and method of manufacturing the same |
| 09/24/2009 | US20090239327 Cmos image sensor and method of fabricating the same |
| 09/24/2009 | US20090239325 Method of fabricating a integrated pressure sensor |
| 09/24/2009 | US20090239324 Method for manufacturing semiconductor device using separable support body |
| 09/24/2009 | US20090239323 Microresonator Systems And Methods Of Fabricating The Same |
| 09/24/2009 | US20090239322 Method of fabricating liquid crystal display |
| 09/24/2009 | US20090239321 Transistor array substrate and display panel |
| 09/24/2009 | US20090239320 Semiconductor device and peeling off method and method of manufacturing semiconductor device |
| 09/24/2009 | US20090239319 Package for a light emitting diode and a process for fabricating the same |
| 09/24/2009 | US20090239317 Method and jig structure for positioning bare dice |
| 09/24/2009 | US20090239316 Method and system to dynamically compensate for probe tip misalignement when testing integrated circuits |
| 09/24/2009 | US20090239315 Method and system for processing test wafer in photolithography process |
| 09/24/2009 | US20090239314 Methods of Manufacturing a Semiconductor Device |
| 09/24/2009 | US20090239313 Integrated Circuit Chip Design Flow Methodology Including Insertion of On-Chip or Scribe Line Wireless Process Monitoring and Feedback Circuitry |
| 09/24/2009 | US20090239161 Applications of semiconductor nano-sized particles for photolithography |
| 09/24/2009 | US20090239160 Method for preparing data for exposure and method for manufacturing photo mask |
| 09/24/2009 | US20090239159 Photomask, apparatus for manufacturing semiconductor device having the photomask, and method of manufacturing semiconductor device using the photomask |
| 09/24/2009 | US20090239085 SiC SEMICONDUCTOR ELEMENT, METHOD OF MANUFACTURING THE SAME, AND MANUFACTURING APPARATUS THEREOF |
| 09/24/2009 | US20090238998 Coaxial microwave assisted deposition and etch systems |
| 09/24/2009 | US20090238664 Storing apparatus and transporting system with storage |
| 09/24/2009 | US20090238443 Pattern measurement methods and pattern measurement equipment |
| 09/24/2009 | US20090238441 Pattern inspection apparatus, pattern inspection method, and computer-readable recording medium storing a program |
| 09/24/2009 | US20090238232 Method of Protecting Semiconductor Chips from Mechanical and ESD Damage During Handling |
| 09/24/2009 | US20090238010 Systems and devices including multi-transistor cells and methods of using, making, and operating the same |
| 09/24/2009 | US20090238004 Method of operating sonos memory device |
| 09/24/2009 | US20090238000 Systems and devices including multi-gate transistors and methods of using, making, and operating the same |
| 09/24/2009 | US20090237990 Sonos device with insulating storage layer and p-n junction isolation |
| 09/24/2009 | US20090237987 Crossbar diode-switched magnetoresistive random access memory system |
| 09/24/2009 | US20090237985 Semiconductor device and its fabrication method |
| 09/24/2009 | US20090237983 Integrated circuit including memory element doped with dielectric material |
| 09/24/2009 | US20090237982 Magnetically De-Coupling Magnetic Tunnel Junctions and Bit/Word Lines for Reducing Bit Selection Errors in Spin-Momentum Transfer Switching |
| 09/24/2009 | US20090237890 Semiconductor device and method for manufacturing the same |
| 09/24/2009 | US20090237858 Arrangement of MEMS Devices Having Series Coupled Capacitors |
| 09/24/2009 | US20090237846 Esd protection circuit and method thereof |
| 09/24/2009 | US20090237780 Semiconductor optical amplifier, method for manufacturing the same, and semiconductor optical integrated device |
| 09/24/2009 | US20090237582 System for displaying images |
| 09/24/2009 | US20090237580 System for display images and fabrication method thereof |
| 09/24/2009 | US20090237320 Transducer for high-frequency antenna coupling and related apparatus and method |
| 09/24/2009 | US20090236977 Organic light emitting diode display device and method of fabricating the same |
| 09/24/2009 | US20090236786 Hand having rocking mechanism and substrate delivering device having the same |
| 09/24/2009 | US20090236757 Semiconductor device and method for manufacturing |
| 09/24/2009 | US20090236756 Flip chip interconnection system |
| 09/24/2009 | US20090236754 Integrated circuit package system with stacking module |
| 09/24/2009 | US20090236751 Integrated circuit package system with support structure for die overhang |
| 09/24/2009 | US20090236750 Package structure in which coreless substrate has direct electrical connections to semiconductor chip and manufacturing method thereof |
| 09/24/2009 | US20090236749 Electronic device and manufacturing thereof |
| 09/24/2009 | US20090236747 Semiconductor device and method for fabricating the same |
| 09/24/2009 | US20090236746 Semiconductor device and method for fabricating semiconductor device |
| 09/24/2009 | US20090236745 Adhesion to Copper and Copper Electromigration Resistance |
| 09/24/2009 | US20090236744 Semiconductor device and method of producing the same |
| 09/24/2009 | US20090236742 Wire bonding over active circuits |
| 09/24/2009 | US20090236741 Conductive structure of a chip and method for manufacturing the same |
| 09/24/2009 | US20090236739 Semiconductor package having substrate id code and its fabricating method |
| 09/24/2009 | US20090236738 Semiconductor Device and Method of Forming Oxide Layer on Signal Traces for Electrical Isolation in Fine Pitch Bonding |
| 09/24/2009 | US20090236735 Upgradeable and repairable semiconductor packages and methods |
| 09/24/2009 | US20090236734 Semiconductor Device With Cross-Talk Isolation Using M-CAP and Method Thereof |
| 09/24/2009 | US20090236733 Ball grid array package system |
| 09/24/2009 | US20090236730 Die substrate with reinforcement structure |
| 09/24/2009 | US20090236726 Package-on-package semiconductor structure |
| 09/24/2009 | US20090236724 Ic package with wirebond and flipchip interconnects on the same die with through wafer via |
| 09/24/2009 | US20090236723 Integrated circuit packaging system with package-in-package and method of manufacture thereof |
| 09/24/2009 | US20090236721 Semiconductor device and manufacturing method thereof |
| 09/24/2009 | US20090236720 Integrated circuit package system with step mold recess |
| 09/24/2009 | US20090236717 Organic Electronic Component With Dessicant-Containing Passivation Material |
| 09/24/2009 | US20090236715 Semiconductor package structure with laminated interposing layer |
| 09/24/2009 | US20090236713 Semiconductor integrated circuit package and method of packaging semiconductor integrated circuit |
| 09/24/2009 | US20090236711 Method of making and designing lead frames for semiconductor packages |
| 09/24/2009 | US20090236705 Apparatus and method for series connection of two die or chips in single electronics package |
| 09/24/2009 | US20090236703 Chip package structure and the method thereof |
| 09/24/2009 | US20090236702 SiP SUBSTRATE |
| 09/24/2009 | US20090236700 Semiconductor device and manufacturing method of the same |
| 09/24/2009 | US20090236699 Discreet placement of radiation sources on integrated circuit devices |
| 09/24/2009 | US20090236698 Method of fabricating a semiconductor device |
| 09/24/2009 | US20090236697 Semiconductor device and method of manufacturing the same |