| Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974) |
|---|
| 09/23/2009 | EP2104132A2 Glass-based soi structures |
| 09/23/2009 | EP2103721A1 PROCESS FOR PRODUCTION OF GaN CRYSTALS, GaN CRYSTALS, GaN CRYSTAL SUBSTRATE, SEMICONDUCTOR DEVICES, AND APPARATUS FOR PRODUCTION OF GaN CRYSTALS |
| 09/23/2009 | EP2102907A2 High-z structure and method for co-alignment of mixed optical and electron beam lithographic fabrication levels |
| 09/23/2009 | EP2102906A1 Elimination of short circuits between conductors by laser ablation |
| 09/23/2009 | EP2102905A1 Method of making an interconnect structure |
| 09/23/2009 | EP2102904A2 Method for preparing thin gan layers by implantation and recycling of a starting substrate |
| 09/23/2009 | EP2102903A1 A method of fabricating a mixed substrate |
| 09/23/2009 | EP2102902A1 Handling tool for components, in particular electronic components |
| 09/23/2009 | EP2102901A1 Methods of forming an epitaxial layer on a group iv semiconductor substrate |
| 09/23/2009 | EP2102900A1 Self-constrained anisotropic germanium nanostructure from electroplating |
| 09/23/2009 | EP2102899A1 Nitride nanowires and method of producing such |
| 09/23/2009 | EP2102898A2 Reel-to-reel reaction of precursor film to form solar cell absorber |
| 09/23/2009 | EP2102897A1 Method of sealing glass |
| 09/23/2009 | EP2102896A1 Device and method for cleaning articles, especially thin wafers |
| 09/23/2009 | EP2102895A1 Device and method for wet treating plate-like-articles |
| 09/23/2009 | EP2102894A1 Device and method for controlling the temperature of a substrate |
| 09/23/2009 | EP2102574A1 Arrangement and a method for controlling drying processes for the production of semiconductor components |
| 09/23/2009 | EP2102287A2 Antireflective coating compositions |
| 09/23/2009 | EP1741132B1 Method of making dual-metal cmos transistors with tunable gate electrode work function |
| 09/23/2009 | EP1730767B1 Device for separating and positioning module bridges |
| 09/23/2009 | EP1579487B1 Method of manufacturing a semiconductor device |
| 09/23/2009 | EP1478978B1 Self-aligned pattern formation using dual wavelengths |
| 09/23/2009 | EP1354350B1 Plastic encapsulated semiconductor devices with improved corrosion resistance |
| 09/23/2009 | EP1266214B1 Flexural plate wave sensor |
| 09/23/2009 | EP1204138B1 Attaching and removing unit of lid for wafer carrier |
| 09/23/2009 | EP1186020B1 A method of manufacturing a semiconductor device |
| 09/23/2009 | CN201315317Y Device for rapidly and exactly positioning die bonder |
| 09/23/2009 | CN201315316Y Roller structure |
| 09/23/2009 | CN201315315Y Air extracting device |
| 09/23/2009 | CN201315314Y 晶片清洗装置 Wafer cleaning device |
| 09/23/2009 | CN101542759A Semiconductor wafer and semiconductor device and manufacture methods thereof |
| 09/23/2009 | CN101542726A Semiconductor chip with silicon through holes and side bonding pads |
| 09/23/2009 | CN101542716A Metal substrate having electronic devices formed thereon |
| 09/23/2009 | CN101542715A 半导体装置 Semiconductor device |
| 09/23/2009 | CN101542714A Method of manufacturing semiconductor chip |
| 09/23/2009 | CN101542713A Substrate processing apparatus, substrate processing method and computer readable storage medium |
| 09/23/2009 | CN101542712A Apparatus and method for controlling plasma density profile |
| 09/23/2009 | CN101542711A Substrate position detecting apparatus and method for adjusting position of imaging component of the substrate position detecting apparatus |
| 09/23/2009 | CN101542710A Low resistance contact structure and fabrication thereof |
| 09/23/2009 | CN101542709A Substrate transfer apparatus, substrate transfer module, substrate transfer method and computer readable storage medium |
| 09/23/2009 | CN101542708A Positional shift detecting apparatus and processing system using the same |
| 09/23/2009 | CN101542707A Semiconductor device inspecting method and semiconductor device inspecting apparatus |
| 09/23/2009 | CN101542706A Electronic component mounting body and electronic component with solder bump and method for manufacturing them |
| 09/23/2009 | CN101542705A Electronic component mounting structure and method for manufacturing the same |
| 09/23/2009 | CN101542704A 半导体装置 Semiconductor device |
| 09/23/2009 | CN101542703A Method and apparatus for making semiconductor packages |
| 09/23/2009 | CN101542702A Bonding method of three dimensional wafer lamination based on silicon through holes |
| 09/23/2009 | CN101542701A Bonding method of three dimensional wafer lamination based on silicon through holes |
| 09/23/2009 | CN101542700A Room temperature-operating single-electron device and the fabrication method thereof |
| 09/23/2009 | CN101542699A Semiconductor device and method for manufacturing semiconductor device |
| 09/23/2009 | CN101542698A Electrode coating material, electrode structure and semiconductor device |
| 09/23/2009 | CN101542697A High-voltage bipolar-CMOS-DMOS integrated circuit devices and modular methods of forming the same |
| 09/23/2009 | CN101542696A Al alloy film for display device, display device, and sputtering target |
| 09/23/2009 | CN101542695A Method for forming SrTiO3 film and storage medium |
| 09/23/2009 | CN101542694A Oxidation method and oxidation apparatus |
| 09/23/2009 | CN101542693A Dry photoresist stripping process and apparatus |
| 09/23/2009 | CN101542692A Etching solution composition |
| 09/23/2009 | CN101542691A Reduced twisting in ultra-high aspect ratio dielectric etch |
| 09/23/2009 | CN101542690A Aqueous dispersion for chemical mechanical polishing and method of chemical mechanical polishing of semiconductor device |
| 09/23/2009 | CN101542689A Pressure-sensitive adhesive sheet for water jet laser dicing |
| 09/23/2009 | CN101542688A Method for manufacturing silicon carbide semiconductor element |
| 09/23/2009 | CN101542687A Method of using boron diffusion source and process for producing semiconductor |
| 09/23/2009 | CN101542686A Vacuum processing apparatus and film forming method using vacuum processing apparatus |
| 09/23/2009 | CN101542685A Methods to reduce the critical dimension of semiconductor devices and partially fabricated semiconductor devices having reduced critical dimensions |
| 09/23/2009 | CN101542684A Device and method for removing liquid from a surface of a disc-like article |
| 09/23/2009 | CN101541145A Processing method of ultra-thin core board in manufacturing of printed circuit board or integrated circuit package substrate |
| 09/23/2009 | CN101541140A Plasma treatment equipment and shielding ring thereof |
| 09/23/2009 | CN101540836A Camera chip size module with novel structure and method for producing same |
| 09/23/2009 | CN101540368A Memory cell and method for manufacturing a memory cell |
| 09/23/2009 | CN101540365A Nitride semiconductor laminated structure and optical semiconductor device, and methods for producing the same |
| 09/23/2009 | CN101540355A Die-bonding method for light-emitting diode |
| 09/23/2009 | CN101540343A 4H-SiC PiN /schottky diode of offset field plate structure and manufacturing method of 4H-SiC PiN /schottky diode |
| 09/23/2009 | CN101540338A Groove flat-grid MOSFET component and fabricating method thereof |
| 09/23/2009 | CN101540334A Integration of solar cell and high energy density memory and manufacturing method thereof |
| 09/23/2009 | CN101540332A Display device and manufacturing method thereof |
| 09/23/2009 | CN101540331A System for display images and fabrication method thereof |
| 09/23/2009 | CN101540329A Thin film transistor substrate and manufacturing process thereof |
| 09/23/2009 | CN101540328A Nonvolatile semiconductor storage device and method for manufacturing the same |
| 09/23/2009 | CN101540325A Electrode structure of memory capacitor and method for manufacturing memory capacitor structure |
| 09/23/2009 | CN101540323A Programmable semiconductor antisurge protective device, fabricating process and layout |
| 09/23/2009 | CN101540322A Semiconductor component and manufacturing method thereof |
| 09/23/2009 | CN101540315A Semiconductor device and forming method thereof |
| 09/23/2009 | CN101540314A Light-emitting diode element and forming method thereof |
| 09/23/2009 | CN101540312A Stacked chip encapsulation structure |
| 09/23/2009 | CN101540311A Multilayer wiring substrate and method of manufacturing the same |
| 09/23/2009 | CN101540306A Semiconductor wafer encapsulation body and encapsulation method thereof |
| 09/23/2009 | CN101540303A 抗磨损和晶须的涂覆系统和方法 Abrasion resistant coating systems and methods and whiskers |
| 09/23/2009 | CN101540301A Hermetic sealing apparatus and hermetic sealing method using frit |
| 09/23/2009 | CN101540298A TFT-LCD array substrate and manufacturing method thereof |
| 09/23/2009 | CN101540297A Method for manufacturing monolithic-integrated enhancement/depletion-type GaAs MHEMT annular oscillators |
| 09/23/2009 | CN101540296A Manufacturing method for realizing monolithic integration of microwave switch and logic control circuit thereof |
| 09/23/2009 | CN101540295A Preparation method of insulation layer of TSV through hole |
| 09/23/2009 | CN101540294A Method for fabricating semiconductor device with interface barrier |
| 09/23/2009 | CN101540293A Silicon chip-positioning method and positioning mechanism used in semiconductor manufacturing process |
| 09/23/2009 | CN101540292A Method for testing the stress of side wall of field effect transistor |
| 09/23/2009 | CN101540291A Automatic sorting machine for semiconductor chip |
| 09/23/2009 | CN101540290A Resin encapsulation and manufacturing method thereof |
| 09/23/2009 | CN101540289A Semiconductor integrated circuit package and method for packaging semiconductor integrated circuit |
| 09/23/2009 | CN101540288A Method for printing a metal paste, metal mask, and bump forming method |
| 09/23/2009 | CN101540287A Method for preparing slot field-effect transistor with back-gate ZnO multi-nano wire |