Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
09/2009
09/24/2009WO2009116411A1 Power combiner and microwave introduction mechanism
09/24/2009WO2009116400A1 Annealing apparatus and overheat prevention system
09/24/2009WO2009116383A1 Control device and control method
09/24/2009WO2009116373A1 Gate insulating material, gate insulating film, and organic field effect transistor
09/24/2009WO2009116348A1 Reflective mask blank for euv lithography
09/24/2009WO2009116347A1 Electronic member wherein barrier-seed layer is formed on base
09/24/2009WO2009116346A1 Electronic member wherein barrier-seed layer is formed on base
09/24/2009WO2009116283A1 Semiconductor device and method for manufacturing said device
09/24/2009WO2009116281A1 Semiconductor device and manufacturing method for the same
09/24/2009WO2009116258A1 Photosensitive resin composition, film for photosensitive resin spacer, and semiconductor device
09/24/2009WO2009116233A1 Silicon epitaxial wafer and method for manufacturing the same
09/24/2009WO2009116232A1 Compound semiconductor substrate, light emitting element using compound semiconductor substrate, and method for manufacturing compound semiconductor substrate
09/24/2009WO2009116227A1 Soi wafer, semiconductor device and method for manufacturing soi wafer
09/24/2009WO2009116223A1 Semiconductor device
09/24/2009WO2009116202A1 Mounted board, mounted board set, and panel unit
09/24/2009WO2009116191A1 Diruthenium complex and material and method for chemical vapor deposition
09/24/2009WO2009116185A1 Composite silver nanopaste, process for production thereof, method of connection and pattern formation process
09/24/2009WO2009116180A1 Photoresist applying apparatus
09/24/2009WO2009116177A1 Optical matrix device
09/24/2009WO2009116158A1 Method for manufacturing semiconductor device
09/24/2009WO2009116136A1 Composite silver nanopaste, process for producing the composite silver nanopaste, and method for bonding the nanopaste
09/24/2009WO2009116015A1 Finfet transistor with high-voltage capability and cmos-compatible method for fabricating the same
09/24/2009WO2009115859A1 Substrates for monolithic optical circuits and electronic circuits
09/24/2009WO2009115686A2 Connection component with hollow inserts and method for making same
09/24/2009WO2009115551A1 Method for making microstructures by converting porous silicon into porous metal or ceramics
09/24/2009WO2009115512A1 Heatsinks of thermally conductive plastic materials
09/24/2009WO2009115484A1 Processing of multilayer semiconductor wafers
09/24/2009WO2009115449A1 Method for fabricating through-substrate vias
09/24/2009WO2009115240A1 Method for bonding chips onto wafers
09/24/2009WO2009115068A1 Method and conveyor belt system having at least one conveyor belt for transporting flat transport goods
09/24/2009WO2009115005A1 Shielding ring for plasma processing device and plasma processing device
09/24/2009WO2009114975A1 Power transistor of mos structure and method for manufacturing the same
09/24/2009WO2009114973A1 Intelligent label that may use chips, and flip-chip module production equipment
09/24/2009WO2009114965A1 Electrochemical deposition system
09/24/2009WO2009114964A1 Solution preparation apparatus and method for treating individual semiconductor workpiece
09/24/2009WO2009097089A3 Gas modulation to control edge exclusion in a bevel edge etching plasma chamber
09/24/2009WO2009092794A3 Object provided with a graphics element transferred onto a support wafer and method of producing such an object
09/24/2009WO2009091840A3 Power transistor with protected channel
09/24/2009WO2009091642A3 Electrostatic surface cleaning
09/24/2009WO2009089311A3 Methods and apparatus for a wide conductance kit
09/24/2009WO2009089158A3 Functionalized fullerenes for nanolithography applications
09/24/2009WO2009088922A3 Methods and apparatus for forming memory lines and vias in three dimensional memory arrays using dual damascene process and imprint lithography
09/24/2009WO2009088882A3 Edge-contacted vertical carbon nanotube transistor
09/24/2009WO2009086042A3 Arrangements and methods for determining positions and offsets
09/24/2009WO2009086027A3 Systems and methods for calibrating end effector alignment in a plasma processing system
09/24/2009WO2009085992A3 Thermal reactor with improved gas flow distribution
09/24/2009WO2009085974A3 Low wet etch rate silicon nitride film
09/24/2009WO2009082753A3 Asymmetrical rf drive for electrode of plasma chamber
09/24/2009WO2009079651A3 Electronic device package and method of formation
09/24/2009WO2009079565A3 Multiple chuck scanning stage
09/24/2009WO2009076192A3 Mechanical memory transistor
09/24/2009WO2009073491A3 Apparatus and method for depositing electrically conductive pasting material
09/24/2009WO2009060319A3 Method and apparatus for deriving an iso-dense bias and controlling a fabrication process
09/24/2009WO2009035456A3 A forked probe for testing semiconductor devices
09/24/2009WO2009032390A3 Method of providing patterned embedded conducive layer using laser aided etching of dielectric build-up layer
09/24/2009WO2009023349A3 Integrated nanotube and cmos devices for system-on-chip (soc) applications and method for forming the same
09/24/2009WO2009018044A3 Advanced multi-workpiece processing chamber
09/24/2009WO2008121922A3 CHEMICAL MECHANICAL POLISHING METHOD AND APPARATUS FOR REDUCING MATERIAL RE-DEPOSITION DUE TO pH TRANSITIONS
09/24/2009WO2008100502A8 Al(x)ga(1-x)n-cladding-free nonpolar iii-nitride based laser diodes and light emitting diodes
09/24/2009WO2008092186A8 Method of forming openings in selected material
09/24/2009US20090241086 Method of making pattern data, and medium for storing the program for making the pattern data
09/24/2009US20090240362 Simulation model creating method, mask data creating method and semiconductor device manufacturing method
09/24/2009US20090240017 Borazine-based resin, process for its production, borazine-based resin composition, insulating film and method for its formation
09/24/2009US20090239732 Optical component quartz glass
09/24/2009US20090239454 Cmp conditioner and process for producing the same
09/24/2009US20090239448 Machining quality judging method for wafer grinding machine and wafer grinding machine
09/24/2009US20090239390 Methods for producing low stress porous and cdo low-k dielectric materials using precursors with organic functional groups
09/24/2009US20090239389 Method of Forming a Layer of Material Using an Atomic Layer Deposition Process
09/24/2009US20090239388 Semiconductor device and method for manufacturing the same
09/24/2009US20090239387 Producing method of semiconductor device and substrate processing apparatus
09/24/2009US20090239386 Producing method of semiconductor device and substrate processing apparatus
09/24/2009US20090239385 Substrate-supporting device having continuous concavity
09/24/2009US20090239384 Substrate processing apparatus and substrate processing method
09/24/2009US20090239383 Manufacturing method of semiconductor device
09/24/2009US20090239382 Method for selectively modifying spacing between pitch multiplied structures
09/24/2009US20090239381 Porous film
09/24/2009US20090239380 Polishing liquid for metal and polishing method using the same
09/24/2009US20090239379 Methods of Planarization and Electro-Chemical Mechanical Polishing Processes
09/24/2009US20090239378 Methods for forming a titanium nitride layer
09/24/2009US20090239377 Semiconductor device and method for manufacturing the same
09/24/2009US20090239376 Method for fabricating semiconductor device with interface barrier
09/24/2009US20090239375 Dual Damascene Process
09/24/2009US20090239374 Methods of Forming Metal Interconnect Structures on Semiconductor Substrates Using Oxygen-Removing Plasmas and Interconnect Structures Formed Thereby
09/24/2009US20090239373 Chemical mechanical polishing method and method of manufacturing semiconductor device
09/24/2009US20090239372 Seed Layers for Electroplated Interconnects
09/24/2009US20090239371 Method For Applying Selectively A Layer To A Structured Substrate By The Usage Of A Temperature Gradient In The Substrate
09/24/2009US20090239370 Methods Of Forming An Antifuse And A Conductive Interconnect, And Methods Of Forming DRAM Circuitry
09/24/2009US20090239369 Method of Forming Electrical Interconnects within Insulating Layers that Form Consecutive Sidewalls
09/24/2009US20090239368 Methods of Forming an Oxide Layer and Methods of Forming a Gate Using the Same
09/24/2009US20090239367 Nonvolatile memory device and method of fabricating the same
09/24/2009US20090239366 Method Of Forming A Transistor Gate Of A Recessed Access Device, Method Of Forming A Recessed Transistor Gate And A Non-Recessed Transistor Gate, And Method Of Fabricating An Integrated Circuit
09/24/2009US20090239365 Nonvolatile semiconductor memory and fabrication method for the same
09/24/2009US20090239364 Method for forming insulating film and method for manufacturing semiconductor device
09/24/2009US20090239363 Methods for forming doped regions in semiconductor substrates using non-contact printing processes and dopant-comprising inks for forming such doped regions using non-contact printing processes
09/24/2009US20090239362 Apparatus for manufacturing semiconductor device and method for manufacturing semiconductor device
09/24/2009US20090239361 Method of manufacturing semiconductor device
09/24/2009US20090239360 Semiconductor device manufacturing apparatus and method
09/24/2009US20090239359 Integrated process system and process sequence for production of thin film transistor arrays using doped or compounded metal oxide semiconductor
09/24/2009US20090239358 Memory Device Manufacturing Method
09/24/2009US20090239357 AlGaN SUBSTRATE AND PRODUCTION METHOD THEREOF