Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
10/2009
10/01/2009US20090242899 Epitaxial Growth on Low Degree Off-Axis SiC Substrates and Semiconductor Devices Made Thereby
10/01/2009US20090242898 Method of controlling stress in gallium nitride films deposited on substrates
10/01/2009US20090242895 Thin film transistor, method of fabricating the same, and organic lighting emitting diode display device including the same
10/01/2009US20090242894 Thin-Film-Transistor Structure, Pixel Structure and Manufacturing Method Thereof
10/01/2009US20090242893 Semiconductor device, production method thereof, and display device
10/01/2009US20090242892 Semiconductor device and method for forming the same
10/01/2009US20090242889 Thin film transistor, method for manufacturing the same, and display
10/01/2009US20090242888 Display Device and Method for Manufacturing the Same
10/01/2009US20090242887 Display Substrate Having a Transparent Conductive Layer Made of Zinc Oxide and Manufacturing Method Thereof
10/01/2009US20090242885 Manufacturing process of liquid crystal display device, and liquid crystal display device
10/01/2009US20090242884 Method of producing display device, display device, method of producing thin-film transistor substrate, and thin-film transistor substrate
10/01/2009US20090242883 Thin film transistor, active array substrate and method for manufacturing the same
10/01/2009US20090242882 Three-dimensional microstructures and methods for making same
10/01/2009US20090242880 Thermally stabilized electrode structure
10/01/2009US20090242873 Semiconductor heterostructures to reduce short channel effects
10/01/2009US20090242869 Super lattice/quantum well nanowires
10/01/2009US20090242868 Semiconductor device and method of manufacturing the same
10/01/2009US20090242866 Phase change memory device and method of fabricating the same
10/01/2009US20090242865 Memory array with diode driver and method for fabricating the same
10/01/2009US20090242843 Method for Manufacturing Silicon Wafer and Silicon Wafer Manufactured by this Method
10/01/2009US20090242800 Electron-beam dimension measuring apparatus and electron-beam dimension measuring method
10/01/2009US20090242787 Charged-particle beam writing method and charged-particle beam writing apparatus
10/01/2009US20090242768 Thermal-type infrared solid-state imaging device and manufacturing method of the same
10/01/2009US20090242741 Solid-state image capturing apparatus, manufacturing method for the solid-state image capturing apparatus, and electronic information device
10/01/2009US20090242736 Solid-state imaging device and manufacturing method thereof and electronic apparatus and manufacturing method thereof
10/01/2009US20090242543 Monitoring Witness Structures for Temperature Control in RTP Systems
10/01/2009US20090242516 Plasma etching method and computer readable storage medium
10/01/2009US20090242405 Bottom-up assembly of structures on a substrate
10/01/2009US20090242135 Plasma processing apparatus
10/01/2009US20090242132 Plasma processing apparatus and feeder rod used therein
10/01/2009US20090242128 Plasma processing apparatus and method
10/01/2009US20090242127 Plasma etching apparatus and method, and computer-readable storage medium
10/01/2009US20090242122 Method for mounting semiconductor device, as well as circuit board, electrooptic device, and electronic device
10/01/2009US20090242111 Method for dicing wafer and process for manufacturing liquid-discharging head using the dicing method
10/01/2009US20090242032 Photoelectric conversion device and method for manufacturing the same
10/01/2009US20090242031 Photovoltaic Assembly Including a Conductive Layer Between a Semiconductor Lamina and a Receiver Element
10/01/2009US20090242025 Thin film type solar cell, and method for manufacturing the same
10/01/2009US20090242023 System and method for producing a solar cell array
10/01/2009US20090242018 Thin-film solar cell and fabrication method thereof
10/01/2009US20090241996 Single wafer dryer and drying methods
10/01/2009US20090241681 Hydrogel-based mems biosensor
10/01/2009US20090241678 Pressure sensor and method for manufacturing the same
10/01/2009US20090241665 Vibrating beam accelerometer with improved performance in vibration environments
10/01/2009US20090241311 Jig for producing capacitor, production method for capacitor and capacitor
10/01/2009US20090241310 Rlsa cvd deposition control using halogen gas for hydrogen scavenging
10/01/2009US20090241274 Method of removing particles on photomask
10/01/2009DE202009010229U1 Sorter Sorter
10/01/2009DE202009009950U1 Elektronische Baugruppe Electronic assembly
10/01/2009DE19953843B4 Verfahren zur Herstellung einer Kupferverdrahtung für eine Halbleitervorrichtung A process for producing a copper wiring for a semiconductor device
10/01/2009DE112007002816T5 Vertikales Boot für eine Wärmebehandlung und Wärmebehandlungsverfahren von Halbleiter-Wafern unter Verwendung desselben The same vertical boat for heat treatment and heat treatment method of semiconductor wafers using
10/01/2009DE10354866B4 Verfahren zum Herstellen einer Flüssigkristallanzeigevorrichtung A method of manufacturing a liquid crystal display device
10/01/2009DE102009015322A1 Schalterschaltung Switch circuit
10/01/2009DE102009014582A1 Verfahren zur Herstellung einer Halbleitervorrichtung A process for producing a semiconductor device
10/01/2009DE102009012643A1 Connecting structure for connecting electronic component i.e. semiconductor chip, and/or substrate carrier on organic printed circuit board, has contact elements at which material of component or carrier is removed for forming free area
10/01/2009DE102009012524A1 Halbleitermodul Semiconductor module
10/01/2009DE102009011491A1 Schleifverfahren zum Schleifen der Rückfläche eines Halbleiterwafers sowie dafür verwendete Schleifvorrichtung zum Schleifen der Rückfläche eines Halbleiters Grinding method for grinding the back surface of a semiconductor wafer and used for grinding apparatus for grinding the back surface of a semiconductor
10/01/2009DE102009010174A1 Halbleiterbauelement und Verfahren zu seiner Herstellung Semiconductor device and process for its preparation
10/01/2009DE102009008504A1 Ein Halbleiterbauelement und Verfahren A semiconductor device and method
10/01/2009DE102009007708A1 Elektronikeinrichtung Electronic device
10/01/2009DE102009004511A1 Wafer-Verarbeitungsverfahren und Wafer-Verarbeitungsvorrichtung The wafer processing method and wafer processing apparatus
10/01/2009DE102009000625A1 Zweifach-Damascene-Prozess Dual damascene process
10/01/2009DE102008063721A1 Waferschleifverfahren und Waferschleifvorrichtung Wafer grinding method and grinding device wafer
10/01/2009DE102008016694A1 Verfahren zur Erzeugung eines Leiter-Nichtleiter-Übergangs A process for producing a conductor-insulator-transition
10/01/2009DE102008016463A1 Verfahren zur Planarisierung einer Halbleiterstruktur Method for planarizing a semiconductor structure
10/01/2009DE102008016439A1 SOI-Transistor mit potentialfreiem Körper für die Informationsspeicherung mit asymmetrischen Drain/Source-Gebieten SOI transistor with a floating body for information storage with asymmetrical drain / source regions
10/01/2009DE102008016429A1 Verfahren zur Herstellung dünner Schichten durch einen thermisch aktivierten Prozess unter Anwendung eines Temperaturgradienten über das Substrat hinweg A method for producing thin layers by a thermally activated process, using a temperature gradient across the substrate
10/01/2009DE102008016426A1 Verfahren zum Erzeugen einer Zugverformung durch Anwenden von Verspannungsgedächtnistechniken in unmittelbarer Nähe zu der Gateelektrode A method for generating a tensile strain by applying stress memorization techniques in close proximity to the gate electrode
10/01/2009DE102008016425A1 Verfahren zur Strukturierung einer Metallisierungsschicht durch Verringerung der durch Lackentfernung hervorgerufenen Schäden des dielektrischen Materials Method for structuring a metallization layer by reducing the damage caused by varnish removal of the dielectric material
10/01/2009DE102008016424A1 Verringern der Strukturierungsschwankung von Gräben in Metallisierungsschichtstapeln mit einem Material mit kleinem ε durch Verringerung der Kontamination der Grabendielektrika Reduce the fluctuation of patterning trenches in Metallisierungsschichtstapeln with a material with a small ε, by reducing the contamination of the Grabendielektrika
10/01/2009DE102008014824A1 Doping area of body by using doping agent for doping wafers, preferably wafers of pure elements or alloys, particularly crystalline or polycrystalline silicon or germanium wafers, involves providing doping film having carrier film
10/01/2009DE102008013428A1 Radiation detector module producing method for detecting X-ray or gamma radiation, involves connecting converter and electronic component such that contact surfaces face each other and contact elements are connected with each other
10/01/2009DE102008012858A1 Integrierte Schaltung in einem Halbleiterbauelement mit mindestens zwei elektrisch voneinander isolierten Bereichen An integrated circuit in a semiconductor component having at least two regions electrically insulated from one another
10/01/2009DE102008008498A1 Punch-through-trend reducing method for semiconductor device, involves forming doped region adjacent to another doped region with dopant e.g. antimony, where doped regions are electrically isolated against each other
10/01/2009DE102008000842A1 Verfahren zur Herstellung einer elektronischen Baugruppe A process for preparing an electronic assembly
10/01/2009DE102007063640A1 Integrierter Schaltkreis mit einer Speicherzellenanordnung An integrated circuit comprising a memory cell array
10/01/2009DE102006060887B4 Verfahren zur Herstellung einer Halbleiteranordnung mit gemischter Orientierung A method of manufacturing a semiconductor device having a mixed orientation
10/01/2009DE102006042956B4 Verfahren zur optischen Inspektion und Visualisierung der von scheibenförmigen Objekten gewonnenen optischen Messwerte Method for optically inspecting and visualization of the disc-shaped objects obtained from optical measurements
10/01/2009DE102005019552B4 Verfahren zum Herstellen eines Flash-Speichers A method of manufacturing a flash memory
10/01/2009DE102004063143B4 Dummy-Schicht bei einem Halbleiter-Bauelement und Herstellungsverfahren dafür Dummy layer in a semiconductor device and manufacturing method thereof
10/01/2009DE102004045231B4 Halbleitervorrichtung, die eine Fehlfunktion verhindern kann, welche von einem in einer Pegelschiebeschaltung erzeugten falschen Signal verursacht ist A semiconductor device which can prevent a malfunction which is caused by a signal generated in a level shift circuit wrong signal
10/01/2009DE10064042B4 Verfahren zur Herstellung einer Kupferverdrahtung in einem Halbleiterbauelement A process for producing a copper wiring in a semiconductor device
10/01/2009CA2689186A1 Coating membrane forming method and coating membrane forming apparatus
09/2009
09/30/2009EP2105977A1 Nitride semiconductor element with supporting substrate and method for producing nitride semiconductor element
09/30/2009EP2105975A1 Resin sheet for encapsulating optical semiconductor element and optical semiconductor device
09/30/2009EP2105973A1 Iii nitride compound semiconductor element and method for manufacturing the same, iii nitride compound semiconductor light emitting element and method for manufacturing the same, and lamp
09/30/2009EP2105966A2 Semiconductor TFT device and method of fabricating same
09/30/2009EP2105962A2 Semiconductor device and production method thereof
09/30/2009EP2105960A2 Improved adhesion to copper and copper electromigration resistance
09/30/2009EP2105959A2 Method for forming interconnection levels of an integrated circuit
09/30/2009EP2105958A1 Method for manufacturing a stressed layer
09/30/2009EP2105957A2 Method for manufacturing soi substrate and method for manufacturing semiconductor device
09/30/2009EP2105956A1 Silicon wafer evaluation method
09/30/2009EP2105955A1 Method for preparing P-doped ZnO or ZnMgO
09/30/2009EP2105954A1 Wafer for backside illumination type solid imaging device, production method thereof and backside illumination solid imaging device
09/30/2009EP2105953A1 Amorphous carbon film, semiconductor device, film forming method, film forming apparatus and storage medium
09/30/2009EP2105952A2 Deep reactive ion etching
09/30/2009EP2105951A1 Semiconductor layer manufacturing method, semiconductor layer manufacturing apparatus and semiconductor device manufactured by using such method and apparatus
09/30/2009EP2105950A1 Thin film etching method
09/30/2009EP2105949A1 Composition for formation of antireflection film and pattern formation method using the same
09/30/2009EP2105255A1 Wafer and method of producing the same
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