Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
10/2009
10/01/2009US20090246917 Linked chip attach and underfill
10/01/2009US20090246916 Chip Package with Pin Stabilization Layer
10/01/2009US20090246915 Adhesive Composition, Adhesive Sheet and Production Method of Semiconductor Device
10/01/2009US20090246914 Semiconductor package and method of manufacturing the same
10/01/2009US20090246913 acrylic polymer, epoxy resin, thermosetting resin, and as silicone a polysiloxane having aromatic side chain to improve compatibility with the epoxy resin and/or phenolic resin thermosetting agent, so it does not ooze out or cause outgas; stably connect a wire without contaminating a wire pad part
10/01/2009US20090246912 Method of producing semiconductor packages
10/01/2009US20090246911 Substrate for mounting electronic components and its method of manufacture
10/01/2009US20090246910 Semiconductor device manufacturing method
10/01/2009US20090246909 Semiconductor device and method of manufacturing the same
10/01/2009US20090246908 Roll-to-roll processing method and tools for electroless deposition of thin layers
10/01/2009US20090246907 Higher Selectivity, Method for passivating short circuit current paths in semiconductor devices
10/01/2009US20090246904 Method for manufacturing a photovoltaic module
10/01/2009US20090246903 Manufacturing method for semiconductor device
10/01/2009US20090246902 Thiophene derivative and organic electroluminescent element
10/01/2009US20090246901 Process of making a microelectronic light-emitting device on semi-conducting nanowire formed on a metallic substrate
10/01/2009US20090246898 Vertically Emitting, Optically Pumped Semiconductor Having and External Resonator on a Separate Substrate
10/01/2009US20090246897 LED chip package structure and method for manufacturing the same
10/01/2009US20090246895 Apparatus and methods for combining light emitters
10/01/2009US20090246894 Fabrication and Test Methods and Systems
10/01/2009US20090246893 Semiconductor integrated circuit manufacturing process evaluation method
10/01/2009US20090246892 Sensor, method, and design structure for a low-k delamination sensor
10/01/2009US20090246891 Mark forming method and method for manufacturing semiconductor device
10/01/2009US20090246890 METHOD FOR MANUFACTURING A TUNNEL JUNCTION MAGNETORESISTIVE SENSOR WITH IMPROVED PERFORMANCE AND HAVING A CoFeB FREE LAYER
10/01/2009US20090246723 Method and heat treatment apparatus for uniformly heating a substrate during a bake process
10/01/2009US20090246655 Electron beam writing apparatus and method
10/01/2009US20090246538 Method of forming a porous insulation film
10/01/2009US20090246460 Structure And Method For Forming Crystalline Material On An Amorphous Structure
10/01/2009US20090246112 Hydride fuel and explosive
10/01/2009US20090245995 Game skid
10/01/2009US20090245983 Clam shell two-pin wafer holder for metal plating
10/01/2009US20090245982 Unit for opening insert for test tray and method of mounting semiconductor device using the same
10/01/2009US20090245981 Closed container, lid opening and closing system for closed container, wafer transfer system, and lid closing method for closed container
10/01/2009US20090245980 Stage device
10/01/2009US20090245979 Carrier Supporting Apparatus
10/01/2009US20090245978 Apparatus and method for opening/closing lid of closed container, gas replacement apparatus using same, and load port apparatus
10/01/2009US20090245761 Light-emitting heat treatment apparatus
10/01/2009US20090245735 Photonic power devices and methods of manufacturing the same
10/01/2009US20090245543 Amplifying element and manufacturing method thereof
10/01/2009US20090245311 Process for producing nitride semiconductor laser, and nitride semiconductor laser
10/01/2009US20090245310 Nitride-based semiconductor laser device and method of manufacturing the same
10/01/2009US20090245307 Laser forming apparatus and method for manufacturing head suspension with the apparatus
10/01/2009US20090245009 256 Meg dynamic random access memory
10/01/2009US20090244954 Structure and method for improving storage latch susceptibility to single event upsets
10/01/2009US20090244928 Dual gate lateral diffused mos transistor
10/01/2009US20090244874 Microelectronic package containing silicon patches for high density interconnects, and method of manufacturing same
10/01/2009US20090244873 Optical package
10/01/2009US20090244867 Methods of fabricating multichip packages and structures formed thereby
10/01/2009US20090244676 Mirror Device and Mirror Device Manufacturing Method
10/01/2009US20090244531 Optical apparatus, photomask inspecting apparatus, and exposure apparatus
10/01/2009US20090244503 Exposure apparatus, device manufacturing method, maintenance method, and exposure method
10/01/2009US20090244423 Contact structure
10/01/2009US20090244418 Liquid Crystal Display and Method for Manufacturing the Same
10/01/2009US20090244347 Image sensor with an improved sensitivity
10/01/2009US20090243985 Contact structure of conductive films and thin film transistor array panel including the same
10/01/2009US20090243696 High voltage semiconductor device having shifters and method of fabricating the same
10/01/2009US20090243658 Semiconductor integrated circuit device and method for manufacturing the same
10/01/2009US20090243645 Manufacturing method of a semiconductor device, a semiconductor wafer, and a test method
10/01/2009US20090243625 Test structure to monitor the release step in a micromachining process
10/01/2009US20090243595 Sensor module with mold encapsulation for applying a bias magnetic field
10/01/2009US20090243123 Increasing Exposure Tool Alignment Signal Strength for a Ferroelectric Capacitor Layer
10/01/2009US20090243122 Alignment mark for opaque layer
10/01/2009US20090243120 Semiconductor element and semiconductor element fabrication method
10/01/2009US20090243118 Semiconductor device and manufacturing method of the same
10/01/2009US20090243116 Reducing patterning variability of trenches in metallization layer stacks with a low-k material by reducing contamination of trench dielectrics
10/01/2009US20090243115 Semiconductor device and method of manufacturing the same
10/01/2009US20090243114 Densely packed metal segments patterned in a semiconductor die
10/01/2009US20090243113 Semiconductor structure
10/01/2009US20090243112 against the diffusing copper from the interconnection body side or the diffusing silicon from the insulating film side
10/01/2009US20090243111 Semiconductor substrate, electrode forming method, and solar cell fabricating method
10/01/2009US20090243109 Metal cap layer of increased electrode potential for copper-based metal regions in semiconductor devices
10/01/2009US20090243108 Control of localized air gap formation in an interconnect stack
10/01/2009US20090243106 Structures and methods to enhance copper metallization
10/01/2009US20090243105 Wire bonding on reactive metal surfaces of a metallization of a semiconductor device by providing a protective layer
10/01/2009US20090243104 Forming thick metal interconnect structures for integrated circuits
10/01/2009US20090243103 Synthesis of zeolite crystals and formation of carbon nanostructures in patterned structures
10/01/2009US20090243101 Method for forming interconnection levels of an integrated circuit
10/01/2009US20090243100 Methods to Form a Three-Dimensionally Curved Pad in a Substrate and Integrated Circuits Incorporating such a Substrate
10/01/2009US20090243098 Underbump metallurgy for enhanced electromigration resistance
10/01/2009US20090243097 Semiconductor device having low dielectric constant film and manufacturing method thereof
10/01/2009US20090243096 Semiconductor device and fabrication method thereof
10/01/2009US20090243095 Substrate, manufacturing method thereof, method for manufacturing semiconductor device
10/01/2009US20090243092 Semiconductor device and manufacturing method of semiconductor device
10/01/2009US20090243090 Mock bump system for flip chip integrated circuits
10/01/2009US20090243089 Module including a rough solder joint
10/01/2009US20090243088 Multiple Layer Metal Integrated Circuits and Method for Fabricating Same
10/01/2009US20090243087 Semiconductor device and method for manufacturing same
10/01/2009US20090243086 Enhanced Thermal Dissipation Ball Grid Array Package
10/01/2009US20090243085 Apparatus and method for attaching a heat dissipating device
10/01/2009US20090243084 Suspension microstructure and a fabrication method for the same
10/01/2009US20090243083 Wafer Integrated with Permanent Carrier and Method Therefor
10/01/2009US20090243082 Integrated circuit package system with planar interconnect
10/01/2009US20090243081 System and method of forming a wafer scale package
10/01/2009US20090243080 Flip Chip Interconnection Structure with Bump on Partial Pad and Method Thereof
10/01/2009US20090243079 Semiconductor device package
10/01/2009US20090243078 Power Device Packages Having Thermal Electric Modules Using Peltier Effect and Methods of Fabricating the Same
10/01/2009US20090243077 Integrated circuit package system with rigid locking lead
10/01/2009US20090243074 Semiconductor through silicon vias of variable size and method of formation
10/01/2009US20090243073 Stacked integrated circuit package system
10/01/2009US20090243072 Stacked integrated circuit package system
10/01/2009US20090243071 Integrated circuit package system with stacking module
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