Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
10/2009
10/01/2009WO2009119103A1 Semiconductor substrate, semiconductor device and semiconductor device manufacturing method
10/01/2009WO2009119102A1 Semiconductor substrate, semiconductor substrate manufacturing method and semiconductor device
10/01/2009WO2009119101A1 Combinatorial type plasma process testing method, and inclined plasma generating device
10/01/2009WO2009119096A1 Joining device and joining method
10/01/2009WO2009119064A1 Method for processing a substrate, method for manufacturing a semiconductor chip, and method for manufacturing a semiconductor chip having a resin adhesive layer
10/01/2009WO2009118999A1 Semiconductor device, multilayer wiring board and method for manufacturing semiconductor device
10/01/2009WO2009118995A1 Semiconductor device and method for manufacturing the same
10/01/2009WO2009118979A1 Nitride semiconductor light-emitting device
10/01/2009WO2009118966A1 Defect inspection device using catadioptric objective lens
10/01/2009WO2009118920A1 Abnormal discharge suppressing device for vacuum apparatus
10/01/2009WO2009118901A1 Method for thin film formation
10/01/2009WO2009118883A1 Exposure head, exposure device, and exposure head manufacturing method
10/01/2009WO2009118850A1 Probe wafer, probe device, and testing system
10/01/2009WO2009118849A1 Probe wafer, probe device, and testing system
10/01/2009WO2009118837A1 Control method and processor of exhaust gas flow rate of processing chamber
10/01/2009WO2009118805A1 Wiring board, semiconductor device, and process for producing semiconductor device
10/01/2009WO2009118790A1 Light-emitting element and method for manufacturing the same
10/01/2009WO2009118783A1 Semiconductor memory, semiconductor memory system using same, and manufacturing method for quantum dot used for semiconductor memory
10/01/2009WO2009118468A2 Connection component provided with inserts comprising compensating blocks
10/01/2009WO2009118374A1 Controlled temperature implantation
10/01/2009WO2009118354A1 Metallic nanocrystal patterning
10/01/2009WO2009118244A1 Method for manufacturing a layer of gallium nitride or gallium and aluminum nitride
10/01/2009WO2009118132A1 Method and device for application of a chip module
10/01/2009WO2009118129A1 Method for wet chemical etching
10/01/2009WO2009117983A1 Method and device for fixing and transporting impact-sensitive sheets in sputter feed systems
10/01/2009WO2009117839A1 Processing chamber
10/01/2009WO2009100015A3 Engineering flat surfaces on materials doped via pulsed laser irradiation
10/01/2009WO2009099812A3 Reducing damage to low-k materials during photoresist stripping
10/01/2009WO2009099660A3 Adjustable gap capacitively coupled rf plasma reactor including lateral bellows and non-contact particle seal
10/01/2009WO2009091264A3 Wafer stack cleaning
10/01/2009WO2009085866A3 Gas transport delay resolution for short etch recipes
10/01/2009WO2009085808A3 Apparatus and method for processing a substrate using inductively coupled plasma technology
10/01/2009WO2009085564A3 Etch with high etch rate resist mask
10/01/2009WO2009082460A3 Enclosure for controlling the enviroment of optical crystals
10/01/2009WO2009079517A3 Methods for isolating portions of a loop of pitch-multiplied material and related structures
10/01/2009WO2009078949A3 Method for using an rc circuit to model trapped charge in an electrostatic chuck
10/01/2009WO2007133346A3 Imprint lithography method and system
10/01/2009US20090247447 Removing agent composition and removing/cleaning method using same
10/01/2009US20090247057 Polishing platen and polishing apparatus
10/01/2009US20090247053 Substrate production apparatus for producing a substrate for a display device
10/01/2009US20090247052 Wafer grinding method and wafer grinding machine
10/01/2009US20090247050 Grinding method for grinding back-surface of semiconductor wafer and grinding apparatus for grinding back-surface of semiconductor wafer used in same
10/01/2009US20090246975 Multiple technology node mask
10/01/2009US20090246974 Method of forming a stressed passivation film using a microwave-assisted oxidation process
10/01/2009US20090246973 Method of forming a stressed passivation film using a non-ionizing electromagnetic radiation-assisted oxidation process
10/01/2009US20090246972 Methods for manufacturing high dielectric constant film
10/01/2009US20090246971 In-situ hybrid deposition of high dielectric constant films using atomic layer deposition and chemical vapor deposition
10/01/2009US20090246970 Fabrication of semiconductor device oxide at lower temperature using pre-dissociated chlorohydrocarbon
10/01/2009US20090246969 Method for texturing silicon wafers for producing solar cells
10/01/2009US20090246968 Substrate treating apparatus and substrate treating method
10/01/2009US20090246967 Semiconductor surface treatment agent
10/01/2009US20090246966 Method of fine patterning semiconductor device
10/01/2009US20090246965 Etching method and manufacturing method of semiconductor device
10/01/2009US20090246964 Etching process for phase-change films
10/01/2009US20090246963 Exposure Apparatus Applying Polarization Illuminator and Exposure Method Using the Same
10/01/2009US20090246962 Substrate processing method
10/01/2009US20090246961 Method for forming pattern of a semiconductor device
10/01/2009US20090246960 Method of fabricating a semiconductor device
10/01/2009US20090246959 Two step optical planarizing layer etch
10/01/2009US20090246958 Method for removing residues from a patterned substrate
10/01/2009US20090246957 Polishing liquid and polishing method
10/01/2009US20090246956 Metal polishing composition and chemical mechanical polishing method
10/01/2009US20090246955 Wafer processing method and wafer processing apparatus
10/01/2009US20090246954 Method of manufacturing semiconductor device
10/01/2009US20090246953 Method for Manufacturing Semiconductor Device
10/01/2009US20090246952 Method of forming a cobalt metal nitride barrier film
10/01/2009US20090246951 Method for patterning a metallization layer by reducing resist strip induced damage of the dielectric material
10/01/2009US20090246950 Laser annealing method for manufacturing semiconductor device
10/01/2009US20090246949 Methods of manufacturing semiconductor devices
10/01/2009US20090246948 Method of Preparing P-Type Doped ZnO or ZnMgO
10/01/2009US20090246947 Method for Manufacturing Semiconductor Device
10/01/2009US20090246946 Method of fabricating a microelectronic structure of a semiconductor on insulator type with different patterns
10/01/2009US20090246945 Method for manufacturing nitride semiconductor substrate
10/01/2009US20090246944 METHOD FOR HETEROEPITAXIAL GROWTH OF HIGH-QUALITY N-FACE GaN, InN, AND AlN AND THEIR ALLOYS BY METAL ORGANIC CHEMICAL VAPOR DEPOSITION
10/01/2009US20090246943 Apparatus for mass-producing silicon-based thin film and method for mass-producing silicon-based thin film
10/01/2009US20090246942 Apparatus for depositing silicon-based thin film and method for depositing silicon-based thin film
10/01/2009US20090246941 Deposition apparatus, deposition system and deposition method
10/01/2009US20090246940 System and method for depositing a material on a substrate
10/01/2009US20090246939 Method for dehydrogenation treatment and method for forming crystalline silicon film
10/01/2009US20090246938 Semiconductor device and method of fabricating the same
10/01/2009US20090246937 Method for manufacturing soi substrate and method for manufacturing semiconductor device
10/01/2009US20090246936 Method for manufacturing soi substrate and method for manufacturing semiconductor device
10/01/2009US20090246935 Method for producing soi substrate
10/01/2009US20090246934 Method for manufacturing soi substrate and method for manufacturing semiconductor device
10/01/2009US20090246933 Method of producing a strained layer
10/01/2009US20090246932 Method of manufacturing semiconductor device
10/01/2009US20090246931 Methods for Forming Roughened Surfaces and Applications thereof
10/01/2009US20090246930 Metal capacitor including lower metal electrode having hemispherical metal grains
10/01/2009US20090246929 Membrane suspended mems structures
10/01/2009US20090246928 Semiconductor device with bipolar transistor and method of fabricating the same
10/01/2009US20090246927 Increasing stress transfer efficiency in a transistor by reducing spacer width during the drain/source implantation sequence
10/01/2009US20090246926 Method for creating tensile strain by applying stress memorization techniques at close proximity to the gate electrode
10/01/2009US20090246925 Nitride read only memory device with buried diffusion spacers and method for making the same
10/01/2009US20090246924 Method of producing field effect transistor
10/01/2009US20090246923 Method of Forming Shielded Gate FET with Self-aligned Features
10/01/2009US20090246922 Method of forming cmos transistor
10/01/2009US20090246921 Semiconductor devices having tensile and/or compressive strain and methods of manufacturing and design structure
10/01/2009US20090246920 Methods for normalizing strain in a semiconductor device
10/01/2009US20090246919 Method for manufacturing pixel structure
10/01/2009US20090246918 Method of manufacturing semiconductor device