Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
10/2009
10/07/2009CN100547789C Integrated gate commutated thyristor and method of manufacturing the same
10/07/2009CN100547788C Embedded memory and manufacturing method thereof
10/07/2009CN100547787C Semiconductor device and method of manufacturing the same
10/07/2009CN100547786C Semiconductor structure and fabrication method thereof
10/07/2009CN100547785C Direct insertion LED and its making method
10/07/2009CN100547783C Integrated circuit test carrier and method for testing manufacture process of the tested carrier
10/07/2009CN100547782C Semiconductor apparatus
10/07/2009CN100547781C Integrated circuit structure with switching welding pad set on active circuit top
10/07/2009CN100547778C Flexible circuit substrate and its forming method and assembly comprising flexible circuit substrate
10/07/2009CN100547772C Wafer-level photoelectric semiconductor assembling structure and its manufacturing method
10/07/2009CN100547768C Method for making non-volatile memory
10/07/2009CN100547767C Method of manufacturing a flash memory device
10/07/2009CN100547766C Embedded DRAM with increased capacitance and method of manufacturing same
10/07/2009CN100547765C Method of forming semiconductor device
10/07/2009CN100547764C Method for fabricating semiconductor device with bulb-shaped recess gate
10/07/2009CN100547763C Method for forming semiconductor device
10/07/2009CN100547762C Method for forming contact hole
10/07/2009CN100547761C Method for fabricating a compound-material and method for choosing a wafer
10/07/2009CN100547760C Method for recycling a wafer comprising a buffer layer, after having separated a thin layer therefrom
10/07/2009CN100547759C Multipurpose clamper for bonding machine worktable
10/07/2009CN100547758C Accurate mechanical bearing and aerostatic bearing associated shafting
10/07/2009CN100547757C Novel wafer locating bias correcting method
10/07/2009CN100547756C Chip supplying unit loading device
10/07/2009CN100547755C Device for measuring the wafer film thickness
10/07/2009CN100547754C A device and method for improving detection precision of oxidated layer thickness
10/07/2009CN100547753C Solid package structure and manufacture method thereof
10/07/2009CN100547752C Adhering apparatus
10/07/2009CN100547751C Manufacturing method of semiconductor element
10/07/2009CN100547750C Method of designing package for semiconductor device, method of manufacturing the same, and layout design tool
10/07/2009CN100547749C Method for manufacturing photoelectric chip packaging structure with control chip
10/07/2009CN100547748C Method for making miniature connector
10/07/2009CN100547747C Forming of local and global wiring for semiconductor product
10/07/2009CN100547746C High-voltage silicon-on-insulator transistors and methods of manufacturing the same
10/07/2009CN100547745C Low temperature direct deposited polycrystalline silicon thin film transistor structure and method for manufacturing the same
10/07/2009CN100547744C Method for dynamically etching sheet metal and forming metal wire
10/07/2009CN100547743C Substrate processing method and substrate processing system
10/07/2009CN100547742C Production method for reducing wafer defect
10/07/2009CN100547741C Semiconductor device, wiring substrate forming method, and substrate processing apparatus
10/07/2009CN100547740C 晶片分割方法 Wafer Segmentation
10/07/2009CN100547739C Method of heating semiconductor wafer
10/07/2009CN100547738C Grid dielectric layer manufacturing method
10/07/2009CN100547737C Heat treatment apparatus
10/07/2009CN100547736C Thin-film transistor, active layer manufacturing method and LCD device
10/07/2009CN100547735C Method for improving thick film GaN quality using uniform nano particle dot array mask
10/07/2009CN100547734C Semiconductor multilayer substrate, semiconductor free-standing substrate, method for manufacturing semiconductor multilayer substrate and semiconductor free-standing substrate, and semiconductor elem
10/07/2009CN100547733C System for displaying image and method for laser annealing for cryogenic polycrystalline silicon
10/07/2009CN100547732C Method for decreasing the etch rate of silicon nitride by carbon addition
10/07/2009CN100547731C Methods for forming arrays of a small, closely spaced features
10/07/2009CN100547730C Exposure equipment and element manufacturing method
10/07/2009CN100547729C Method for fabricating semiconductor device using tungsten as sacrificial hard mask
10/07/2009CN100547728C Extension method of material for low forward voltage drop Schottky diode
10/07/2009CN100547727C Resistor element adjusting method, resistor element and current generating device
10/07/2009CN100547726C Method and apparatus for hydrogenation of thin film silicon on glass
10/07/2009CN100547725C Apparatus and method for treating substrate
10/07/2009CN100547724C Substrate processing apparatus
10/07/2009CN100547723C Micro movable device and method of making the same using wet etching
10/07/2009CN100547722C Methods of forming semiconductor devices of diamond bottom
10/07/2009CN100547721C Deposition technique for producing high quality compound semiconductor materials
10/07/2009CN100547720C Driving mechanism for chip detachment apparatus
10/07/2009CN100547713C Method for manufacturing field transmitting device
10/07/2009CN100547490C Method for calibrating focus part of exposure member of lithography tool
10/07/2009CN100547489C Illuminating optic system for microlithography
10/07/2009CN100547487C Composition for forming antireflection film for lithography
10/07/2009CN100547486C Sensitive resin composition
10/07/2009CN100547485C Photosensitive resin composition
10/07/2009CN100547472C Electro-optical device, method of manufacturing electro-optical device, and electronic apparatus
10/07/2009CN100547404C Probe card clamp mechanism and probe apparatus
10/07/2009CN100547122C Vacancy-dominated, defect-free silicon
10/07/2009CN100546929C Method of manufacturing vitreous silica diffusion reaction furnace tube
10/07/2009CN100546793C Device and method for determining the orientation of a crystallographic plane in relation to a crystal surface
10/07/2009CN100546774C Multi-directional type grab
10/06/2009US7600213 Pattern data verification method, pattern data creation method, exposure mask manufacturing method, semiconductor device manufacturing method, and computer program product
10/06/2009US7600205 Net/wiring selection method, net selection method, wiring selection method, and delay improvement method
10/06/2009US7600140 Logic circuit system and method of changing operating voltage of a programmable logic circuit
10/06/2009US7599667 Wireless communication apparatus and semiconductor device
10/06/2009US7599594 Method of fabricating waveguide using sacrificial spacer layer
10/06/2009US7599545 Method and its apparatus for inspecting defects
10/06/2009US7599193 Tape circuit substrate with reduced size of base film
10/06/2009US7599165 Palladium-containing particles, method and apparatus of manufacturing palladium-containing devices made therefrom
10/06/2009US7599054 Pattern inspection apparatus
10/06/2009US7599053 Pattern defect inspection method, photomask manufacturing method, and display device substrate manufacturing method
10/06/2009US7599042 Coating and developing apparatus, substrate processing method and computer-readable recording medium
10/06/2009US7599037 Thin film transistor array panel for liquid crystal display and method for manufacturing the same
10/06/2009US7599034 Thin film transistor substrate of a horizontal electric field type LCD and fabricating method thereof
10/06/2009US7598796 Semiconductor integrated circuit including charging pump
10/06/2009US7598755 Probe navigation method and device and defect inspection device
10/06/2009US7598730 Semiconductor wafer examination method and semiconductor chip manufacturing method
10/06/2009US7598729 Semiconductor chip flipping assembly and apparatus for bonding semiconductor chip using the same
10/06/2009US7598619 Electronic component and semiconductor device, method of fabricating the same, circuit board mounted with the same, and electronic appliance comprising the circuit board
10/06/2009US7598616 Interconnect structure
10/06/2009US7598613 Flip chip bonding structure
10/06/2009US7598606 Integrated circuit package system with die and package combination
10/06/2009US7598598 Offset etched corner leads for semiconductor package
10/06/2009US7598597 Segmented magnetic shielding elements
10/06/2009US7598596 Methods and apparatus for a dual-metal magnetic shield structure
10/06/2009US7598595 Fabrication of nanoporous antireflection film
10/06/2009US7598594 Wafer-scale microcolumn array using low temperature co-fired ceramic substrate
10/06/2009US7598593 N-type ohmic electrode for n-type group III nitride semiconductor, semiconductor light-emitting device with the electrode, and method for forming n-type ohmic electrode
10/06/2009US7598586 Semiconductor device and production method therefor
10/06/2009US7598577 Magnetic memory device
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