Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
12/2009
12/10/2009US20090305442 Light emitting device and method for fabricating the same
12/10/2009US20090305441 Next generation screen printing system
12/10/2009US20090305440 Method for Treatment of Samples for Auger Electronic Spectrometer (AES) in the Manufacture of Integrated Circuits
12/10/2009US20090305439 Method for correcting mask pattern and method for manufacturing acceleration sensor and angular velocity sensor by using the method for correcting the mask pattern
12/10/2009US20090305438 Trench isolation method of semiconductor device using chemical mechanical polishing process
12/10/2009US20090305437 Fabrication of inorganic materials using templates with labile linkage
12/10/2009US20090305172 Lithography simulation method, computer program product, and pattern forming method
12/10/2009US20090305153 Substrate processing method and mask manufacturing method
12/10/2009US20090305149 Dummy light-exposed substrate, method of manufacturing the same, immersion exposure apparatus, and device manufacturing method
12/10/2009US20090305148 Pattern data creating method, photomask fabricating method, and method of manufacturing semiconductor device
12/10/2009US20090305021 Film thickness measurement method, epitaxial wafer production process and epitaxial wafer
12/10/2009US20090304994 Epitaxially coated silicon wafer with 110 orientation and method for producing it
12/10/2009US20090304975 Epitaxial silicon wafer and method for producing the same
12/10/2009US20090304490 Method for holding silicon wafer
12/10/2009US20090304326 Etched-facet semiconductor optical component with integrated end-coupled waveguide and methods of fabrication and use thereof
12/10/2009US20090304261 Defect inspection apparatus, defect inspection method, and manufacture method for semiconductor device
12/10/2009US20090304034 Electrically Pumped Broadly Tunable Mid-Infrared Lasers based on Quantum Confined Transition Metal Doped Semiconductors
12/10/2009US20090303797 Semiconductor device and method of manufacturing the same
12/10/2009US20090303794 Structure and Method of A Field-Enhanced Charge Trapping-DRAM
12/10/2009US20090303787 Nonvolatile memories with tunnel dielectric with chlorine
12/10/2009US20090303780 Integrated circuit including an array of diodes coupled to a layer of resistance changing material
12/10/2009US20090303769 Rom array with shared bit-lines
12/10/2009US20090303639 Magnetoresistance device
12/10/2009US20090303638 Magnetoresistance device
12/10/2009US20090303475 Multi-wavelength light source for spectroscopy
12/10/2009US20090303359 Solid-state imaging device, manufacturing method thereof, and electronic device
12/10/2009US20090303224 Liquid crystal display device with a timing controller and manufacturing the same
12/10/2009US20090303214 Display control substrate, manufacturing method thereof, liquid crystal display panel, electronic information device
12/10/2009US20090302729 Flat Lighting Devices and Method of Contacting Flat Lighting Devices
12/10/2009US20090302486 Semiconductor substrate and manufacturing method thereof
12/10/2009US20090302484 Packaged microelectronic devices and methods for manufacturing packaged microelectronic devices
12/10/2009US20090302482 Structure and Method for Forming Hybrid Substrate
12/10/2009US20090302480 Through Substrate Via Semiconductor Components
12/10/2009US20090302479 Semiconductor structures having vias
12/10/2009US20090302478 Semiconductor device and method of forming recessed conductive vias in saw streets
12/10/2009US20090302477 Integrated circuit with embedded contacts
12/10/2009US20090302476 Structures and Methods to Enhance CU Interconnect Electromigration (EM) Performance
12/10/2009US20090302475 Semiconductor device and manufacturing method thereof
12/10/2009US20090302474 Atomic laminates for diffucion barrier applications
12/10/2009US20090302473 Semiconductor device and manufacturing method thereof
12/10/2009US20090302471 Semiconductor device and manufacturing method therefor
12/10/2009US20090302469 Semiconductor device and method for manufacturing thereof
12/10/2009US20090302468 Printed circuit board comprising semiconductor chip and method of manufacturing the same
12/10/2009US20090302466 Semiconductor device and method for manufacturing the same
12/10/2009US20090302465 Die rearrangement package structure and method thereof
12/10/2009US20090302463 Semiconductor device having substrate with differentially plated copper and selective solder
12/10/2009US20090302460 Self-assembled monolayer release films
12/10/2009US20090302457 Wiring substrate, manufacturing method thereof, semiconductor device, and manufacturing method thereof
12/10/2009US20090302456 Method for manufacturing semiconductor device
12/10/2009US20090302455 Semiconductor device and method for manufacturing the same
12/10/2009US20090302454 Technology for fabrication of packaging interface substrate wafers with fully metallized vias through the substrate wafer
12/10/2009US20090302453 Contact pads for silicon chip packages
12/10/2009US20090302450 Semiconductor device and method of manufacturing semiconductor device
12/10/2009US20090302449 Packaged products, including stacked package modules, and methods of forming same
12/10/2009US20090302448 Chip Stacked Structure and the Forming Method
12/10/2009US20090302447 Semiconductor arrangement having specially fashioned bond wires and method for fabricating such an arrangement
12/10/2009US20090302445 Method and Apparatus for Thermally Enhanced Semiconductor Package
12/10/2009US20090302444 Resin sealed semiconductor device and manufacturing method therefor
12/10/2009US20090302442 Integrated circuit packaging system with isolated pads and method of manufacture thereof
12/10/2009US20090302439 Semiconductor Device Having Electrical Devices Mounted to IPD Structure and Method of Shielding Electromagnetic Interference
12/10/2009US20090302437 Semiconductor Device and Method of Connecting a Shielding Layer to Ground Through Conductive Vias
12/10/2009US20090302436 Semiconductor Device and Method of Forming Shielding Layer Grounded Through Metal Pillars Formed in Peripheral Region of the Semiconductor
12/10/2009US20090302435 Semiconductor Device and Method of Shielding Semiconductor Die from Inter-Device Interference
12/10/2009US20090302434 Preparation of Lanthanide-Containing Precursors and Deposition of Lanthanide-Containing Films
12/10/2009US20090302433 Method for modifying high-k dielectric thin film and semiconductor device
12/10/2009US20090302432 Silicon epitaxial wafer and the production method thereof
12/10/2009US20090302431 Method of accessing semiconductor circuits from the backside using ion-beam and gas-etch
12/10/2009US20090302430 Semiconductor device and method of manufacturing the same
12/10/2009US20090302429 Electrically Conducting Connection with Insulating Connection Medium
12/10/2009US20090302428 Laser beam machining method and semiconductor chip
12/10/2009US20090302427 Semiconductor Chip with Reinforcement Structure
12/10/2009US20090302426 Method for the Selective Deposition of Germanium Nanofilm on a Silicon Substrate and Semiconductor Devices Made Therefrom
12/10/2009US20090302425 Carbon ribbon to be covered with a thin layer made of semiconductor material and method for depositing a layer of this type
12/10/2009US20090302424 Method of forming a bi-directional diode and structure therefor
12/10/2009US20090302422 Capacitor-cell, integrated circuit, and designing and manufacturing methods
12/10/2009US20090302421 Method and apparatus for creating a deep trench capacitor to improve device performance
12/10/2009US20090302419 Method of modifying surface area and electronic device
12/10/2009US20090302417 Structure and method to form dual silicide e-fuse
12/10/2009US20090302416 Programmable Electrical Fuse
12/10/2009US20090302415 Micro-Electromechanical System Devices
12/10/2009US20090302414 Trench isolation for reduced cross talk
12/10/2009US20090302413 Semiconductor device and sti forming method therefor
12/10/2009US20090302412 Carrier mobility enhanced channel devices and method of manufacture
12/10/2009US20090302409 Image sensor with multiple thickness anti-relfective coating layers
12/10/2009US20090302406 Delamination and crack resistant image sensor structures and methods
12/10/2009US20090302405 Method for forming slot via bitline for mram devices
12/10/2009US20090302404 Semiconductor device and manufacturing method therefor
12/10/2009US20090302402 Mugfet with stub source and drain regions
12/10/2009US20090302401 Pfet enhancement during smt
12/10/2009US20090302398 Methods of forming replacement metal gate structures with recessed channel
12/10/2009US20090302394 Cmos integrated circuits with bonded layers containing functional electronic devices
12/10/2009US20090302391 Stress liner for stress engineering
12/10/2009US20090302390 Method of manufacturing semiconductor device with different metallic gates
12/10/2009US20090302389 Method of manufacturing semiconductor device with different metallic gates
12/10/2009US20090302386 Soi transistor having a carrier recombination structure in a body
12/10/2009US20090302385 High performance ldmos device having enhanced dielectric strain layer
12/10/2009US20090302384 Semiconductor device and method for producing semiconductor device
12/10/2009US20090302383 High-Voltage Transistor and Component Containing the Latter
12/10/2009US20090302382 Power Ic Device and Method of Manufacturing Same
12/10/2009US20090302381 Structure and Method for Forming Power Devices with Carbon-containing Region